SG11201900593WA - Method and device for lithographically producing a target structure on a non-planar initial structure - Google Patents

Method and device for lithographically producing a target structure on a non-planar initial structure

Info

Publication number
SG11201900593WA
SG11201900593WA SG11201900593WA SG11201900593WA SG11201900593WA SG 11201900593W A SG11201900593W A SG 11201900593WA SG 11201900593W A SG11201900593W A SG 11201900593WA SG 11201900593W A SG11201900593W A SG 11201900593WA SG 11201900593W A SG11201900593W A SG 11201900593WA
Authority
SG
Singapore
Prior art keywords
lithography beam
target
initial structure
planar
producing
Prior art date
Application number
SG11201900593WA
Other languages
English (en)
Inventor
Christian Koos
Tobias Hoose
Philipp-Immanuel Dietrich
Matthias Blaicher
Maria Laura Gödecke
Nicole Lindenmann
Original Assignee
Karlsruher Inst Technologie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=59558404&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11201900593W(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Karlsruher Inst Technologie filed Critical Karlsruher Inst Technologie
Publication of SG11201900593WA publication Critical patent/SG11201900593WA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
SG11201900593WA 2016-08-05 2017-08-04 Method and device for lithographically producing a target structure on a non-planar initial structure SG11201900593WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016214606.8A DE102016214606B3 (de) 2016-08-05 2016-08-05 Verfahren und Vorrichtung zur lithographischen Erzeugung einer Zielstruktur an einer nicht-planaren Ausgangsstruktur
PCT/EP2017/069764 WO2018024872A1 (de) 2016-08-05 2017-08-04 Verfahren und vorrichtung zur lithographischen erzeugung einer zielstruktur an einer nicht-planaren ausgangsstruktur

Publications (1)

Publication Number Publication Date
SG11201900593WA true SG11201900593WA (en) 2019-02-27

Family

ID=59558404

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201900593WA SG11201900593WA (en) 2016-08-05 2017-08-04 Method and device for lithographically producing a target structure on a non-planar initial structure
SG10202101208YA SG10202101208YA (en) 2016-08-05 2017-08-04 Method and device for lithographically producing a target structure on a non-planar initial structure

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10202101208YA SG10202101208YA (en) 2016-08-05 2017-08-04 Method and device for lithographically producing a target structure on a non-planar initial structure

Country Status (8)

Country Link
US (2) US11143966B2 (de)
EP (1) EP3494440A1 (de)
JP (1) JP7023928B2 (de)
CN (1) CN109997081B (de)
CA (1) CA3033331A1 (de)
DE (1) DE102016214606B3 (de)
SG (2) SG11201900593WA (de)
WO (1) WO2018024872A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017128824A1 (de) * 2017-12-05 2019-06-06 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines strahlungsemittierenden Bauteils und strahlungsemittierendes Bauteil
US10942313B2 (en) * 2019-02-13 2021-03-09 United States Of America As Represented By The Secretary Of The Air Force Temperature-immune self-referencing Fabry-Pérot cavity sensors
CN110263588B (zh) * 2019-07-23 2023-05-16 南方电网科学研究院有限责任公司 一种物理不可克隆函数电路，集成电路及制备方法
TWI715277B (zh) * 2019-11-05 2021-01-01 友達光電股份有限公司 顯示面板及其製造方法
DE102020202821A1 (de) 2020-03-05 2021-09-09 Karlsruher Institut für Technologie Lokalisierung von optischen Koppelstellen
CN113031149B (zh) * 2021-04-06 2022-03-18 上海大学 基于微流控型双光子激光直写技术的超长三维纳米光纤制备系统及方法
DE102021110860B3 (de) 2021-04-28 2022-03-17 Nanoscribe Holding Gmbh Verfahren zum Erzeugen einer dreidimensionalen Struktur in einem Lithographiematerial mittels einer Laserlithographie-Vorrichtung und Laserlithographie-Vorrichtung
US20220357484A1 (en) * 2021-05-10 2022-11-10 Juejun Hu Methods and Systems for Metasurface-Based Nanofabrication
CN113532280B (zh) * 2021-06-04 2023-03-21 华南师范大学 可用于纳米级位移测量的液晶光尺及其制备方法
CN113985536B (zh) * 2021-10-28 2023-06-13 中国科学院半导体研究所 一种光电子集成器件及其制备方法
DE102022104797A1 (de) 2022-03-01 2023-09-07 Carl Zeiss Ag 3D-Druckvorrichtung und 3D-Druckverfahren zur Fertigung eines Werkstücks
DE102022118641A1 (de) 2022-07-26 2024-02-01 Baden-Württemberg Stiftung Ggmbh Verfahren zur Herstellung einer Mikrooptik

