SG11201902579QA - Method of detecting particles on panel - Google Patents

Method of detecting particles on panel

Info

Publication number
SG11201902579QA
SG11201902579QA SG11201902579QA SG11201902579QA SG11201902579QA SG 11201902579Q A SG11201902579Q A SG 11201902579QA SG 11201902579Q A SG11201902579Q A SG 11201902579QA SG 11201902579Q A SG11201902579Q A SG 11201902579QA SG 11201902579Q A SG11201902579Q A SG 11201902579QA
Authority
SG
Singapore
Prior art keywords
panel
illumination field
adjusting
detecting particles
detecting
Prior art date
Application number
SG11201902579QA
Other languages
English (en)
Inventor
Xueshan Han
Yongqiang Shen
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11201902579QA publication Critical patent/SG11201902579QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/02—Investigating particle size or size distribution
    • G01N15/0205—Investigating particle size or size distribution by optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/02—Investigating particle size or size distribution
    • G01N15/0205—Investigating particle size or size distribution by optical means
    • G01N15/0227—Investigating particle size or size distribution by optical means using imaging; using holography
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B15/00—Special procedures for taking photographs; Apparatus therefor
    • G03B15/02—Illuminating scene
    • G03B15/03—Combinations of cameras with lighting apparatus; Flash units
    • G03B15/05—Combinations of cameras with electronic flash apparatus; Electronic flash units
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG11201902579QA 2016-09-30 2017-09-26 Method of detecting particles on panel SG11201902579QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610877673.4A CN107884318B (zh) 2016-09-30 2016-09-30 一种平板颗粒度检测方法
PCT/CN2017/103334 WO2018059376A1 (zh) 2016-09-30 2017-09-26 一种平板颗粒度检测方法

Publications (1)

Publication Number Publication Date
SG11201902579QA true SG11201902579QA (en) 2019-05-30

Family

ID=61763132

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201902579QA SG11201902579QA (en) 2016-09-30 2017-09-26 Method of detecting particles on panel

Country Status (8)

Country Link
US (1) US10648926B2 (zh)
EP (1) EP3521805A4 (zh)
JP (1) JP7045369B2 (zh)
KR (1) KR102157044B1 (zh)
CN (1) CN107884318B (zh)
SG (1) SG11201902579QA (zh)
TW (1) TWI658263B (zh)
WO (1) WO2018059376A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN110658196B (zh) * 2018-06-29 2022-07-08 上海微电子装备（集团）股份有限公司 一种缺陷检测装置及缺陷检测方法
CN111351794B (zh) * 2018-12-20 2021-12-10 上海微电子装备（集团）股份有限公司 一种物体表面检测装置及检测方法
US11733605B2 (en) * 2019-06-20 2023-08-22 Kla Corporation EUV in-situ linearity calibration for TDI image sensors using test photomasks
CN112540082A (zh) * 2019-09-20 2021-03-23 深圳中科飞测科技股份有限公司 检测系统及检测方法
CN113406086A (zh) * 2020-03-16 2021-09-17 上海微电子装备（集团）股份有限公司 检测装置及光刻设备

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DE3800053A1 (de) * 1988-01-04 1989-07-13 Sick Optik Elektronik Erwin Optische fehlerinspektionsvorrichtung
JP3300830B2 (ja) * 1995-07-12 2002-07-08 株式会社日立製作所 異物等の欠陥検査方法及びその装置
US5978078A (en) * 1996-12-17 1999-11-02 Texas Instruments Incorporated System and method for detecting particles on substrate-supporting chucks of photolithography equipment
JP2000223541A (ja) * 1999-01-27 2000-08-11 Hitachi Ltd 欠陥検査装置およびその方法
US6760100B2 (en) 2001-03-12 2004-07-06 Ade Corporation Method and apparatus for classifying defects occurring at or near a surface of a smooth substrate
JP4234945B2 (ja) * 2002-05-01 2009-03-04 株式会社トプコン 表面検査方法および表面検査装置
US7027142B2 (en) * 2002-05-06 2006-04-11 Applied Materials, Israel, Ltd. Optical technique for detecting buried defects in opaque films
US7349082B2 (en) * 2004-10-05 2008-03-25 Asml Netherlands B.V. Particle detection device, lithographic apparatus and device manufacturing method
WO2006057125A1 (ja) * 2004-11-24 2006-06-01 Asahi Glass Company, Limited 透明板状体の欠陥検査方法および装置
JP4988223B2 (ja) * 2005-06-22 2012-08-01 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
US7567344B2 (en) * 2006-05-12 2009-07-28 Corning Incorporated Apparatus and method for characterizing defects in a transparent substrate
US7715000B2 (en) * 2006-08-17 2010-05-11 Asml Netherlands B.V. Particle detection system, and lithographic apparatus provided with such particle detection system
CN101021490B (zh) * 2007-03-12 2012-11-14 3i系统公司 平面基板自动检测系统及方法
JP2009014617A (ja) * 2007-07-06 2009-01-22 Olympus Corp 基板外観検査装置
KR100958204B1 (ko) * 2008-08-21 2010-05-14 티에스씨멤시스(주) 평판디스플레이 패널 검사 장비 및 방법
US8624971B2 (en) 2009-01-23 2014-01-07 Kla-Tencor Corporation TDI sensor modules with localized driving and signal processing circuitry for high speed inspection
JP5213765B2 (ja) 2009-03-06 2013-06-19 株式会社日立ハイテクノロジーズ 表面検査装置及び表面検査方法
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KR101177299B1 (ko) * 2010-01-29 2012-08-30 삼성코닝정밀소재 주식회사 평판 유리 표면 이물질 검사 장치
JP5520737B2 (ja) * 2010-07-30 2014-06-11 株式会社日立ハイテクノロジーズ 欠陥検査装置および欠陥検査方法
KR20130124954A (ko) * 2010-12-09 2013-11-15 아사히 가라스 가부시키가이샤 유리 기판
CN102519968A (zh) * 2011-11-28 2012-06-27 上海华力微电子有限公司 掩膜板缺陷检测装置
CN102768969B (zh) * 2012-07-03 2015-01-07 上海华力微电子有限公司 一种亮场缺陷扫描中的光斑抑制方法
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CN104897693A (zh) * 2015-06-12 2015-09-09 武汉中导光电设备有限公司 一种玻璃表面缺陷增强装置及其检测方法

Also Published As

Publication number Publication date
JP2019529925A (ja) 2019-10-17
KR102157044B1 (ko) 2020-09-17
TWI658263B (zh) 2019-05-01
US20200025691A1 (en) 2020-01-23
CN107884318A (zh) 2018-04-06
JP7045369B2 (ja) 2022-03-31
CN107884318B (zh) 2020-04-10
EP3521805A1 (en) 2019-08-07
TW201814275A (zh) 2018-04-16
EP3521805A4 (en) 2019-11-06
US10648926B2 (en) 2020-05-12
KR20190051031A (ko) 2019-05-14
WO2018059376A1 (zh) 2018-04-05

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