SG11201806662WA - Window in thin polishing pad - Google Patents

Window in thin polishing pad

Info

Publication number
SG11201806662WA
SG11201806662WA SG11201806662WA SG11201806662WA SG11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA SG 11201806662W A SG11201806662W A SG 11201806662WA
Authority
SG
Singapore
Prior art keywords
polishing
international
aperture
layer
california
Prior art date
Application number
SG11201806662WA
Other languages
English (en)
Inventor
Yongqi Hu
Kadthala Ramaya Narendrnath
Thomas Lawrence Terry
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201806662WA publication Critical patent/SG11201806662WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
SG11201806662WA 2016-02-26 2016-02-26 Window in thin polishing pad SG11201806662WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2016/019916 WO2017146735A1 (en) 2016-02-26 2016-02-26 Window in thin polishing pad

Publications (1)

Publication Number Publication Date
SG11201806662WA true SG11201806662WA (en) 2018-09-27

Family

ID=59686484

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201806662WA SG11201806662WA (en) 2016-02-26 2016-02-26 Window in thin polishing pad

Country Status (6)

Country Link
EP (1) EP3420579B1 (ja)
JP (1) JP6794464B2 (ja)
KR (2) KR102664256B1 (ja)
CN (2) CN108701600B (ja)
SG (1) SG11201806662WA (ja)
WO (1) WO2017146735A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240006369A (ko) * 2022-07-06 2024-01-15 케이피엑스케미칼 주식회사 윈도우가 장착된 연마패드 및 이의 제조방법

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224460B1 (en) * 1999-06-30 2001-05-01 Vlsi Technology, Inc. Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process
WO2001023141A1 (en) * 1999-09-29 2001-04-05 Rodel Holdings, Inc. Polishing pad
CA2317778A1 (en) * 1999-09-29 2001-03-29 Vivienne E. Harris Synergistic insecticidal formulations of pyridaben and strobilurins
US6383058B1 (en) * 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
WO2003032379A1 (fr) * 2001-10-09 2003-04-17 Hitachi Chemical Co., Ltd. Element de polissage pour procede cmp, procede de polissage de substrat comprenant l'utilisation de cet element, et procede de production d'un element de polissage pour cmp
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
JP2004098264A (ja) * 2002-09-12 2004-04-02 Shin Etsu Handotai Co Ltd 研磨布のドレッシング方法及びワークの研磨方法
CN1285457C (zh) * 2002-12-06 2006-11-22 智胜科技股份有限公司 具有侦测窗口的研磨垫的制造方法
US6913514B2 (en) * 2003-03-14 2005-07-05 Ebara Technologies, Inc. Chemical mechanical polishing endpoint detection system and method
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
US20040224611A1 (en) * 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
JP4514199B2 (ja) * 2004-05-10 2010-07-28 東洋ゴム工業株式会社 研磨パッド及び半導体デバイスの製造方法
JP2006190826A (ja) * 2005-01-06 2006-07-20 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
JP5474093B2 (ja) * 2009-01-16 2014-04-16 アプライド マテリアルズ インコーポレイテッド 窓支持部を具備する研磨パッドおよび研磨システム
TWI396602B (zh) * 2009-12-31 2013-05-21 Iv Technologies Co Ltd 具有偵測窗之研磨墊的製造方法及具有偵測窗之研磨墊
JP5620141B2 (ja) * 2010-04-15 2014-11-05 東洋ゴム工業株式会社 研磨パッド
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
JP2013082035A (ja) * 2011-10-11 2013-05-09 Toyo Tire & Rubber Co Ltd 積層研磨パッド及びその製造方法
JP2014104521A (ja) * 2012-11-26 2014-06-09 Toyo Tire & Rubber Co Ltd 研磨パッド

Also Published As

Publication number Publication date
EP3420579A4 (en) 2019-08-14
KR20230058559A (ko) 2023-05-03
EP3420579A1 (en) 2019-01-02
KR20180117655A (ko) 2018-10-29
KR102527886B1 (ko) 2023-04-28
CN108701600A (zh) 2018-10-23
CN116141191A (zh) 2023-05-23
CN108701600B (zh) 2023-03-14
WO2017146735A1 (en) 2017-08-31
JP6794464B2 (ja) 2020-12-02
JP2019508272A (ja) 2019-03-28
KR102664256B1 (ko) 2024-05-08
EP3420579B1 (en) 2022-10-19

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