SG11202000023QA - Flux and solder material - Google Patents

Flux and solder material

Info

Publication number
SG11202000023QA
SG11202000023QA SG11202000023QA SG11202000023QA SG11202000023QA SG 11202000023Q A SG11202000023Q A SG 11202000023QA SG 11202000023Q A SG11202000023Q A SG 11202000023QA SG 11202000023Q A SG11202000023Q A SG 11202000023QA SG 11202000023Q A SG11202000023Q A SG 11202000023QA
Authority
SG
Singapore
Prior art keywords
flux
solder material
solder
Prior art date
Application number
SG11202000023QA
Other languages
English (en)
Inventor
Noriyoshi Uchida
Original Assignee
Koki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=64949951&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11202000023Q(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Koki Kk filed Critical Koki Kk
Publication of SG11202000023QA publication Critical patent/SG11202000023QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SG11202000023QA 2017-07-03 2018-06-22 Flux and solder material SG11202000023QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017130727A JP6528102B2 (ja) 2017-07-03 2017-07-03 フラックス及びはんだ材料
PCT/JP2018/023757 WO2019009097A1 (ja) 2017-07-03 2018-06-22 フラックス及びはんだ材料

Publications (1)

Publication Number Publication Date
SG11202000023QA true SG11202000023QA (en) 2020-02-27

Family

ID=64949951

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202000023QA SG11202000023QA (en) 2017-07-03 2018-06-22 Flux and solder material

Country Status (10)

Country Link
US (1) US10864606B2 (zh)
EP (1) EP3650164B1 (zh)
JP (1) JP6528102B2 (zh)
KR (1) KR102184056B1 (zh)
CN (1) CN109429491B (zh)
CA (1) CA3068816C (zh)
PL (1) PL3650164T3 (zh)
SG (1) SG11202000023QA (zh)
TW (1) TWI708759B (zh)
WO (1) WO2019009097A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6528102B2 (ja) * 2017-07-03 2019-06-12 株式会社弘輝 フラックス及びはんだ材料
EP3741498B1 (en) * 2018-01-16 2023-08-02 Senju Metal Industry Co., Ltd Flux and solder paste
JP7130564B2 (ja) * 2019-01-15 2022-09-05 千住金属工業株式会社 フラックス及びソルダペースト
JP6544498B1 (ja) * 2019-01-15 2019-07-17 千住金属工業株式会社 フラックス及びソルダペースト
JP7063630B2 (ja) * 2018-01-16 2022-05-09 千住金属工業株式会社 フラックス及びソルダペースト
JP6734553B1 (ja) * 2019-03-29 2020-08-05 千住金属工業株式会社 ソルダペースト
TWI753469B (zh) * 2019-06-27 2022-01-21 日商弘輝股份有限公司 助焊劑及焊膏
JP2021087998A (ja) * 2021-02-24 2021-06-10 千住金属工業株式会社 フラックス及びソルダペースト

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2646394B2 (ja) * 1989-06-15 1997-08-27 千住金属工業株式会社 水溶性はんだ付け用フラックス
JP3155778B2 (ja) 1991-08-09 2001-04-16 山栄化学株式会社 クリームはんだ
JP2002146159A (ja) * 2000-11-08 2002-05-22 Sumitomo Bakelite Co Ltd 硬化性フラックス及びそれを用いた半田接合部
TW574739B (en) * 2001-02-14 2004-02-01 Nitto Denko Corp Thermosetting resin composition and semiconductor device using the same
JP4181797B2 (ja) * 2002-06-14 2008-11-19 四国化成工業株式会社 イソシアヌル酸環を有する新規なエステル化合物および該化合物を用いたエポキシ樹脂組成物
US9185812B2 (en) * 2005-05-25 2015-11-10 Senju Metal Industry Co., Ltd. Lead-free solder paste
JP2007070481A (ja) * 2005-09-07 2007-03-22 Toyobo Co Ltd 接着剤組成物およびこれを用いてなるフレキシブルプリント配線基板
JP4887850B2 (ja) * 2006-03-16 2012-02-29 住友ベークライト株式会社 アンダーフィル用液状樹脂組成物、並びにそれを用いた半導体装置の製造方法及び半導体装置
HUE031302T2 (en) * 2011-03-02 2017-06-28 Senju Metal Industry Co flux
JP2012241178A (ja) * 2011-05-24 2012-12-10 Panasonic Corp 半導体封止用エポキシ樹脂組成物および半導体装置
JP6405920B2 (ja) 2014-11-12 2018-10-17 千住金属工業株式会社 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
KR20180044224A (ko) * 2015-08-24 2018-05-02 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
CN105364243B (zh) * 2015-11-26 2018-02-27 芜湖雅葆轩电子科技股份有限公司 信号处理基板
JP6528102B2 (ja) * 2017-07-03 2019-06-12 株式会社弘輝 フラックス及びはんだ材料

Also Published As

Publication number Publication date
JP6528102B2 (ja) 2019-06-12
CN109429491A (zh) 2019-03-05
CA3068816C (en) 2020-11-10
PL3650164T3 (pl) 2023-01-09
JP2019013926A (ja) 2019-01-31
KR102184056B1 (ko) 2020-11-27
TWI708759B (zh) 2020-11-01
EP3650164B1 (en) 2022-11-02
WO2019009097A1 (ja) 2019-01-10
CA3068816A1 (en) 2019-01-10
CN109429491B (zh) 2021-07-27
TW201906812A (zh) 2019-02-16
US20200269362A1 (en) 2020-08-27
KR20190015467A (ko) 2019-02-13
EP3650164A1 (en) 2020-05-13
EP3650164A4 (en) 2021-01-27
US10864606B2 (en) 2020-12-15

Similar Documents

Publication Publication Date Title
SG11202000023QA (en) Flux and solder material
PL3597356T3 (pl) Stop lutowniczy
PH12018502559A1 (en) Flux and resin composition for flux
EP3369522A4 (en) FLUX AND SOLDERING COMPOSITION
EP3683005A4 (en) SOLDERING FLUX AND PULP
HUE058789T2 (hu) Forrasztó berendezés
EP3495090A4 (en) FLUX OF BRAZING PASTE AND BRAZING PASTE
PL3603879T3 (pl) Kompozycja topnika i kompozycja pasty lutowniczej
EP3307034A4 (en) LÖTVORRICHTUNG AND FLUIDS APPLICATION DEVICE
GB201410093D0 (en) Solder flux
IL292488B1 (en) Pyridineamine-pyridone and pyrimidineamine-pyridone compounds
EP3653332A4 (en) BRAZING FLOW AND BRAZING PASTE
PT3281739T (pt) Dispositivo de revestimento de fluxo e solda
EP3124167A4 (en) Flux and solder paste
PL3254800T3 (pl) Środek aktywujący topnik, topnik i lutowie
EP3492217A4 (en) SOLDER MATERIAL
PL3476516T3 (pl) Urządzenie lutownicze
LT3804902T (lt) Litavimo pastos fliusas ir litavimo pasta
IL275211A (en) Fast and flexible segment chains - division
EP3778110A4 (en) Flux and solder material
GB201700404D0 (en) Compounds and composistions
HUE055378T2 (hu) Folyasztószer
EP3608050A4 (en) SOLDER MATERIAL
IL292482B2 (en) Azaindolylpyridone and diazaindolylpyridone compounds
PL3473373T3 (pl) Kompozycja lutownicza