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09243869A (ja) * 1996-03-14 1997-09-19 Hitachi Ltd 光モジュールの製造方法
JPH10209000A (ja) * 1997-01-17 1998-08-07 Sony Corp 電子ビーム描画装置及びパターン描画方法
US6346979B1 (en) * 1999-03-17 2002-02-12 International Business Machines Corporation Process and apparatus to adjust exposure dose in lithography systems
WO2001096959A2 (en) 2000-06-15 2001-12-20 3M Innovative Properties Company Multidirectional photoreactive absorption method
US8597871B2 (en) 2005-06-18 2013-12-03 The Regents Of The University Of Colorado Three-dimensional direct-write lithography
US7265057B2 (en) 2005-11-18 2007-09-04 Matsushita Electric Industrial Co., Ltd 3D lithography with laser beam writer for making hybrid surfaces
WO2009009208A2 (en) 2007-04-23 2009-01-15 The Trustees Of The University Of Pennsylvania Patterning structures using deformable substrates
JP5234315B2 (ja) 2007-12-03 2013-07-10 ソニー株式会社 光造形装置および光造形方法
DE102008054582A1 (de) 2007-12-21 2009-07-09 Carl Zeiss Smt Ag Mikrolithographische Projektionsbelichtungsanlage
US7902526B2 (en) 2008-04-28 2011-03-08 Massachusetts Institute Of Technology 3D two-photon lithographic microfabrication system
US8636496B2 (en) 2008-05-05 2014-01-28 Georgia Tech Research Corporation Systems and methods for fabricating three-dimensional objects
WO2010065247A2 (en) 2008-12-05 2010-06-10 3M Innovative Properties Company Three-dimensional articles using nonlinear thermal polymerization
US8903205B2 (en) * 2012-02-23 2014-12-02 Karlsruhe Institute of Technology (KIT) Three-dimensional freeform waveguides for chip-chip connections
US9034222B2 (en) 2012-02-23 2015-05-19 Karlsruhe Institut Fuer Technologie Method for producing photonic wire bonds
DE102012010635B4 (de) 2012-05-18 2022-04-07 Leibniz-Institut für Oberflächenmodifizierung e.V. Verfahren zur 3D-Strukturierung und Formgebung von Oberflächen aus harten, spröden und optischen Materialien
GB2502313A (en) 2012-05-24 2013-11-27 Ibm Manufacturing three dimensional photonic device by two photon absorption polymerization

Also Published As

Publication number Publication date
JP7023928B2 (ja) 2022-02-22
DE102016214606B3 (de) 2017-08-31
US11143966B2 (en) 2021-10-12
JP2019525249A (ja) 2019-09-05
EP3494440A1 (de) 2019-06-12
US11630394B2 (en) 2023-04-18
WO2018024872A1 (de) 2018-02-08
SG10202101208YA (en) 2021-03-30
CA3033331A1 (en) 2018-02-08
CN109997081B (zh) 2021-12-14
US20210405537A1 (en) 2021-12-30
CN109997081A (zh) 2019-07-09
US20190163067A1 (en) 2019-05-30

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