SG11201908481QA - Vertical control method for use in lithography machine - Google Patents
Vertical control method for use in lithography machineInfo
- Publication number
- SG11201908481QA SG11201908481QA SG11201908481QA SG11201908481QA SG 11201908481Q A SG11201908481Q A SG 11201908481QA SG 11201908481Q A SG11201908481Q A SG 11201908481QA SG 11201908481Q A SG11201908481Q A SG 11201908481QA
- Authority
- SG
- Singapore
- Prior art keywords
- workpiece
- vertical control
- control method
- vertical
- exposure field
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70641—Focus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7034—Leveling
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
A vertical control method for use in a lithography machine, comprising the following steps: step : before scanning exposure, controlling a vertical measurement sensor (5) to measure a workpiece (6) to acquire data of the overall shape of the workpiece; step 2: executing global levelling on the basis of the data of the overall shape of the workpiece; and step 3: when performing scanning exposure of each exposure field, using the vertical measurement sensor to measure in real time the partial shape of the workpiece and, on the basis of a height value in the Z direction, an inclination value around the X direction, and an inclination value around the Y direction in the partial shape of the workpiece, controlling at least one of a mask stage (3), a workpiece stage (7), and a projection objective (4) to move vertically to complement the partial shape of the workpiece in real time, such that the upper surface of the workpiece in each exposure field coincides with a reference focal plane (42) of the exposure field. The present vertical control method can flexibly select a vertical control scheme, improving the precision of vertical control. 41
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710154051.3A CN107966880B (en) | 2017-03-15 | 2017-03-15 | A kind of vertical control method for litho machine |
PCT/CN2018/078930 WO2018166462A1 (en) | 2017-03-15 | 2018-03-14 | Vertical control method for use in lithography machine |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201908481QA true SG11201908481QA (en) | 2019-10-30 |
Family
ID=61996541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201908481Q SG11201908481QA (en) | 2017-03-15 | 2018-03-14 | Vertical control method for use in lithography machine |
Country Status (7)
Country | Link |
---|---|
US (1) | US11042101B2 (en) |
JP (1) | JP6941684B2 (en) |
KR (1) | KR102278250B1 (en) |
CN (1) | CN107966880B (en) |
SG (1) | SG11201908481QA (en) |
TW (1) | TWI668523B (en) |
WO (1) | WO2018166462A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111123667B (en) * | 2018-10-31 | 2021-09-24 | 上海微电子装备(集团)股份有限公司 | Photoetching device, vertical control method of photoetching device and exposure method |
CN113031461B (en) * | 2019-12-24 | 2023-08-11 | 沈阳智能机器人创新中心有限公司 | Semi-physical simulation system and method for ultra-precise motion platform |
CN111103768B (en) * | 2019-12-26 | 2022-06-07 | 华虹半导体(无锡)有限公司 | Method for reducing poor focusing of wafer edge |
CN114252042B (en) * | 2020-09-25 | 2023-12-22 | 上海微电子装备(集团)股份有限公司 | Mask table vertical measurement tool and mask table vertical measurement method |
EP4036649A1 (en) * | 2021-01-29 | 2022-08-03 | ASML Netherlands B.V. | Method for determining a focus actuation profile for one or more actuators of a lithographic exposure apparatus |
DE102021127226B3 (en) | 2021-10-20 | 2022-12-22 | Jenaer Antriebstechnik Gmbh | Device with a movable table system and method for its calibration and operation |
CN117055306B (en) * | 2023-10-11 | 2024-01-16 | 福建安芯半导体科技有限公司 | Automatic synchronous focusing system for step-and-scan lithography machine |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08330219A (en) | 1995-06-02 | 1996-12-13 | Nikon Corp | Scanning-type exposure device |
JP3572430B2 (en) * | 1994-11-29 | 2004-10-06 | 株式会社ニコン | Exposure method and apparatus |
JPH11168050A (en) | 1997-12-04 | 1999-06-22 | Nikon Corp | Exposure method and exposure system |
TW446829B (en) | 1998-09-25 | 2001-07-21 | Nippon Kogaku Kk | Image formation position adjusting device, exposure system, image formation adjusting method and exposure method |
TWI518742B (en) | 2003-05-23 | 2016-01-21 | 尼康股份有限公司 | A method of manufacturing an exposure apparatus and an element |
US7327465B2 (en) * | 2003-06-19 | 2008-02-05 | Zygo Corporation | Compensation for effects of beam misalignments in interferometer metrology systems |
JP2005129674A (en) * | 2003-10-23 | 2005-05-19 | Canon Inc | Scanning aligner and method of manufacturing device |
US7113256B2 (en) | 2004-02-18 | 2006-09-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method with feed-forward focus control |
JP2006261418A (en) | 2005-03-17 | 2006-09-28 | Canon Inc | Projection aligner and process for fabricating device |
CN102033438B (en) | 2009-09-29 | 2012-08-29 | 上海微电子装备有限公司 | Focusing and levelling device with expandable measuring range and focusing and levelling method |
CN102486623A (en) * | 2010-12-03 | 2012-06-06 | 上海微电子装备有限公司 | Focusing control device and method used for photoetching equipment |
JP5890139B2 (en) * | 2011-09-30 | 2016-03-22 | 株式会社Screenホールディングス | Drawing apparatus and focus adjustment method thereof |
CN105892241B (en) * | 2014-05-12 | 2019-03-26 | 上海微电子装备(集团)股份有限公司 | A kind of device and method of litho machine large area static state focusing and leveling |
CN106154759B (en) * | 2015-04-15 | 2018-08-24 | 上海微电子装备(集团)股份有限公司 | A kind of lithographic equipment and method of the fluctuating of recoverable material |
-
2017
- 2017-03-15 CN CN201710154051.3A patent/CN107966880B/en active Active
-
2018
- 2018-03-14 JP JP2019550786A patent/JP6941684B2/en active Active
- 2018-03-14 US US16/494,097 patent/US11042101B2/en active Active
- 2018-03-14 WO PCT/CN2018/078930 patent/WO2018166462A1/en active Application Filing
- 2018-03-14 SG SG11201908481Q patent/SG11201908481QA/en unknown
- 2018-03-14 KR KR1020197030157A patent/KR102278250B1/en active IP Right Grant
- 2018-03-15 TW TW107108867A patent/TWI668523B/en active
Also Published As
Publication number | Publication date |
---|---|
KR102278250B1 (en) | 2021-07-16 |
US11042101B2 (en) | 2021-06-22 |
US20200272062A1 (en) | 2020-08-27 |
KR20190122857A (en) | 2019-10-30 |
WO2018166462A1 (en) | 2018-09-20 |
TW201837618A (en) | 2018-10-16 |
JP6941684B2 (en) | 2021-09-29 |
CN107966880B (en) | 2019-01-11 |
TWI668523B (en) | 2019-08-11 |
CN107966880A (en) | 2018-04-27 |
JP2020511690A (en) | 2020-04-16 |
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