SG11201908481QA - Vertical control method for use in lithography machine - Google Patents

Vertical control method for use in lithography machine

Info

Publication number
SG11201908481QA
SG11201908481QA SG11201908481QA SG11201908481QA SG 11201908481Q A SG11201908481Q A SG 11201908481QA SG 11201908481Q A SG11201908481Q A SG 11201908481QA SG 11201908481Q A SG11201908481Q A SG 11201908481QA
Authority
SG
Singapore
Prior art keywords
workpiece
vertical control
control method
vertical
exposure field
Prior art date
Application number
Inventor
Dan Chen
Xianying Wang
Zhiyong Yang
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11201908481QA publication Critical patent/SG11201908481QA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling

Abstract

A vertical control method for use in a lithography machine, comprising the following steps: step : before scanning exposure, controlling a vertical measurement sensor (5) to measure a workpiece (6) to acquire data of the overall shape of the workpiece; step 2: executing global levelling on the basis of the data of the overall shape of the workpiece; and step 3: when performing scanning exposure of each exposure field, using the vertical measurement sensor to measure in real time the partial shape of the workpiece and, on the basis of a height value in the Z direction, an inclination value around the X direction, and an inclination value around the Y direction in the partial shape of the workpiece, controlling at least one of a mask stage (3), a workpiece stage (7), and a projection objective (4) to move vertically to complement the partial shape of the workpiece in real time, such that the upper surface of the workpiece in each exposure field coincides with a reference focal plane (42) of the exposure field. The present vertical control method can flexibly select a vertical control scheme, improving the precision of vertical control. 41
SG11201908481Q 2017-03-15 2018-03-14 Vertical control method for use in lithography machine SG11201908481QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710154051.3A CN107966880B (en) 2017-03-15 2017-03-15 A kind of vertical control method for litho machine
PCT/CN2018/078930 WO2018166462A1 (en) 2017-03-15 2018-03-14 Vertical control method for use in lithography machine

Publications (1)

Publication Number Publication Date
SG11201908481QA true SG11201908481QA (en) 2019-10-30

Family

ID=61996541

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201908481Q SG11201908481QA (en) 2017-03-15 2018-03-14 Vertical control method for use in lithography machine

Country Status (7)

Country Link
US (1) US11042101B2 (en)
JP (1) JP6941684B2 (en)
KR (1) KR102278250B1 (en)
CN (1) CN107966880B (en)
SG (1) SG11201908481QA (en)
TW (1) TWI668523B (en)
WO (1) WO2018166462A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111123667B (en) * 2018-10-31 2021-09-24 上海微电子装备（集团）股份有限公司 Photoetching device, vertical control method of photoetching device and exposure method
CN113031461B (en) * 2019-12-24 2023-08-11 沈阳智能机器人创新中心有限公司 Semi-physical simulation system and method for ultra-precise motion platform
CN111103768B (en) * 2019-12-26 2022-06-07 华虹半导体(无锡)有限公司 Method for reducing poor focusing of wafer edge
CN114252042B (en) * 2020-09-25 2023-12-22 上海微电子装备（集团）股份有限公司 Mask table vertical measurement tool and mask table vertical measurement method
EP4036649A1 (en) * 2021-01-29 2022-08-03 ASML Netherlands B.V. Method for determining a focus actuation profile for one or more actuators of a lithographic exposure apparatus
DE102021127226B3 (en) 2021-10-20 2022-12-22 Jenaer Antriebstechnik Gmbh Device with a movable table system and method for its calibration and operation
CN117055306B (en) * 2023-10-11 2024-01-16 福建安芯半导体科技有限公司 Automatic synchronous focusing system for step-and-scan lithography machine

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330219A (en) 1995-06-02 1996-12-13 Nikon Corp Scanning-type exposure device
JP3572430B2 (en) * 1994-11-29 2004-10-06 株式会社ニコン Exposure method and apparatus
JPH11168050A (en) * 1997-12-04 1999-06-22 Nikon Corp Exposure method and exposure system
TW446829B (en) * 1998-09-25 2001-07-21 Nippon Kogaku Kk Image formation position adjusting device, exposure system, image formation adjusting method and exposure method
TW200509205A (en) 2003-05-23 2005-03-01 Nippon Kogaku Kk Exposure method and device-manufacturing method
US7327465B2 (en) * 2003-06-19 2008-02-05 Zygo Corporation Compensation for effects of beam misalignments in interferometer metrology systems
JP2005129674A (en) * 2003-10-23 2005-05-19 Canon Inc Scanning aligner and method of manufacturing device
US7113256B2 (en) 2004-02-18 2006-09-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method with feed-forward focus control
JP2006261418A (en) 2005-03-17 2006-09-28 Canon Inc Projection aligner and process for fabricating device
CN102033438B (en) * 2009-09-29 2012-08-29 上海微电子装备有限公司 Focusing and levelling device with expandable measuring range and focusing and levelling method
CN102486623A (en) * 2010-12-03 2012-06-06 上海微电子装备有限公司 Focusing control device and method used for photoetching equipment
JP5890139B2 (en) * 2011-09-30 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス Drawing apparatus and focus adjustment method thereof
CN105892241B (en) * 2014-05-12 2019-03-26 上海微电子装备（集团）股份有限公司 A kind of device and method of litho machine large area static state focusing and leveling
CN106154759B (en) * 2015-04-15 2018-08-24 上海微电子装备（集团）股份有限公司 A kind of lithographic equipment and method of the fluctuating of recoverable material

Also Published As

Publication number Publication date
JP6941684B2 (en) 2021-09-29
US11042101B2 (en) 2021-06-22
TW201837618A (en) 2018-10-16
JP2020511690A (en) 2020-04-16
KR102278250B1 (en) 2021-07-16
US20200272062A1 (en) 2020-08-27
TWI668523B (en) 2019-08-11
CN107966880B (en) 2019-01-11
WO2018166462A1 (en) 2018-09-20
CN107966880A (en) 2018-04-27
KR20190122857A (en) 2019-10-30

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