SG11201901887UA - Process for the generation of metal-containing films - Google Patents
Process for the generation of metal-containing filmsInfo
- Publication number
- SG11201901887UA SG11201901887UA SG11201901887UA SG11201901887UA SG11201901887UA SG 11201901887U A SG11201901887U A SG 11201901887UA SG 11201901887U A SG11201901887U A SG 11201901887UA SG 11201901887U A SG11201901887U A SG 11201901887UA SG 11201901887U A SG11201901887U A SG 11201901887UA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- group
- metal
- basf
- pct
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45534—Use of auxiliary reactants other than used for contributing to the composition of the main film, e.g. catalysts, activators or scavengers
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16193697 | 2016-10-13 | ||
PCT/EP2017/075304 WO2018069130A1 (en) | 2016-10-13 | 2017-10-05 | Process for the generation of metal-containing films |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201901887UA true SG11201901887UA (en) | 2019-04-29 |
Family
ID=57226755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201901887UA SG11201901887UA (en) | 2016-10-13 | 2017-10-05 | Process for the generation of metal-containing films |
Country Status (9)
Country | Link |
---|---|
US (1) | US20190360096A1 (de) |
EP (1) | EP3526363A1 (de) |
JP (1) | JP2019532184A (de) |
KR (1) | KR20190066048A (de) |
CN (1) | CN109844172A (de) |
IL (1) | IL265868A (de) |
SG (1) | SG11201901887UA (de) |
TW (1) | TW201829833A (de) |
WO (1) | WO2018069130A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111727272B (zh) | 2017-12-20 | 2023-04-28 | 巴斯夫欧洲公司 | 产生含金属膜的方法 |
EP3980578A1 (de) * | 2019-06-06 | 2022-04-13 | Basf Se | Verfahren zur erzeugung von metall- oder halbmetallhaltigen schichten |
WO2020244988A1 (en) * | 2019-06-06 | 2020-12-10 | Basf Se | Process for the generation of metal- or semimetal-containing films |
IL293042A (en) * | 2019-11-22 | 2022-07-01 | Basf Se | A process for creating layers containing a metal or semi-metal |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4316883C2 (de) * | 1993-05-19 | 1996-01-25 | Michael Dr Denk | Silylen, Verfahren zur Herstellung von Silylen oder Carben sowie die Verwendung des Silylens |
US5389401A (en) * | 1994-02-23 | 1995-02-14 | Gordon; Roy G. | Chemical vapor deposition of metal oxides |
TW200611990A (en) * | 2004-08-16 | 2006-04-16 | Du Pont | Atomic layer deposition of copper using surface-activating agents |
WO2009009882A1 (en) | 2007-07-16 | 2009-01-22 | F. Hoffmann-La Roche Ag | An anti-cancer cytotoxic monoclonal antibody |
US8765223B2 (en) * | 2008-05-08 | 2014-07-01 | Air Products And Chemicals, Inc. | Binary and ternary metal chalcogenide materials and method of making and using same |
JP5707768B2 (ja) | 2010-07-30 | 2015-04-30 | ブラザー工業株式会社 | 画像形成装置 |
CA2863432A1 (en) | 2012-02-01 | 2013-08-08 | Sfc Koenig Ag | Element, preferably a closure element for inserting into a bore in a component |
US9157149B2 (en) * | 2013-06-28 | 2015-10-13 | Wayne State University | Bis(trimethylsilyl) six-membered ring systems and related compounds as reducing agents for forming layers on a substrate |
EP2857550A1 (de) * | 2013-10-02 | 2015-04-08 | Basf Se | Aminvorläufer zum Ablagern von Graphen |
-
2017
- 2017-10-05 KR KR1020197013634A patent/KR20190066048A/ko not_active Application Discontinuation
- 2017-10-05 WO PCT/EP2017/075304 patent/WO2018069130A1/en unknown
- 2017-10-05 US US16/331,593 patent/US20190360096A1/en not_active Abandoned
- 2017-10-05 SG SG11201901887UA patent/SG11201901887UA/en unknown
- 2017-10-05 CN CN201780062626.7A patent/CN109844172A/zh active Pending
- 2017-10-05 JP JP2019520416A patent/JP2019532184A/ja not_active Withdrawn
- 2017-10-05 EP EP17777596.2A patent/EP3526363A1/de not_active Withdrawn
- 2017-10-11 TW TW106134730A patent/TW201829833A/zh unknown
-
2019
- 2019-04-07 IL IL265868A patent/IL265868A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2018069130A1 (en) | 2018-04-19 |
EP3526363A1 (de) | 2019-08-21 |
KR20190066048A (ko) | 2019-06-12 |
JP2019532184A (ja) | 2019-11-07 |
CN109844172A (zh) | 2019-06-04 |
IL265868A (en) | 2019-06-30 |
US20190360096A1 (en) | 2019-11-28 |
TW201829833A (zh) | 2018-08-16 |
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