SG11201903430PA - Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint - Google Patents

Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint

Info

Publication number
SG11201903430PA
SG11201903430PA SG11201903430PA SG11201903430PA SG11201903430PA SG 11201903430P A SG11201903430P A SG 11201903430PA SG 11201903430P A SG11201903430P A SG 11201903430PA SG 11201903430P A SG11201903430P A SG 11201903430PA SG 11201903430P A SG11201903430P A SG 11201903430PA
Authority
SG
Singapore
Prior art keywords
solder
pipes
bonding
alloy
preform
Prior art date
Application number
SG11201903430PA
Other languages
English (en)
Inventor
Naoto Kameda
Osamu Munekata
Kaichi Tsuruta
Isamu Sato
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of SG11201903430PA publication Critical patent/SG11201903430PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes, wires
    • B23K35/0266—Rods, electrodes, wires flux-cored
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/06—Tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B23K2103/22—Ferrous alloys and copper or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Non-Disconnectible Joints And Screw-Threaded Joints (AREA)
  • Die Bonding (AREA)
  • Nonmetallic Welding Materials (AREA)
SG11201903430PA 2017-09-20 2018-06-07 Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint SG11201903430PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017180660A JP6292342B1 (ja) 2017-09-20 2017-09-20 Ｃｕ管及び／又はＦｅ管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手
PCT/JP2018/021812 WO2019058650A1 (ja) 2017-09-20 2018-06-07 Ｃｕ管及び／又はＦｅ管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手

Publications (1)

Publication Number Publication Date
SG11201903430PA true SG11201903430PA (en) 2019-05-30

Family

ID=61628653

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201903430PA SG11201903430PA (en) 2017-09-20 2018-06-07 Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint

Country Status (9)

Country Link
US (1) US20190358751A1 (zh)
EP (1) EP3513900A4 (zh)
JP (1) JP6292342B1 (zh)
CN (1) CN109963684B (zh)
BR (1) BR112019008146A2 (zh)
MX (1) MX2019004644A (zh)
PH (1) PH12019500835A1 (zh)
SG (1) SG11201903430PA (zh)
WO (1) WO2019058650A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4411792A1 (en) * 2021-09-30 2024-08-07 Tamura Corporation Bonding material and semiconductor package
EP4212278A4 (en) * 2021-11-30 2023-09-06 Tamura Corporation SOLDER ALLOY, SOLDER JOINT, SOLDER PASTE, AND SEMICONDUCTOR PACKAGE
JP7133739B1 (ja) 2021-11-30 2022-09-08 株式会社タムラ製作所 接合部、電子回路基板及び半導体パッケージ
JP7079889B1 (ja) * 2021-11-30 2022-06-02 株式会社タムラ製作所 はんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージ

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
GB2419137A (en) * 2004-10-15 2006-04-19 Alpha Fry Ltd Solder alloy
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
WO2006122240A2 (en) * 2005-05-11 2006-11-16 American Iron & Metal Company, Inc. Tin alloy solder compositions
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
US9339893B2 (en) * 2011-04-15 2016-05-17 Nihon Superior Co., Ltd. Lead-free solder alloy
WO2014002304A1 (ja) * 2012-06-29 2014-01-03 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP6283317B2 (ja) * 2012-11-30 2018-02-21 株式会社日本スペリア社 低融点ろう材
JP6713106B2 (ja) * 2014-02-24 2020-06-24 株式会社弘輝 鉛フリーはんだ合金、はんだ材料及び接合構造体
JP6390700B2 (ja) * 2014-04-02 2018-09-19 千住金属工業株式会社 Ｌｅｄ用はんだ合金およびｌｅｄモジュール
WO2016052124A1 (ja) * 2014-10-01 2016-04-07 株式会社村田製作所 配管接合方法、継手および配管接合構造
CN106001978B (zh) * 2015-03-24 2020-02-07 株式会社田村制作所 无铅软钎料合金、电子电路基板和电子控制装置
JP6047254B1 (ja) * 2016-03-22 2016-12-21 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置

Also Published As

Publication number Publication date
WO2019058650A1 (ja) 2019-03-28
JP6292342B1 (ja) 2018-03-14
JP2019055410A (ja) 2019-04-11
EP3513900A1 (en) 2019-07-24
CN109963684A (zh) 2019-07-02
PH12019500835A1 (en) 2019-07-24
EP3513900A4 (en) 2019-12-18
CN109963684B (zh) 2020-05-08
BR112019008146A2 (pt) 2019-07-02
MX2019004644A (es) 2019-06-17
US20190358751A1 (en) 2019-11-28

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