SG11202004010WA - Substrate storage container - Google Patents
Substrate storage containerInfo
- Publication number
- SG11202004010WA SG11202004010WA SG11202004010WA SG11202004010WA SG11202004010WA SG 11202004010W A SG11202004010W A SG 11202004010WA SG 11202004010W A SG11202004010W A SG 11202004010WA SG 11202004010W A SG11202004010W A SG 11202004010WA SG 11202004010W A SG11202004010W A SG 11202004010WA
- Authority
- SG
- Singapore
- Prior art keywords
- storage container
- substrate storage
- substrate
- container
- storage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017221126A JP6992240B2 (ja) | 2017-11-16 | 2017-11-16 | 基板収納容器 |
PCT/JP2018/036714 WO2019097862A1 (ja) | 2017-11-16 | 2018-10-01 | 基板収納容器 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202004010WA true SG11202004010WA (en) | 2020-05-28 |
Family
ID=66538667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202004010WA SG11202004010WA (en) | 2017-11-16 | 2018-10-01 | Substrate storage container |
Country Status (8)
Country | Link |
---|---|
US (1) | US11735449B2 (zh) |
JP (1) | JP6992240B2 (zh) |
KR (1) | KR102635149B1 (zh) |
CN (1) | CN111213228A (zh) |
DE (1) | DE112018005884T5 (zh) |
SG (1) | SG11202004010WA (zh) |
TW (1) | TWI783076B (zh) |
WO (1) | WO2019097862A1 (zh) |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6267245B1 (en) * | 1998-07-10 | 2001-07-31 | Fluoroware, Inc. | Cushioned wafer container |
FR2785270B1 (fr) * | 1998-10-30 | 2001-01-19 | St Microelectronics Sa | Cassette de transport de plaquettes de semiconducteur |
EP1548820B1 (en) * | 2002-09-11 | 2010-12-15 | Shin-Etsu Polymer Co., Ltd. | Substrate-storing container |
JP4175939B2 (ja) | 2003-04-01 | 2008-11-05 | 信越ポリマー株式会社 | 精密基板収納容器 |
JP4584023B2 (ja) * | 2005-05-17 | 2010-11-17 | 信越ポリマー株式会社 | 基板収納容器及びその製造方法 |
US20070295638A1 (en) * | 2006-06-21 | 2007-12-27 | Vantec Co., Ltd. | Wafer transportable container |
JP4920387B2 (ja) * | 2006-12-01 | 2012-04-18 | 信越半導体株式会社 | 基板収納容器 |
WO2009060782A1 (ja) * | 2007-11-09 | 2009-05-14 | Shin-Etsu Polymer Co., Ltd. | リテーナ及び基板収納容器 |
JP2011060994A (ja) * | 2009-09-10 | 2011-03-24 | Shin Etsu Polymer Co Ltd | 基板収納容器及び基板の取り扱い方法 |
KR20110046038A (ko) * | 2009-10-28 | 2011-05-04 | 박종익 | 기판 수납 용기 |
JP2011108715A (ja) | 2009-11-13 | 2011-06-02 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP4919123B2 (ja) | 2010-03-08 | 2012-04-18 | Tdk株式会社 | 処理基板収納ポッド及び処理基板収納ポッドの蓋開閉システム |
KR101165611B1 (ko) * | 2010-04-20 | 2012-07-16 | 미라이얼 가부시키가이샤 | 기판수납용기 |
WO2011148450A1 (ja) * | 2010-05-24 | 2011-12-01 | ミライアル株式会社 | 基板収納容器 |
JP2011253960A (ja) * | 2010-06-02 | 2011-12-15 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
KR101411367B1 (ko) | 2012-01-17 | 2014-06-27 | 비아이 이엠티 주식회사 | 웨이퍼 카세트용 쿠션 |
US9768045B2 (en) | 2012-11-20 | 2017-09-19 | Miraial Co., Ltd. | Substrate storing container |
KR20140092548A (ko) * | 2013-01-16 | 2014-07-24 | 삼성전자주식회사 | 웨이퍼 보관 장치 |
KR20170048429A (ko) | 2014-08-28 | 2017-05-08 | 엔테그리스, 아이엔씨. | 기판 컨테이너 |
JP6430649B2 (ja) * | 2014-12-18 | 2018-11-28 | インテグリス・インコーポレーテッド | 衝撃状態保護具を有するウエハ収納容器 |
CN107431036B (zh) * | 2015-04-10 | 2021-09-28 | 信越聚合物株式会社 | 基板收纳容器 |
WO2017006406A1 (ja) * | 2015-07-03 | 2017-01-12 | ミライアル株式会社 | 基板収納容器 |
-
2017
- 2017-11-16 JP JP2017221126A patent/JP6992240B2/ja active Active
-
2018
- 2018-10-01 SG SG11202004010WA patent/SG11202004010WA/en unknown
- 2018-10-01 US US16/763,990 patent/US11735449B2/en active Active
- 2018-10-01 WO PCT/JP2018/036714 patent/WO2019097862A1/ja active Application Filing
- 2018-10-01 CN CN201880066595.7A patent/CN111213228A/zh active Pending
- 2018-10-01 DE DE112018005884.0T patent/DE112018005884T5/de not_active Withdrawn
- 2018-10-01 KR KR1020207016760A patent/KR102635149B1/ko active IP Right Grant
- 2018-11-02 TW TW107138946A patent/TWI783076B/zh active
Also Published As
Publication number | Publication date |
---|---|
US11735449B2 (en) | 2023-08-22 |
JP6992240B2 (ja) | 2022-01-13 |
TWI783076B (zh) | 2022-11-11 |
WO2019097862A1 (ja) | 2019-05-23 |
CN111213228A (zh) | 2020-05-29 |
KR20200085328A (ko) | 2020-07-14 |
JP2019091856A (ja) | 2019-06-13 |
DE112018005884T5 (de) | 2020-07-23 |
KR102635149B1 (ko) | 2024-02-13 |
TW201923946A (zh) | 2019-06-16 |
US20200286761A1 (en) | 2020-09-10 |
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