SG11201909269UA - Positive type photosensitive siloxane composition and cured film formed by using the same - Google Patents

Positive type photosensitive siloxane composition and cured film formed by using the same

Info

Publication number
SG11201909269UA
SG11201909269UA SG11201909269UA SG11201909269UA SG 11201909269U A SG11201909269U A SG 11201909269UA SG 11201909269U A SG11201909269U A SG 11201909269UA SG 11201909269U A SG11201909269U A SG 11201909269UA
Authority
SG
Singapore
Prior art keywords
international
type photosensitive
cured film
positive type
chihama
Prior art date
Application number
Inventor
Naofumi Yoshida
Megumi Takahashi
Katsuto Taniguchi
Original Assignee
Merck Patent Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent Gmbh filed Critical Merck Patent Gmbh
Publication of SG11201909269UA publication Critical patent/SG11201909269UA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 01 November 2018 (01.11.2018) WIPO I PCT omit IIl °nolo Oil mo mil oimIE (10) International Publication Number WO 2018/197524 Al (51) International Patent Classification: G03F 7/004 (2006.01) GO3F 7/023 (2006.01) G03F 7/022 (2006.01) G03F 7/075 (2006.01) (21) International Application Number: PCT/EP2018/060520 (22) International Filing Date: 25 April 2018 (25.04.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 2017-090388 28 April 2017 (28.04.2017) JP (71) Applicant: MERCK PATENT GMBH [DE/DE]; Frank- furter Strasse 250, 64293 Darmstadt (DE). (72) Inventors: YOSHIDA, Naofumi; c/o Merck Performance Materials Ltd., 3330, Chihama, Kakegawa-shi, Shizuo- ka, 437-1412 (JP). TAKAHASHI, Megumi; c/o Merck Performance Materials Ltd., 3330, Chihama, Kakegawa- shi, Shizuoka, 437-1412 (JP). TANIGUCHI, Katsuto; c/o Merck Performance Materials Ltd., 3330, Chihama, Kakegawa-shi, SHIZUOKA, 437-1412 (JP). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) 71' (54) Title: POSITIVE TYPE PHOTOSENSITIVE SILOXANE COMPOSITION AND CURED FILM FORMED BY USING THE 1-1 SAME (57) : [] To provide a positive type photosensitive composition capable of forming a cured film having high transparency 0 [Means] The present invention provides apositive type photosensitive siloxane composition comprising: a polysiloxane, a diazonaph- thoquinone derivative, an additive having a >N-C(=O)-or >N-C(=S)- structure and the capability of interacting with the polysiloxane, 0 and a solvent. The polysiloxane and the additive interact with each other before exposure, but they lose the interaction after exposure.
SG11201909269U 2017-04-28 2018-04-25 Positive type photosensitive siloxane composition and cured film formed by using the same SG11201909269UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017090388A JP2018189738A (en) 2017-04-28 2017-04-28 Positive type photosensitive siloxane composition and cured film formed by using the same
PCT/EP2018/060520 WO2018197524A1 (en) 2017-04-28 2018-04-25 Positive type photosensitive siloxane composition and cured film formed by using the same

Publications (1)

Publication Number Publication Date
SG11201909269UA true SG11201909269UA (en) 2019-11-28

Family

ID=62116839

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201909269U SG11201909269UA (en) 2017-04-28 2018-04-25 Positive type photosensitive siloxane composition and cured film formed by using the same

Country Status (7)

Country Link
US (1) US11860537B2 (en)
JP (2) JP2018189738A (en)
KR (1) KR102626975B1 (en)
CN (1) CN110546566B (en)
SG (1) SG11201909269UA (en)
TW (1) TWI749218B (en)
WO (1) WO2018197524A1 (en)

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TWI360722B (en) * 2003-08-21 2012-03-21 Nissan Chemical Ind Ltd Dye-containing resist composition and color filter
US7585613B2 (en) 2006-01-25 2009-09-08 Shin-Etsu Chemical Co., Ltd. Antireflection film composition, substrate, and patterning process
WO2008065944A1 (en) * 2006-11-30 2008-06-05 Toray Industries, Inc. Photosensitive siloxane composition, hardened film formed therefrom and device having the hardened film
JP5233526B2 (en) 2008-09-05 2013-07-10 東レ株式会社 Photosensitive composition, cured film formed therefrom, and device having cured film
JP5533232B2 (en) * 2009-06-29 2014-06-25 Ｊｓｒ株式会社 Positive radiation sensitive composition, cured film, interlayer insulating film, method for forming interlayer insulating film, display element, and siloxane polymer for forming interlayer insulating film
KR101799260B1 (en) * 2010-08-24 2017-11-20 메르크 파텐트 게엠베하 Positive photosensitive siloxane composition
JP5867006B2 (en) * 2011-11-22 2016-02-24 Jsr株式会社 Positive radiation sensitive composition, cured film for display element, method for forming cured film for display element, and display element
KR101992594B1 (en) * 2011-11-29 2019-06-25 메르크 파텐트 게엠베하 Negative-type photosensitive siloxane composition
JP2013114238A (en) 2011-12-01 2013-06-10 Toray Ind Inc Positive photosensitive composition, cured film formed of the positive photosensitive composition and element having the cured film
CN103988127B (en) * 2011-12-09 2019-04-19 旭化成株式会社 Photosensitive polymer combination, the manufacturing method of cured relief pattern, semiconductor device and display body device
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JP6013150B2 (en) * 2012-11-22 2016-10-25 メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 Method for producing positive photosensitive siloxane composition
JP6137862B2 (en) * 2013-02-20 2017-05-31 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ Negative photosensitive siloxane composition
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TWI518460B (en) * 2013-08-13 2016-01-21 Chi Mei Corp Photosensitive polysiloxane compositions and their use
TWI541595B (en) * 2014-09-25 2016-07-11 Chi Mei Corp Photosensitive polysiloxane compositions and their use
JP6480691B2 (en) * 2013-10-21 2019-03-13 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ Silicon-containing heat or light curable composition
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JP2017151209A (en) 2016-02-23 2017-08-31 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ Positive photosensitive siloxane composition
JP2017173741A (en) * 2016-03-25 2017-09-28 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ Photosensitive siloxane composition
CN115185157A (en) * 2016-03-31 2022-10-14 旭化成株式会社 Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device
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Also Published As

Publication number Publication date
KR102626975B1 (en) 2024-01-22
JP2020517984A (en) 2020-06-18
TWI749218B (en) 2021-12-11
CN110546566A (en) 2019-12-06
WO2018197524A1 (en) 2018-11-01
US20210116811A1 (en) 2021-04-22
JP2018189738A (en) 2018-11-29
KR20190137929A (en) 2019-12-11
TW201842067A (en) 2018-12-01
US11860537B2 (en) 2024-01-02
CN110546566B (en) 2024-02-09
JP7296886B2 (en) 2023-06-23

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