MX2019004644A - Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint. - Google Patents

Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint.

Info

Publication number
MX2019004644A
MX2019004644A MX2019004644A MX2019004644A MX2019004644A MX 2019004644 A MX2019004644 A MX 2019004644A MX 2019004644 A MX2019004644 A MX 2019004644A MX 2019004644 A MX2019004644 A MX 2019004644A MX 2019004644 A MX2019004644 A MX 2019004644A
Authority
MX
Mexico
Prior art keywords
solder
pipes
bonding
alloy
preform
Prior art date
Application number
MX2019004644A
Other languages
Spanish (es)
Inventor
Kameda Naoto
Munekata Osamu
Tsuruta Kaichi
Sato Isamu
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MX2019004644A publication Critical patent/MX2019004644A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes, wires
    • B23K35/0266—Rods, electrodes, wires flux-cored
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/06—Tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B23K2103/22—Ferrous alloys and copper or alloys thereof

Abstract

Provided is a solder alloy that makes it possible to ensure long-term bonding reliability in metal piping by minimizing the growth of an intermetallic compound layer at the bonding interface when performing low-temperature bonding of metal piping. This solder alloy comprises, in mass%, 5.0-15.0% of Sb, 0.5-8.0% of Cu, 0.025-0.7% of Ni, 0.025-0.3% of Co, and a remainder of Sn. The content (in mass%) of Co and Ni in the alloy composition of the solder alloy satisfies 0.07 = Co/Ni = 6.
MX2019004644A 2017-09-20 2018-06-07 Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint. MX2019004644A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017180660A JP6292342B1 (en) 2017-09-20 2017-09-20 Solder alloy for joining Cu pipe and / or Fe pipe, preform solder, cored solder and solder joint
PCT/JP2018/021812 WO2019058650A1 (en) 2017-09-20 2018-06-07 Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint

Publications (1)

Publication Number Publication Date
MX2019004644A true MX2019004644A (en) 2019-06-17

Family

ID=61628653

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019004644A MX2019004644A (en) 2017-09-20 2018-06-07 Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint.

Country Status (9)

Country Link
US (1) US20190358751A1 (en)
EP (1) EP3513900A4 (en)
JP (1) JP6292342B1 (en)
CN (1) CN109963684B (en)
BR (1) BR112019008146A2 (en)
MX (1) MX2019004644A (en)
PH (1) PH12019500835A1 (en)
SG (1) SG11201903430PA (en)
WO (1) WO2019058650A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023053901A1 (en) * 2021-09-30 2023-04-06
EP4212278A4 (en) * 2021-11-30 2023-09-06 Tamura Corporation Solder alloy, solder joining member, solder paste, and semiconductor package
JP7079889B1 (en) * 2021-11-30 2022-06-02 株式会社タムラ製作所 Solder alloys, solder joints, solder pastes and semiconductor packages
JP7133739B1 (en) * 2021-11-30 2022-09-08 株式会社タムラ製作所 Joints, electronic circuit boards and semiconductor packages

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
GB2419137A (en) * 2004-10-15 2006-04-19 Alpha Fry Ltd Solder alloy
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
CA2607286A1 (en) * 2005-05-11 2006-11-16 American Iron & Metal Company, Inc. Tin alloy solder compositions
WO2012127642A1 (en) * 2011-03-23 2012-09-27 千住金属工業株式会社 Lead-free solder alloy
US9339893B2 (en) * 2011-04-15 2016-05-17 Nihon Superior Co., Ltd. Lead-free solder alloy
WO2014002304A1 (en) * 2012-06-29 2014-01-03 ハリマ化成株式会社 Solder alloy, solder paste, and electronic circuit board
WO2014084242A1 (en) * 2012-11-30 2014-06-05 株式会社日本スペリア社 Low melting point brazing material
JP6713106B2 (en) * 2014-02-24 2020-06-24 株式会社弘輝 Lead-free solder alloy, solder material and joint structure
JP6390700B2 (en) * 2014-04-02 2018-09-19 千住金属工業株式会社 LED solder alloy and LED module
WO2016052124A1 (en) * 2014-10-01 2016-04-07 株式会社村田製作所 Pipe joining method, joint and pipe joining structure
CN106001978B (en) * 2015-03-24 2020-02-07 株式会社田村制作所 Lead-free solder alloy, electronic circuit board, and electronic control device
JP6047254B1 (en) * 2016-03-22 2016-12-21 株式会社タムラ製作所 Lead-free solder alloy, electronic circuit board and electronic control device

Also Published As

Publication number Publication date
BR112019008146A2 (en) 2019-07-02
EP3513900A1 (en) 2019-07-24
CN109963684B (en) 2020-05-08
CN109963684A (en) 2019-07-02
SG11201903430PA (en) 2019-05-30
US20190358751A1 (en) 2019-11-28
PH12019500835A1 (en) 2019-07-24
WO2019058650A1 (en) 2019-03-28
JP2019055410A (en) 2019-04-11
JP6292342B1 (en) 2018-03-14
EP3513900A4 (en) 2019-12-18

Similar Documents

Publication Publication Date Title
PH12019500835A1 (en) Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint
MX2021012411A (en) Lead-free, silver-free solder alloys.
JP2018518368A5 (en)
PH12016502152B1 (en) Lead-free solder alloy
TW200730288A (en) Lead free solder paste and application thereof
MY188098A (en) Solder alloy, solder ball, solder preform, solder paste and solder joint
JP2017209732A5 (en)
PH12015502404B1 (en) Lead-free solder alloy
PH12019501934A1 (en) Solder material, solder paste, formed solder and solder joint
PH12020551402A1 (en) Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint
MX2010002306A (en) Filler metal alloy compositions.
CA3156067A1 (en) Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ecu electronic circuit, in-vehicle electronic circuit device and ecu electronic circuit device
MY158834A (en) Lead-free solder alloy,connecting member and a method for its manufacture,and electronic part
TW200604349A (en) Lead-free solder alloy
MY191908A (en) Lead-free solder alloy and solder joint part
MY165485A (en) High-temperature lead-free solder alloy
MY177221A (en) Solder alloy
MY187963A (en) Flux, solder alloy, joined body, and method for producing joined body
AU2012363597B2 (en) Audio solder alloy
MX2022009912A (en) Lead-free and antimony-free solder alloy, solder ball, and solder joint.
CN104889598A (en) High-strength silver-free copper-based brazing filler metal
MY195069A (en) Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit board
PH12018501146B1 (en) Solder alloy for preventing fe erosion, resin flux cored solder, wire solder, resin flux cored wire solder, flux coated solder, solder joint and soldering method
PH12020550954A1 (en) Solder alloy and solder joint
MX2021015960A (en) Solder alloy, cast article, formed article, and solder joint.