SG11201900434PA - Saw-based electronic elements and filter devices - Google Patents

Saw-based electronic elements and filter devices

Info

Publication number
SG11201900434PA
SG11201900434PA SG11201900434PA SG11201900434PA SG11201900434PA SG 11201900434P A SG11201900434P A SG 11201900434PA SG 11201900434P A SG11201900434P A SG 11201900434PA SG 11201900434P A SG11201900434P A SG 11201900434PA SG 11201900434P A SG11201900434P A SG 11201900434PA
Authority
SG
Singapore
Prior art keywords
international
kadoma
osaka
shi
filter
Prior art date
Application number
SG11201900434PA
Other languages
English (en)
Inventor
Yoshiaki Ando
Satoshi Niwa
Hiroyuki Nakamura
Original Assignee
Skyworks Filter Solutions Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skyworks Filter Solutions Japan Co Ltd filed Critical Skyworks Filter Solutions Japan Co Ltd
Publication of SG11201900434PA publication Critical patent/SG11201900434PA/en

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02913—Measures for shielding against electromagnetic fields
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6423—Means for obtaining a particular transfer characteristic
    • H03H9/6433—Coupled resonator filters
    • H03H9/6483—Ladder SAW filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Electromagnetism (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Control Of Metal Rolling (AREA)
  • Measuring And Recording Apparatus For Diagnosis (AREA)
SG11201900434PA 2016-07-18 2017-07-18 Saw-based electronic elements and filter devices SG11201900434PA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662363655P 2016-07-18 2016-07-18
US201762510035P 2017-05-23 2017-05-23
PCT/JP2017/025889 WO2018016467A1 (en) 2016-07-18 2017-07-18 Saw-based electronic elements and filter devices

Publications (1)

Publication Number Publication Date
SG11201900434PA true SG11201900434PA (en) 2019-02-27

Family

ID=59523213

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201900434PA SG11201900434PA (en) 2016-07-18 2017-07-18 Saw-based electronic elements and filter devices

Country Status (4)

Country Link
US (1) US10778183B2 (enrdf_load_stackoverflow)
JP (1) JP6809994B2 (enrdf_load_stackoverflow)
SG (1) SG11201900434PA (enrdf_load_stackoverflow)
WO (1) WO2018016467A1 (enrdf_load_stackoverflow)

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KR102282201B1 (ko) 2017-08-31 2021-07-26 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치 및 그것을 구비한 탄성파 모듈
WO2019044310A1 (ja) 2017-08-31 2019-03-07 株式会社村田製作所 弾性波装置およびそれを備えた弾性波モジュール
JP6848953B2 (ja) * 2018-11-26 2021-03-24 株式会社大真空 圧電振動デバイス
US12150114B2 (en) * 2019-06-05 2024-11-19 Lg Electronics Inc. Method and device for performing HARQ feedback in NR V2X
JP7401200B2 (ja) * 2019-06-14 2023-12-19 太陽誘電株式会社 電子デバイスの製造方法
US11244876B2 (en) 2019-10-09 2022-02-08 Microchip Technology Inc. Packaged semiconductor die with micro-cavity
US11316497B2 (en) * 2019-12-09 2022-04-26 Intel Corporation Multi-filter die
CN111864050B (zh) * 2020-04-16 2023-04-18 诺思(天津)微系统有限责任公司 半导体器件、半导体组件及电子设备
US12404167B2 (en) 2021-09-28 2025-09-02 Skyworks Global Pte. Ltd. Piezoelectric MEMS device with thermal compensation from different material thicknesses
US20240038690A1 (en) * 2022-07-26 2024-02-01 Mediatek Inc. Semiconductor devices with a structure capable of suppressing coupling noise suppression

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JPH06244676A (ja) 1993-02-19 1994-09-02 Daishinku Co 多段接続型弾性表面波フィルタ
JPH07154201A (ja) * 1993-11-30 1995-06-16 Matsushita Electric Ind Co Ltd 弾性表面波フィルタ
JP3860364B2 (ja) * 1999-08-11 2006-12-20 富士通メディアデバイス株式会社 弾性表面波装置
EP1475890A1 (en) 2002-02-12 2004-11-10 Matsushita Electric Industrial Co., Ltd. Elastic surface wave apparatus
JP2004129223A (ja) 2002-07-31 2004-04-22 Murata Mfg Co Ltd 圧電部品およびその製造方法
JP2004096250A (ja) * 2002-08-29 2004-03-25 Murata Mfg Co Ltd 弾性表面波フィルタ、通信装置
JP3985780B2 (ja) * 2003-05-29 2007-10-03 エプソントヨコム株式会社 圧電デバイス
JP2004364041A (ja) 2003-06-05 2004-12-24 Fujitsu Media Device Kk 弾性表面波デバイス及びその製造方法
JP2005167969A (ja) 2003-11-14 2005-06-23 Fujitsu Media Device Kk 弾性波素子および弾性波素子の製造方法
US7385463B2 (en) * 2003-12-24 2008-06-10 Kyocera Corporation Surface acoustic wave device and electronic circuit device
JP3998658B2 (ja) 2004-04-28 2007-10-31 富士通メディアデバイス株式会社 弾性波デバイスおよびパッケージ基板
JP4587732B2 (ja) 2004-07-28 2010-11-24 京セラ株式会社 弾性表面波装置
JP2006211612A (ja) * 2005-01-31 2006-08-10 Sony Corp Ｓａｗデバイス、通信モジュール及びｓａｗデバイスの製造方法
KR100631212B1 (ko) 2005-08-01 2006-10-04 삼성전자주식회사 모놀리식 듀플렉서 및 그 제조방법
JP2008288497A (ja) 2007-05-21 2008-11-27 Toshiba Corp 微小電気機械装置
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JP5261112B2 (ja) * 2008-09-29 2013-08-14 京セラ株式会社 弾性表面波素子、弾性表面波装置及び通信装置
US8836449B2 (en) 2010-08-27 2014-09-16 Wei Pang Vertically integrated module in a wafer level package
JP2012199833A (ja) * 2011-03-22 2012-10-18 Taiyo Yuden Co Ltd 電子部品、電子デバイス、及び電子部品の製造方法
DE102011016554B4 (de) 2011-04-08 2018-11-22 Snaptrack, Inc. Waferlevel-Package und Verfahren zur Herstellung
JP6006086B2 (ja) 2012-11-01 2016-10-12 太陽誘電株式会社 弾性波フィルタ及びモジュール
JP6261867B2 (ja) 2013-01-25 2018-01-17 太陽誘電株式会社 弾性波デバイスの製造方法

Also Published As

Publication number Publication date
JP2018014717A (ja) 2018-01-25
JP6809994B2 (ja) 2021-01-06
US20180019727A1 (en) 2018-01-18
US10778183B2 (en) 2020-09-15
WO2018016467A1 (en) 2018-01-25

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