SG11201907121WA - Probe card for high-frequency applications - Google Patents

Probe card for high-frequency applications

Info

Publication number
SG11201907121WA
SG11201907121WA SG11201907121WA SG11201907121WA SG11201907121WA SG 11201907121W A SG11201907121W A SG 11201907121WA SG 11201907121W A SG11201907121W A SG 11201907121WA SG 11201907121W A SG11201907121W A SG 11201907121WA SG 11201907121W A SG11201907121W A SG 11201907121WA
Authority
SG
Singapore
Prior art keywords
international
probe card
flexible membrane
end portion
support plate
Prior art date
Application number
SG11201907121WA
Other languages
English (en)
Inventor
Stefano Felici
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of SG11201907121WA publication Critical patent/SG11201907121WA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Medicinal Preparation (AREA)
  • Reinforced Plastic Materials (AREA)
  • Tests Of Electronic Circuits (AREA)
SG11201907121WA 2017-02-15 2018-02-14 Probe card for high-frequency applications SG11201907121WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102017000017037A IT201700017037A1 (it) 2017-02-15 2017-02-15 Scheda di misura per applicazioni ad alta frequenza
PCT/EP2018/053615 WO2018149847A1 (en) 2017-02-15 2018-02-14 Probe card for high-frequency applications

Publications (1)

Publication Number Publication Date
SG11201907121WA true SG11201907121WA (en) 2019-09-27

Family

ID=59579801

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201907121WA SG11201907121WA (en) 2017-02-15 2018-02-14 Probe card for high-frequency applications

Country Status (11)

Country Link
US (1) US11112431B2 (cg-RX-API-DMAC10.html)
EP (1) EP3583431A1 (cg-RX-API-DMAC10.html)
JP (2) JP7306993B2 (cg-RX-API-DMAC10.html)
KR (1) KR102522524B1 (cg-RX-API-DMAC10.html)
CN (1) CN110291407B (cg-RX-API-DMAC10.html)
IT (1) IT201700017037A1 (cg-RX-API-DMAC10.html)
MY (1) MY195983A (cg-RX-API-DMAC10.html)
PH (1) PH12019501889A1 (cg-RX-API-DMAC10.html)
SG (1) SG11201907121WA (cg-RX-API-DMAC10.html)
TW (1) TWI703329B (cg-RX-API-DMAC10.html)
WO (1) WO2018149847A1 (cg-RX-API-DMAC10.html)

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* Cited by examiner, † Cited by third party
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IT201700017037A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura per applicazioni ad alta frequenza
CN108241078B (zh) * 2017-05-18 2020-06-02 苏州韬盛电子科技有限公司 垂直探针卡
KR102066678B1 (ko) * 2019-10-30 2020-01-15 김재길 범프필름 타입 프로브카드
IT201900024964A1 (it) * 2019-12-20 2021-06-20 Technoprobe Spa Testa di misura per applicazioni a ridotto pitch
CN113433360B (zh) * 2020-03-23 2023-12-01 奥特斯(中国)有限公司 测试适配器、测试设备和测试部件承载件的方法
KR102307942B1 (ko) * 2020-07-13 2021-10-01 양진석 반도체 소자 검사 장치
CN112305395B (zh) * 2020-11-06 2021-05-28 法特迪精密科技（苏州）有限公司 一种探针结构及其安装方法、闭路方法、抗干扰方法
TWI784439B (zh) * 2021-03-12 2022-11-21 冠銓科技實業股份有限公司 應用於高頻量測之測試針座構造
JP7766290B2 (ja) * 2021-03-26 2025-11-10 石福金属興業株式会社 プローブピン用合金材料
KR20230160837A (ko) 2021-03-26 2023-11-24 가부시키가이샤 요코오 프로브
US11714105B2 (en) * 2021-03-30 2023-08-01 Enplas Corporation Socket and inspection socket
KR102309675B1 (ko) * 2021-07-30 2021-10-07 김재길 필름 형태의 프로브카드
JP7795316B2 (ja) * 2021-09-27 2026-01-07 株式会社ヨコオ コンタクトユニット及び検査治具
KR102450658B1 (ko) * 2022-09-01 2022-10-06 윌테크놀러지(주) 니들유닛의 팁 길이조절이 용이한 니들블럭
KR102847367B1 (ko) * 2022-10-20 2025-08-18 주식회사 에이엠에스티 프로브 카드 제작 방법
IT202400003139A1 (it) * 2024-02-14 2025-08-14 Technoprobe Spa Scheda di misura per applicazioni ad elevata frequenza
KR102913907B1 (ko) * 2024-06-10 2026-01-19 (주)위드멤스 피검사체의 전기적 특성을 프로빙하는 프로브 카드 어셈블리

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IT201700017037A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura per applicazioni ad alta frequenza

Also Published As

Publication number Publication date
JP2020507771A (ja) 2020-03-12
EP3583431A1 (en) 2019-12-25
CN110291407B (zh) 2022-06-07
KR102522524B1 (ko) 2023-04-14
US11112431B2 (en) 2021-09-07
TW201831909A (zh) 2018-09-01
JP7306993B2 (ja) 2023-07-11
KR20190112155A (ko) 2019-10-02
CN110291407A (zh) 2019-09-27
WO2018149847A1 (en) 2018-08-23
JP2023085418A (ja) 2023-06-20
MY195983A (en) 2023-02-27
IT201700017037A1 (it) 2018-08-15
TWI703329B (zh) 2020-09-01
PH12019501889A1 (en) 2020-07-06
US20190361050A1 (en) 2019-11-28

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