SG11202004068XA - Cost-effective lead-free solder alloy for electronic applications - Google Patents
Cost-effective lead-free solder alloy for electronic applicationsInfo
- Publication number
- SG11202004068XA SG11202004068XA SG11202004068XA SG11202004068XA SG11202004068XA SG 11202004068X A SG11202004068X A SG 11202004068XA SG 11202004068X A SG11202004068X A SG 11202004068XA SG 11202004068X A SG11202004068X A SG 11202004068XA SG 11202004068X A SG11202004068X A SG 11202004068XA
- Authority
- SG
- Singapore
- Prior art keywords
- cost
- free solder
- solder alloy
- electronic applications
- effective lead
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762583271P | 2017-11-08 | 2017-11-08 | |
US16/022,330 US11123823B2 (en) | 2017-11-08 | 2018-06-28 | Cost-effective lead-free solder alloy for electronic applications |
PCT/US2018/058457 WO2019094241A2 (en) | 2017-11-08 | 2018-10-31 | Cost-effective lead-free solder alloy for electronic applications |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202004068XA true SG11202004068XA (en) | 2020-05-28 |
Family
ID=66326664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202004068XA SG11202004068XA (en) | 2017-11-08 | 2018-10-31 | Cost-effective lead-free solder alloy for electronic applications |
Country Status (9)
Country | Link |
---|---|
US (3) | US11123823B2 (zh) |
EP (1) | EP3706949B1 (zh) |
JP (1) | JP7273049B2 (zh) |
KR (1) | KR102667729B1 (zh) |
CN (2) | CN111511494B (zh) |
HU (1) | HUE065268T2 (zh) |
SG (1) | SG11202004068XA (zh) |
TW (1) | TWI821211B (zh) |
WO (1) | WO2019094241A2 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4017088B2 (ja) * | 1997-08-07 | 2007-12-05 | ハリマ化成株式会社 | ソルダペースト |
US20040241039A1 (en) * | 2000-10-27 | 2004-12-02 | H-Technologies Group | High temperature lead-free solder compositions |
JP2003001482A (ja) * | 2001-06-19 | 2003-01-08 | Tokyo Daiichi Shoko:Kk | 無鉛半田合金 |
US20030021718A1 (en) * | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
US8216395B2 (en) * | 2001-06-28 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
JP3768849B2 (ja) * | 2001-08-27 | 2006-04-19 | 白光株式会社 | 半田ごて用の半田 |
JP4817095B2 (ja) * | 2005-10-03 | 2011-11-16 | 上村工業株式会社 | ウィスカ抑制表面処理方法 |
CN100439028C (zh) | 2007-01-24 | 2008-12-03 | 太仓市南仓金属材料有限公司 | 一种无铅软钎锡焊料 |
CN101801588B (zh) * | 2007-07-13 | 2015-03-25 | 千住金属工业株式会社 | 车载安装用无铅焊料以及车载电路 |
US8220692B2 (en) | 2008-04-23 | 2012-07-17 | Senju Metal Industry Co., Ltd. | Lead-free solder |
US8013444B2 (en) | 2008-12-24 | 2011-09-06 | Intel Corporation | Solder joints with enhanced electromigration resistance |
JP2011251310A (ja) * | 2010-06-02 | 2011-12-15 | Nippon Genma:Kk | 鉛フリーはんだ合金 |
JP4787384B1 (ja) * | 2010-10-29 | 2011-10-05 | ハリマ化成株式会社 | 低銀はんだ合金およびはんだペースト組成物 |
WO2012127642A1 (ja) * | 2011-03-23 | 2012-09-27 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
TWI460046B (zh) * | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
RU2695791C2 (ru) * | 2014-04-30 | 2019-07-26 | Нихон Супериор Ко., Лтд. | Бессвинцовый припой |
JP6504401B2 (ja) * | 2015-11-05 | 2019-04-24 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
JP6119911B1 (ja) | 2016-09-13 | 2017-04-26 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
US20200140975A1 (en) * | 2017-03-23 | 2020-05-07 | Nihon Superior Co., Ltd. | Soldered Joint |
JP6369620B1 (ja) * | 2017-12-31 | 2018-08-08 | 千住金属工業株式会社 | はんだ合金 |
-
2018
- 2018-06-28 US US16/022,330 patent/US11123823B2/en active Active
- 2018-10-31 CN CN201880072316.8A patent/CN111511494B/zh active Active
- 2018-10-31 EP EP18804200.6A patent/EP3706949B1/en active Active
- 2018-10-31 CN CN202210902779.0A patent/CN115178910B/zh active Active
- 2018-10-31 SG SG11202004068XA patent/SG11202004068XA/en unknown
- 2018-10-31 KR KR1020207014921A patent/KR102667729B1/ko active IP Right Grant
- 2018-10-31 HU HUE18804200A patent/HUE065268T2/hu unknown
- 2018-10-31 WO PCT/US2018/058457 patent/WO2019094241A2/en unknown
- 2018-10-31 JP JP2020544347A patent/JP7273049B2/ja active Active
- 2018-11-08 TW TW107139613A patent/TWI821211B/zh active
-
2021
- 2021-08-31 US US17/462,064 patent/US11724342B2/en active Active
-
2023
- 2023-06-30 US US18/217,156 patent/US20230356333A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20230356333A1 (en) | 2023-11-09 |
JP2021502258A (ja) | 2021-01-28 |
CN111511494B (zh) | 2022-08-16 |
CN111511494A (zh) | 2020-08-07 |
CN115178910B (zh) | 2024-04-16 |
WO2019094241A2 (en) | 2019-05-16 |
EP3706949B1 (en) | 2023-11-29 |
US20220080535A1 (en) | 2022-03-17 |
EP3706949A2 (en) | 2020-09-16 |
WO2019094241A3 (en) | 2019-07-18 |
TW201934768A (zh) | 2019-09-01 |
US20190134757A1 (en) | 2019-05-09 |
TWI821211B (zh) | 2023-11-11 |
KR102667729B1 (ko) | 2024-05-20 |
HUE065268T2 (hu) | 2024-05-28 |
CN115178910A (zh) | 2022-10-14 |
KR20200089269A (ko) | 2020-07-24 |
JP7273049B2 (ja) | 2023-05-12 |
US11724342B2 (en) | 2023-08-15 |
US11123823B2 (en) | 2021-09-21 |
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