SG11201903430PA - Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint - Google Patents
Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder jointInfo
- Publication number
- SG11201903430PA SG11201903430PA SG11201903430PA SG11201903430PA SG11201903430PA SG 11201903430P A SG11201903430P A SG 11201903430PA SG 11201903430P A SG11201903430P A SG 11201903430PA SG 11201903430P A SG11201903430P A SG 11201903430PA SG 11201903430P A SG11201903430P A SG 11201903430PA
- Authority
- SG
- Singapore
- Prior art keywords
- solder
- pipes
- bonding
- alloy
- preform
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0266—Rods, electrodes, wires flux-cored
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/06—Tubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/22—Ferrous alloys and copper or alloys thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Non-Disconnectible Joints And Screw-Threaded Joints (AREA)
- Die Bonding (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
(made by International Searching Authority) Provided is a solder alloy that makes it possible to ensure long-term bonding reliability in metal piping by minimizing the growth of an intermetallic compound layer at the bonding interface when performing low-temperature bonding of metal piping. This 5 solder alloy comprises, in mass%, 5.0-15.0% of Sb, 0.5-8.0% of Cu, 0.025-0.7% of Ni, 0.025-0.3% of Co, and a remainder of Sn. The content (in mass%) of Co and Ni in the alloy composition of the solder alloy satisfies 0.07 Co/Ni 6. 24 SOLDER ALLOY FOR BONDING CU PIPES AND/OR FE PIPES, PREFORM SOLDER, RESIN FLUX CORED SOLDER, AND SOLDER JOINT [FIG. 5] ABSTRACT
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017180660A JP6292342B1 (en) | 2017-09-20 | 2017-09-20 | Solder alloy for joining Cu pipe and / or Fe pipe, preform solder, cored solder and solder joint |
PCT/JP2018/021812 WO2019058650A1 (en) | 2017-09-20 | 2018-06-07 | Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201903430PA true SG11201903430PA (en) | 2019-05-30 |
Family
ID=61628653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201903430PA SG11201903430PA (en) | 2017-09-20 | 2018-06-07 | Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint |
Country Status (9)
Country | Link |
---|---|
US (1) | US20190358751A1 (en) |
EP (1) | EP3513900A4 (en) |
JP (1) | JP6292342B1 (en) |
CN (1) | CN109963684B (en) |
BR (1) | BR112019008146A2 (en) |
MX (1) | MX2019004644A (en) |
PH (1) | PH12019500835A1 (en) |
SG (1) | SG11201903430PA (en) |
WO (1) | WO2019058650A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7536882B2 (en) | 2021-09-30 | 2024-08-20 | 株式会社タムラ製作所 | Bonding materials and semiconductor packages |
JP7133739B1 (en) | 2021-11-30 | 2022-09-08 | 株式会社タムラ製作所 | Joints, electronic circuit boards and semiconductor packages |
JP7079889B1 (en) * | 2021-11-30 | 2022-06-02 | 株式会社タムラ製作所 | Solder alloys, solder joints, solder pastes and semiconductor packages |
CN116529020A (en) * | 2021-11-30 | 2023-08-01 | 株式会社田村制作所 | Solder alloy, solder bonding material, solder paste, and semiconductor package |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758407A (en) * | 1987-06-29 | 1988-07-19 | J.W. Harris Company | Pb-free, tin base solder composition |
GB2419137A (en) * | 2004-10-15 | 2006-04-19 | Alpha Fry Ltd | Solder alloy |
GB2421030B (en) * | 2004-12-01 | 2008-03-19 | Alpha Fry Ltd | Solder alloy |
US20060263234A1 (en) * | 2005-05-11 | 2006-11-23 | American Iron & Metal Company, Inc. | Tin alloy solder compositions |
WO2012127642A1 (en) * | 2011-03-23 | 2012-09-27 | 千住金属工業株式会社 | Lead-free solder alloy |
EP2698225B1 (en) * | 2011-04-15 | 2018-07-25 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
WO2014002304A1 (en) * | 2012-06-29 | 2014-01-03 | ハリマ化成株式会社 | Solder alloy, solder paste, and electronic circuit board |
JP6283317B2 (en) * | 2012-11-30 | 2018-02-21 | 株式会社日本スペリア社 | Low melting point brazing material |
US9764430B2 (en) * | 2014-02-24 | 2017-09-19 | Koki Company Limited | Lead-free solder alloy, solder material and joined structure |
US10272527B2 (en) * | 2014-04-02 | 2019-04-30 | Senju Metal Industry Co., Ltd. | Solder alloy, and LED module |
WO2016052124A1 (en) * | 2014-10-01 | 2016-04-07 | 株式会社村田製作所 | Pipe joining method, joint and pipe joining structure |
CN106001978B (en) * | 2015-03-24 | 2020-02-07 | 株式会社田村制作所 | Lead-free solder alloy, electronic circuit board, and electronic control device |
JP6047254B1 (en) * | 2016-03-22 | 2016-12-21 | 株式会社タムラ製作所 | Lead-free solder alloy, electronic circuit board and electronic control device |
-
2017
- 2017-09-20 JP JP2017180660A patent/JP6292342B1/en not_active Expired - Fee Related
-
2018
- 2018-06-07 CN CN201880004018.5A patent/CN109963684B/en not_active Expired - Fee Related
- 2018-06-07 EP EP18857692.0A patent/EP3513900A4/en not_active Withdrawn
- 2018-06-07 SG SG11201903430PA patent/SG11201903430PA/en unknown
- 2018-06-07 BR BR112019008146A patent/BR112019008146A2/en not_active Application Discontinuation
- 2018-06-07 US US16/341,386 patent/US20190358751A1/en not_active Abandoned
- 2018-06-07 WO PCT/JP2018/021812 patent/WO2019058650A1/en unknown
- 2018-06-07 MX MX2019004644A patent/MX2019004644A/en unknown
-
2019
- 2019-04-16 PH PH12019500835A patent/PH12019500835A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3513900A4 (en) | 2019-12-18 |
US20190358751A1 (en) | 2019-11-28 |
EP3513900A1 (en) | 2019-07-24 |
MX2019004644A (en) | 2019-06-17 |
CN109963684A (en) | 2019-07-02 |
PH12019500835A1 (en) | 2019-07-24 |
CN109963684B (en) | 2020-05-08 |
WO2019058650A1 (en) | 2019-03-28 |
JP6292342B1 (en) | 2018-03-14 |
BR112019008146A2 (en) | 2019-07-02 |
JP2019055410A (en) | 2019-04-11 |
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