BR112019008146A2 - ligas de solda, solda pré-formada e solda com núcleo de fluxo - Google Patents

ligas de solda, solda pré-formada e solda com núcleo de fluxo

Info

Publication number
BR112019008146A2
BR112019008146A2 BR112019008146A BR112019008146A BR112019008146A2 BR 112019008146 A2 BR112019008146 A2 BR 112019008146A2 BR 112019008146 A BR112019008146 A BR 112019008146A BR 112019008146 A BR112019008146 A BR 112019008146A BR 112019008146 A2 BR112019008146 A2 BR 112019008146A2
Authority
BR
Brazil
Prior art keywords
welding
preformed
alloys
flux core
joint
Prior art date
Application number
BR112019008146A
Other languages
English (en)
Inventor
Sato Isamu
Tsuruta Kaichi
Kameda Naoto
Munekata Osamu
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of BR112019008146A2 publication Critical patent/BR112019008146A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes, wires
    • B23K35/0266—Rods, electrodes, wires flux-cored
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/06—Tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B23K2103/22—Ferrous alloys and copper or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Die Bonding (AREA)
  • Non-Disconnectible Joints And Screw-Threaded Joints (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

a presente invenção refere-se a uma liga de solda, com a qual se pode assegurar uma confiabilidade de junção de longo prazo de um cano metálico por meio da evitação do crescimento de uma camada de composto intermetálico na interface de junção durante uma junção de baixa temperatura desse cano metálico. a solda da presente invenção inclui uma composição de liga que consiste de (em % em massa): sb: 5,0 a 15,0%; cu: 0,5 a 8,0%; ni: 0,025 a 0,7%; co: 0,025 a 0,3%; e equilíbrio com sn.
BR112019008146A 2017-09-20 2018-06-07 ligas de solda, solda pré-formada e solda com núcleo de fluxo BR112019008146A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017180660A JP6292342B1 (ja) 2017-09-20 2017-09-20 Ｃｕ管及び／又はＦｅ管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手
PCT/JP2018/021812 WO2019058650A1 (ja) 2017-09-20 2018-06-07 Ｃｕ管及び／又はＦｅ管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手

Publications (1)

Publication Number Publication Date
BR112019008146A2 true BR112019008146A2 (pt) 2019-07-02

Family

ID=61628653

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112019008146A BR112019008146A2 (pt) 2017-09-20 2018-06-07 ligas de solda, solda pré-formada e solda com núcleo de fluxo

Country Status (9)

Country Link
US (1) US20190358751A1 (pt)
EP (1) EP3513900A4 (pt)
JP (1) JP6292342B1 (pt)
CN (1) CN109963684B (pt)
BR (1) BR112019008146A2 (pt)
MX (1) MX2019004644A (pt)
PH (1) PH12019500835A1 (pt)
SG (1) SG11201903430PA (pt)
WO (1) WO2019058650A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023053901A1 (pt) * 2021-09-30 2023-04-06
CN116529020A (zh) * 2021-11-30 2023-08-01 株式会社田村制作所 软钎料合金、钎焊接合材料、焊膏及半导体封装体
JP7133739B1 (ja) * 2021-11-30 2022-09-08 株式会社タムラ製作所 接合部、電子回路基板及び半導体パッケージ
JP7079889B1 (ja) * 2021-11-30 2022-06-02 株式会社タムラ製作所 はんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージ

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
GB2419137A (en) * 2004-10-15 2006-04-19 Alpha Fry Ltd Solder alloy
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
US20060263234A1 (en) * 2005-05-11 2006-11-23 American Iron & Metal Company, Inc. Tin alloy solder compositions
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
JP5784109B2 (ja) * 2011-04-15 2015-09-24 株式会社日本スペリア社 鉛フリーはんだ合金
WO2014002304A1 (ja) * 2012-06-29 2014-01-03 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP6283317B2 (ja) * 2012-11-30 2018-02-21 株式会社日本スペリア社 低融点ろう材
US9764430B2 (en) * 2014-02-24 2017-09-19 Koki Company Limited Lead-free solder alloy, solder material and joined structure
US10272527B2 (en) * 2014-04-02 2019-04-30 Senju Metal Industry Co., Ltd. Solder alloy, and LED module
WO2016052124A1 (ja) * 2014-10-01 2016-04-07 株式会社村田製作所 配管接合方法、継手および配管接合構造
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
JP6047254B1 (ja) * 2016-03-22 2016-12-21 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置

Also Published As

Publication number Publication date
JP2019055410A (ja) 2019-04-11
EP3513900A4 (en) 2019-12-18
EP3513900A1 (en) 2019-07-24
MX2019004644A (es) 2019-06-17
CN109963684A (zh) 2019-07-02
PH12019500835A1 (en) 2019-07-24
CN109963684B (zh) 2020-05-08
SG11201903430PA (en) 2019-05-30
WO2019058650A1 (ja) 2019-03-28
JP6292342B1 (ja) 2018-03-14
US20190358751A1 (en) 2019-11-28

Similar Documents

Publication Publication Date Title
BR112019008146A2 (pt) ligas de solda, solda pré-formada e solda com núcleo de fluxo
US8603390B2 (en) Copper-phosphorus-strontium brazing alloy
BR112016024855A2 (pt) liga de solda isenta de chumbo
WO2009011392A1 (ja) 車載電子回路用Ｉｎ入り鉛フリーはんだ
TW200730288A (en) Lead free solder paste and application thereof
PH12015502404B1 (en) Lead-free solder alloy
JP2019093428A5 (pt)
MX2016003814A (es) Aleacion de cobre y lamina de aleacion de cobre.
MX2021002203A (es) Aleacion de soldadura y pieza de union de soldadura sin plomo.
MY188098A (en) Solder alloy, solder ball, solder preform, solder paste and solder joint
PH12019501934A1 (en) Solder material, solder paste, formed solder and solder joint
MY194455A (en) Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint
BR102021014263A2 (pt) Liga de solda
CA3156067A1 (en) SOLDERING ALLOY, SOLDERING PASTE, BOSS, SOLDERING PREFORM, BRAZED JOINT, ONBOARD ELECTRONIC CIRCUIT, ELECTRONIC CONTROL UNIT ELECTRONIC CIRCUIT, ONBOARD ELECTRONIC CIRCUIT DEVICE AND ELECTRONIC CONTROL UNIT ELECTRONIC CIRCUIT DEVICE
MY177221A (en) Solder alloy
MY187963A (en) Flux, solder alloy, joined body, and method for producing joined body
BR112015006226A2 (pt) composições resistentes a corrosão para brasagem de titânio e aplicações de revestimento e métodos de aplicação
CN103894754A (zh) 一种含锡低温铜基钎料及其制备方法
PH12020550954A1 (en) Solder alloy and solder joint
MY189490A (en) Solder alloy, solder paste, solder ball, solder preform, and solder joint
TW202421803A (zh) 焊料合金、焊料球及焊料接頭
MX2023014150A (es) Aleacion de soldadura, bola de soldadura y junta de soldadura.
TH2001003190A (th) โลหะผสมบัดกรีและรอยบัดกรี
Kang et al. Properties of low-temperature nanocomposite Sn-58Bi-Ta2O5 solder for mini LED bonding on flexible electronics
UA112120C2 (uk) Флюс для низькотемпературної пайки і лудіння міді, сталей і сплавів з кольорових металів

Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: MANTIDO O INDEFERIMENTO UMA VEZ QUE NAO FOI APRESENTADO RECURSO DENTRO DO PRAZO LEGAL.

B350 Update of information on the portal [chapter 15.35 patent gazette]