SG11201802958QA - Cooling device and refrigerant relay device - Google Patents

Cooling device and refrigerant relay device

Info

Publication number
SG11201802958QA
SG11201802958QA SG11201802958QA SG11201802958QA SG11201802958QA SG 11201802958Q A SG11201802958Q A SG 11201802958QA SG 11201802958Q A SG11201802958Q A SG 11201802958QA SG 11201802958Q A SG11201802958Q A SG 11201802958QA SG 11201802958Q A SG11201802958Q A SG 11201802958QA
Authority
SG
Singapore
Prior art keywords
refrigerant relay
cooling device
cooling
relay device
refrigerant
Prior art date
Application number
SG11201802958QA
Other languages
English (en)
Inventor
Yasuhito Nakamura
Shunsuke Fujii
Original Assignee
Nec Platforms Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Platforms Ltd filed Critical Nec Platforms Ltd
Publication of SG11201802958QA publication Critical patent/SG11201802958QA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B43/00—Arrangements for separating or purifying gases or liquids; Arrangements for vaporising the residuum of liquid refrigerant, e.g. by heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/01—Heaters

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG11201802958QA 2015-10-15 2016-10-14 Cooling device and refrigerant relay device SG11201802958QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015203538A JP6170110B2 (ja) 2015-10-15 2015-10-15 冷却装置および冷媒中継装置
PCT/JP2016/004592 WO2017064871A1 (ja) 2015-10-15 2016-10-14 冷却装置および冷媒中継装置

Publications (1)

Publication Number Publication Date
SG11201802958QA true SG11201802958QA (en) 2018-05-30

Family

ID=58517976

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201802958QA SG11201802958QA (en) 2015-10-15 2016-10-14 Cooling device and refrigerant relay device

Country Status (5)

Country Link
US (1) US10788270B2 (ja)
EP (1) EP3364139B1 (ja)
JP (1) JP6170110B2 (ja)
SG (1) SG11201802958QA (ja)
WO (1) WO2017064871A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6424936B1 (ja) 2017-10-04 2018-11-21 日本電気株式会社 気液分離装置、リアドア、冷却装置、及び気液分離方法
JP6579633B2 (ja) * 2017-10-20 2019-09-25 Ｎｅｃプラットフォームズ株式会社 装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5477583A (en) 1977-12-02 1979-06-21 Mitsubishi Electric Corp Semiconductor device and production of the same
US4314601A (en) 1978-10-04 1982-02-09 Giuffre Anthony A Heat exchange system for recycling waste heat
JPS5911456Y2 (ja) * 1979-06-05 1984-04-09 三菱電機株式会社 沸騰冷却装置
DE3328990C2 (de) 1983-08-11 1985-12-12 Pelikan Ag, 3000 Hannover Thermofarbband sowie Verfahren zu dessen Herstellung
JPH0328283Y2 (ja) * 1985-04-15 1991-06-18
JP2827931B2 (ja) 1994-11-21 1998-11-25 松下電器産業株式会社 熱搬送装置
US5857347A (en) 1997-03-04 1999-01-12 Frigoscandia Equipment Ab Refrigeration system and a separator therefor
JP2003240385A (ja) * 2002-02-19 2003-08-27 Daikin Ind Ltd 空気調和機
JP2004349551A (ja) 2003-05-23 2004-12-09 Denso Corp 沸騰冷却システム
JP2006039916A (ja) * 2004-07-27 2006-02-09 Internatl Business Mach Corp <Ibm> 冷却構造を備えた電子機器、冷却構造物、および電子機器の冷却方法
JP2009008349A (ja) * 2007-06-29 2009-01-15 Daikin Ind Ltd 気液分離器
BRPI1011880A2 (pt) * 2009-06-29 2016-03-29 John Bean Technologies Ab dispositivo e método para obter espaço adicional para suporte de um líquido de refrigeração
JP5780166B2 (ja) 2011-02-11 2015-09-16 株式会社デンソー ヒートポンプサイクル
JP2013139908A (ja) * 2011-12-28 2013-07-18 Daikin Industries Ltd 気液分離器及び冷凍装置
AU2013219731B2 (en) * 2012-02-14 2015-05-14 Nec Corporation Cooling apparatus and cooling system
US9612046B2 (en) 2012-12-14 2017-04-04 Mahle International Gmbh Sub-cooled condenser having a receiver tank with a refrigerant diverter for improved filling efficiency
JP6079212B2 (ja) * 2012-12-20 2017-02-15 富士通株式会社 冷却装置、電子装置および冷却方法
US20160290691A1 (en) 2013-11-14 2016-10-06 Nec Corporation Piping structure, cooling device including the same, and method for transporting refrigerant vapor
DE102014205086B3 (de) * 2014-03-19 2015-07-23 Areva Gmbh Passiver Zweiphasen-Kühlkreislauf
JP6919612B2 (ja) 2018-03-27 2021-08-18 オムロン株式会社 非接触給電装置

Also Published As

Publication number Publication date
US10788270B2 (en) 2020-09-29
WO2017064871A1 (ja) 2017-04-20
EP3364139B1 (en) 2021-01-27
EP3364139A1 (en) 2018-08-22
JP2017075736A (ja) 2017-04-20
EP3364139A4 (en) 2019-06-19
JP6170110B2 (ja) 2017-07-26
US20180313612A1 (en) 2018-11-01

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