SG11202004744TA - Ptfe sheet and method for mounting die - Google Patents

Ptfe sheet and method for mounting die

Info

Publication number
SG11202004744TA
SG11202004744TA SG11202004744TA SG11202004744TA SG11202004744TA SG 11202004744T A SG11202004744T A SG 11202004744TA SG 11202004744T A SG11202004744T A SG 11202004744TA SG 11202004744T A SG11202004744T A SG 11202004744TA SG 11202004744T A SG11202004744T A SG 11202004744TA
Authority
SG
Singapore
Prior art keywords
ptfe sheet
mounting die
die
mounting
ptfe
Prior art date
Application number
SG11202004744TA
Other languages
English (en)
Inventor
Osamu Watanabe
Tomonori Nakamura
Yoshihito Hagiwara
Yuji Kanai
Original Assignee
Shinkawa Kk
Valqua Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk, Valqua Ltd filed Critical Shinkawa Kk
Publication of SG11202004744TA publication Critical patent/SG11202004744TA/en

Links

Classifications

    • D—TEXTILES; PAPER
    • D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
    • D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
    • D01F6/00—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof
    • D01F6/02—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from homopolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • D01F6/08—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from homopolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds from polymers of halogenated hydrocarbons
    • D01F6/12—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from homopolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds from polymers of halogenated hydrocarbons from polymers of fluorinated hydrocarbons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Textile Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202004744TA 2017-11-30 2018-11-28 Ptfe sheet and method for mounting die SG11202004744TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017230376 2017-11-30
PCT/JP2018/043802 WO2019107419A1 (ja) 2017-11-30 2018-11-28 ダイの実装に用いられる這い上がり防止用のｐｔｆｅシート及びダイの実装方法

Publications (1)

Publication Number Publication Date
SG11202004744TA true SG11202004744TA (en) 2020-06-29

Family

ID=66664496

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202004744TA SG11202004744TA (en) 2017-11-30 2018-11-28 Ptfe sheet and method for mounting die

Country Status (7)

Country Link
US (1) US11512411B2 (ko)
JP (1) JP6842567B2 (ko)
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JPWO2019107419A1 (ja) 2020-11-19
WO2019107419A1 (ja) 2019-06-06
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JP6842567B2 (ja) 2021-03-17
TWI687463B (zh) 2020-03-11
CN111712906B (zh) 2023-11-03
US20200291548A1 (en) 2020-09-17
KR20200066359A (ko) 2020-06-09
TW201925289A (zh) 2019-07-01
KR102363090B1 (ko) 2022-02-15

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