SG11202003761XA - Device and method for linearly moving movable body relative to object - Google Patents
Device and method for linearly moving movable body relative to objectInfo
- Publication number
- SG11202003761XA SG11202003761XA SG11202003761XA SG11202003761XA SG11202003761XA SG 11202003761X A SG11202003761X A SG 11202003761XA SG 11202003761X A SG11202003761X A SG 11202003761XA SG 11202003761X A SG11202003761X A SG 11202003761XA SG 11202003761X A SG11202003761X A SG 11202003761XA
- Authority
- SG
- Singapore
- Prior art keywords
- movable body
- body relative
- linearly moving
- moving movable
- linearly
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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- H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/85132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017162928 | 2017-08-28 | ||
PCT/JP2018/031744 WO2019044819A1 (ja) | 2017-08-28 | 2018-08-28 | 対象物に対して移動体を直線移動させる装置および方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202003761XA true SG11202003761XA (en) | 2020-05-28 |
Family
ID=65525589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202003761XA SG11202003761XA (en) | 2017-08-28 | 2018-08-28 | Device and method for linearly moving movable body relative to object |
Country Status (7)
Country | Link |
---|---|
US (1) | US11410866B2 (ko) |
JP (1) | JP7072264B2 (ko) |
KR (1) | KR102374227B1 (ko) |
CN (1) | CN111213226B (ko) |
SG (1) | SG11202003761XA (ko) |
TW (1) | TWI686881B (ko) |
WO (1) | WO2019044819A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11202003712WA (en) * | 2017-08-28 | 2020-05-28 | Shinkawa Kk | Device and method for linearly moving first and second moving bodies relative to target object |
KR102489221B1 (ko) * | 2020-12-21 | 2023-01-17 | 세메스 주식회사 | 위치 측정기 및 이를 포함하는 기판 처리 장치 |
WO2023062371A1 (en) * | 2021-10-14 | 2023-04-20 | Oivi As | System and method for automatic calibration and alignment of fundus camera device |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61232874A (ja) * | 1985-04-04 | 1986-10-17 | 株式会社 遠藤製作所 | ゴルフクラブヘツドのサンドプラスト刻印方法 |
JPS62173147A (ja) * | 1986-01-24 | 1987-07-30 | Disco Abrasive Sys Ltd | 温度変化に起因する誤差が低減された精密装置 |
JPS62173151A (ja) * | 1986-01-22 | 1987-07-30 | Hitachi Ltd | リニヤスケ−ルの測定値補正装置 |
JP2930093B2 (ja) * | 1995-08-18 | 1999-08-03 | 澁谷工業株式会社 | ボンディング方法 |
JP3416091B2 (ja) | 2000-01-21 | 2003-06-16 | 株式会社新川 | ボンディング装置およびボンディング方法 |
KR100326757B1 (en) * | 2001-08-09 | 2002-03-13 | Justek Corp | Method for correcting error of scaler according to variation of temperature in linear motor |
JP2004167641A (ja) * | 2002-11-20 | 2004-06-17 | Ngk Spark Plug Co Ltd | 搬送方法と搬送装置と、この搬送装置を用いた工作機械 |
CN100377326C (zh) * | 2002-12-02 | 2008-03-26 | 松下电器产业株式会社 | 零件供给头装置、零件供给装置、零件安装装置、以及安装头部的移动方法 |
JP4408682B2 (ja) * | 2003-10-31 | 2010-02-03 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP4270019B2 (ja) * | 2004-04-23 | 2009-05-27 | パナソニック株式会社 | 電子部品実装用装置の直動機構 |
