SG11201909269UA - Positive type photosensitive siloxane composition and cured film formed by using the same - Google Patents

Positive type photosensitive siloxane composition and cured film formed by using the same

Info

Publication number
SG11201909269UA
SG11201909269UA SG11201909269UA SG11201909269UA SG 11201909269U A SG11201909269U A SG 11201909269UA SG 11201909269U A SG11201909269U A SG 11201909269UA SG 11201909269U A SG11201909269U A SG 11201909269UA
Authority
SG
Singapore
Prior art keywords
international
type photosensitive
cured film
positive type
chihama
Prior art date
Application number
Other languages
English (en)
Inventor
Naofumi Yoshida
Megumi Takahashi
Katsuto Taniguchi
Original Assignee
Merck Patent Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent Gmbh filed Critical Merck Patent Gmbh
Publication of SG11201909269UA publication Critical patent/SG11201909269UA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
SG11201909269U 2017-04-28 2018-04-25 Positive type photosensitive siloxane composition and cured film formed by using the same SG11201909269UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017090388A JP2018189738A (ja) 2017-04-28 2017-04-28 ポジ型感光性シロキサン組成物、およびそれを用いて形成した硬化膜
PCT/EP2018/060520 WO2018197524A1 (en) 2017-04-28 2018-04-25 Positive type photosensitive siloxane composition and cured film formed by using the same

Publications (1)

Publication Number Publication Date
SG11201909269UA true SG11201909269UA (en) 2019-11-28

Family

ID=62116839

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201909269U SG11201909269UA (en) 2017-04-28 2018-04-25 Positive type photosensitive siloxane composition and cured film formed by using the same

Country Status (7)

Country Link
US (1) US11860537B2 (ja)
JP (2) JP2018189738A (ja)
KR (1) KR102626975B1 (ja)
CN (1) CN110546566B (ja)
SG (1) SG11201909269UA (ja)
TW (1) TWI749218B (ja)
WO (1) WO2018197524A1 (ja)

Family Cites Families (27)

* Cited by examiner, † Cited by third party
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US3695886A (en) 1970-09-29 1972-10-03 Ibm High speed azide resists
JP2004210922A (ja) * 2002-12-27 2004-07-29 Jsr Corp ポリシロキサンとその製造方法および感放射線性樹脂組成物
TWI360722B (en) * 2003-08-21 2012-03-21 Nissan Chemical Ind Ltd Dye-containing resist composition and color filter
US7585613B2 (en) 2006-01-25 2009-09-08 Shin-Etsu Chemical Co., Ltd. Antireflection film composition, substrate, and patterning process
WO2008065944A1 (fr) * 2006-11-30 2008-06-05 Toray Industries, Inc. Composition de siloxane photosensible, film durci formé à partir de celle-ci et dispositif ayant le film durci
JP5233526B2 (ja) 2008-09-05 2013-07-10 東レ株式会社 感光性組成物、それから形成された硬化膜、および硬化膜を有する素子
JP5533232B2 (ja) * 2009-06-29 2014-06-25 Jsr株式会社 ポジ型感放射線性組成物、硬化膜、層間絶縁膜、層間絶縁膜の形成方法、表示素子、及び層間絶縁膜形成用のシロキサンポリマー
KR101799260B1 (ko) * 2010-08-24 2017-11-20 메르크 파텐트 게엠베하 포지티브형 감광성 실록산 조성물
JP5867006B2 (ja) * 2011-11-22 2016-02-24 Jsr株式会社 ポジ型感放射線性組成物、表示素子用硬化膜、表示素子用硬化膜の形成方法及び表示素子
KR101992594B1 (ko) * 2011-11-29 2019-06-25 메르크 파텐트 게엠베하 네거티브형 감광성 실록산 조성물
JP2013114238A (ja) 2011-12-01 2013-06-10 Toray Ind Inc ポジ型感光性組成物、そのポジ型感光性組成物から形成された硬化膜、およびその硬化膜を有する素子。
CN103988127B (zh) * 2011-12-09 2019-04-19 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法、半导体装置及显示体装置
US9704724B2 (en) 2011-12-26 2017-07-11 Toray Industries, Inc. Photosensitive resin composition and method for producing semiconductor device
JP6013150B2 (ja) * 2012-11-22 2016-10-25 メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 ポジ型感光性シロキサン組成物の製造方法
JP6137862B2 (ja) * 2013-02-20 2017-05-31 アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ ネガ型感光性シロキサン組成物
US20150293449A1 (en) 2013-08-13 2015-10-15 Chi Mei Corporation Photosensitive polysiloxane composition and uses thereof
TWI518460B (zh) * 2013-08-13 2016-01-21 Chi Mei Corp Photosensitive polysiloxane compositions and their use
TWI541595B (zh) * 2014-09-25 2016-07-11 Chi Mei Corp Photosensitive polysiloxane compositions and their use
JP6480691B2 (ja) * 2013-10-21 2019-03-13 アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ ケイ素含有熱または光硬化性組成物
US10025182B2 (en) * 2014-03-20 2018-07-17 Zeon Corporation Radiation-sensitive resin composition and electronic device
TWI524150B (zh) * 2014-06-27 2016-03-01 奇美實業股份有限公司 感光性樹脂組成物、保護膜及具有保護膜之元件
KR102456965B1 (ko) * 2015-03-04 2022-10-21 도레이 카부시키가이샤 감광성 수지 조성물, 수지 경화막의 제조 방법 및 반도체 장치
JP2017151209A (ja) 2016-02-23 2017-08-31 アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ ポジ型感光性シロキサン組成物
JP2017173741A (ja) * 2016-03-25 2017-09-28 アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ 感光性シロキサン組成物
CN115185157A (zh) * 2016-03-31 2022-10-14 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法和半导体装置
US10591818B2 (en) * 2016-07-28 2020-03-17 Promerus, Llc Nadic anhydride polymers and photosensitive compositions derived therefrom
WO2018034460A1 (en) 2016-08-19 2018-02-22 Rohm And Haas Electronic Materials Korea Ltd. Photosensitive resin composition and cured film prepared therefrom

Also Published As

Publication number Publication date
KR102626975B1 (ko) 2024-01-22
JP2020517984A (ja) 2020-06-18
TWI749218B (zh) 2021-12-11
CN110546566A (zh) 2019-12-06
WO2018197524A1 (en) 2018-11-01
US20210116811A1 (en) 2021-04-22
JP2018189738A (ja) 2018-11-29
KR20190137929A (ko) 2019-12-11
TW201842067A (zh) 2018-12-01
US11860537B2 (en) 2024-01-02
CN110546566B (zh) 2024-02-09
JP7296886B2 (ja) 2023-06-23

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