KR20070016098A (ko) * | 2004-06-03 | 2007-02-07 | 마츠시타 덴끼 산교 가부시키가이샤 | 부품 실장 방법 및 장치 |
JP4128156B2 (ja) * | 2004-06-03 | 2008-07-30 | 松下電器産業株式会社 | 部品実装方法及び装置 |
JP2006041260A (ja) * | 2004-07-28 | 2006-02-09 | Juki Corp | 電子部品搭載装置のノズル位置補正方法 |
TW200641564A (en) * | 2005-02-24 | 2006-12-01 | Fuji Photo Film Co Ltd | The correction method of plotting device |
JP2006268032A (ja) * | 2005-02-24 | 2006-10-05 | Fuji Photo Film Co Ltd | 描画装置および描画装置の校正方法 |
JP2007108037A (ja) * | 2005-10-14 | 2007-04-26 | Omron Corp | 位置測定方法、距離測定方法及び位置測定装置 |
JP5385794B2 (ja) * | 2008-01-30 | 2014-01-08 | 東レエンジニアリング株式会社 | チップ搭載方法およびチップ搭載装置 |
JP5877645B2 (ja) * | 2011-02-15 | 2016-03-08 | 東レエンジニアリング株式会社 | 実装方法および実装装置 |
JP2013195778A (ja) * | 2012-03-21 | 2013-09-30 | Hitachi High-Technologies Corp | 露光装置、露光方法、及び表示用パネル基板の製造方法 |
JP6055301B2 (ja) * | 2012-12-19 | 2016-12-27 | ヤマハ発動機株式会社 | 表面実装機 |
KR101614425B1 (ko) * | 2014-03-04 | 2016-04-22 | 에이피시스템 주식회사 | 기판 처리 장치 및 헤드블럭의 좌표 보정 방법 |
DE102014205523A1 (de) * | 2014-03-25 | 2015-10-01 | Etel S.A. | Positioniereinrichtung in Portalbauweise |
TWI545663B (zh) | 2014-05-07 | 2016-08-11 | 新川股份有限公司 | 接合裝置以及接合方法 |
JP6040382B2 (ja) * | 2014-12-16 | 2016-12-07 | 株式会社新川 | 実装装置 |
JP6446282B2 (ja) * | 2015-01-29 | 2018-12-26 | Juki株式会社 | 部品実装装置、及び部品実装方法 |
JP6792219B2 (ja) * | 2015-08-10 | 2020-11-25 | 地方独立行政法人東京都立産業技術研究センター | 温度補正方法、温度補正プログラム、温度補正装置、及び座標測定機 |
KR102633248B1 (ko) * | 2015-09-30 | 2024-02-02 | 가부시키가이샤 니콘 | 노광 장치 및 노광 방법, 그리고 플랫 패널 디스플레이 제조 방법 |
TWI632626B (zh) * | 2016-01-06 | 2018-08-11 | 日商新川股份有限公司 | Electronic parts processing unit |
KR102059421B1 (ko) * | 2016-01-06 | 2019-12-26 | 야마하 모터 로보틱스 홀딩스 가부시키가이샤 | 전자 부품 실장 장치 |
JP6585529B2 (ja) * | 2016-03-16 | 2019-10-02 | ヤマハ発動機株式会社 | 部品搭載方法および部品実装装置 |
SG11202003712WA (en) * | 2017-08-28 | 2020-05-28 | Shinkawa Kk | Device and method for linearly moving first and second moving bodies relative to target object |
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2018
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- 2018-08-28 KR KR1020207008769A patent/KR102374227B1/ko active IP Right Grant
- 2018-08-28 CN CN201880066606.1A patent/CN111213226B/zh active Active
- 2018-08-28 TW TW107129994A patent/TWI686881B/zh active
- 2018-08-28 SG SG11202003761XA patent/SG11202003761XA/en unknown
- 2018-08-28 US US16/650,372 patent/US11410866B2/en active Active
- 2018-08-28 WO PCT/JP2018/031744 patent/WO2019044819A1/ja active Application Filing
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US20200411352A1 (en) | 2020-12-31 |
KR102374227B1 (ko) | 2022-03-15 |
US11410866B2 (en) | 2022-08-09 |
TW201923919A (zh) | 2019-06-16 |
JP7072264B2 (ja) | 2022-05-20 |
CN111213226A (zh) | 2020-05-29 |
WO2019044819A1 (ja) | 2019-03-07 |
KR20200040878A (ko) | 2020-04-20 |
TWI686881B (zh) | 2020-03-01 |
CN111213226B (zh) | 2023-07-07 |
JPWO2019044819A1 (ja) | 2020-07-09 |
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