SG11201708862WA - Imprint apparatus, imprinting method, and method of manufacturing product - Google Patents

Imprint apparatus, imprinting method, and method of manufacturing product

Info

Publication number
SG11201708862WA
SG11201708862WA SG11201708862WA SG11201708862WA SG11201708862WA SG 11201708862W A SG11201708862W A SG 11201708862WA SG 11201708862W A SG11201708862W A SG 11201708862WA SG 11201708862W A SG11201708862W A SG 11201708862WA SG 11201708862W A SG11201708862W A SG 11201708862WA
Authority
SG
Singapore
Prior art keywords
imprint apparatus
manufacturing product
imprinting
imprinting method
manufacturing
Prior art date
Application number
SG11201708862WA
Other languages
English (en)
Inventor
Hiroshi Sato
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG11201708862WA publication Critical patent/SG11201708862WA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG11201708862WA 2015-05-13 2016-05-09 Imprint apparatus, imprinting method, and method of manufacturing product SG11201708862WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015098491A JP6562707B2 (ja) 2015-05-13 2015-05-13 インプリント装置、インプリント方法及び物品の製造方法
PCT/JP2016/002271 WO2016181644A1 (en) 2015-05-13 2016-05-09 Imprint apparatus, imprinting method, and method of manufacturing product

Publications (1)

Publication Number Publication Date
SG11201708862WA true SG11201708862WA (en) 2017-11-29

Family

ID=57248847

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201708862WA SG11201708862WA (en) 2015-05-13 2016-05-09 Imprint apparatus, imprinting method, and method of manufacturing product

Country Status (7)

Country Link
US (2) US20180136557A1 (https=)
JP (1) JP6562707B2 (https=)
KR (1) KR102089136B1 (https=)
CN (1) CN107615450A (https=)
SG (1) SG11201708862WA (https=)
TW (1) TWI629709B (https=)
WO (1) WO2016181644A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI840811B (zh) 2015-02-23 2024-05-01 日商尼康股份有限公司 基板處理系統及基板處理方法、以及元件製造方法
KR102688211B1 (ko) * 2015-02-23 2024-07-24 가부시키가이샤 니콘 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고 디바이스 제조 방법
HK1246871A1 (en) 2015-02-23 2018-09-14 Nikon Corporation Measurement device, lithography system and exposure device, and management method, superposition measurement method and device manufacturing method
JP7022615B2 (ja) * 2018-02-26 2022-02-18 キヤノン株式会社 インプリント方法、インプリント装置、モールドの製造方法、および、物品の製造方法
US11740554B2 (en) * 2018-10-11 2023-08-29 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
JP7327973B2 (ja) * 2019-03-29 2023-08-16 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7263088B2 (ja) * 2019-04-08 2023-04-24 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP7222811B2 (ja) * 2019-06-04 2023-02-15 キオクシア株式会社 インプリント装置、インプリント方法、及び半導体装置の製造方法
JP2024003899A (ja) * 2022-06-28 2024-01-16 キヤノン株式会社 インプリントシステム、基板、インプリント方法、レプリカモールド製造方法及び、物品の製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6955074B2 (en) * 2003-12-29 2005-10-18 Asml Netherlands, B.V. Lithographic apparatus, method of calibration, calibration plate, device manufacturing method, and device manufactured thereby
JP4752473B2 (ja) * 2004-12-09 2011-08-17 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
US8098362B2 (en) * 2007-05-30 2012-01-17 Nikon Corporation Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
JP2009088264A (ja) 2007-09-28 2009-04-23 Toshiba Corp 微細加工装置およびデバイス製造方法
US7815824B2 (en) * 2008-02-26 2010-10-19 Molecular Imprints, Inc. Real time imprint process diagnostics for defects
JP2010030153A (ja) * 2008-07-29 2010-02-12 Toshiba Corp パターン形成方法及びパターン形成装置
JP2011009250A (ja) * 2009-06-23 2011-01-13 Toshiba Corp 基板処理方法、半導体装置の製造方法及びインプリント装置
JP2011091124A (ja) * 2009-10-21 2011-05-06 Ricoh Co Ltd 光インプリント方法
JP5455583B2 (ja) * 2009-11-30 2014-03-26 キヤノン株式会社 インプリント装置
JP2011129720A (ja) * 2009-12-17 2011-06-30 Canon Inc インプリント装置、モールド及び物品の製造方法
JP2012009831A (ja) * 2010-05-21 2012-01-12 Tokyo Electron Ltd インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP2012084732A (ja) * 2010-10-13 2012-04-26 Canon Inc インプリント方法及び装置
JP5754965B2 (ja) * 2011-02-07 2015-07-29 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP5498448B2 (ja) * 2011-07-21 2014-05-21 株式会社東芝 インプリント方法及びインプリントシステム
JP6412317B2 (ja) * 2013-04-24 2018-10-24 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
JP6494185B2 (ja) * 2013-06-26 2019-04-03 キヤノン株式会社 インプリント方法および装置
JP5909210B2 (ja) * 2013-07-11 2016-04-26 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6312379B2 (ja) * 2013-07-19 2018-04-18 キヤノン株式会社 リソグラフィ装置、リソグラフィ方法、リソグラフィシステム、プログラム、物品の製造方法
JP6282069B2 (ja) * 2013-09-13 2018-02-21 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JP2015079954A (ja) * 2013-09-13 2015-04-23 キヤノン株式会社 リソグラフィシステムおよび物品の製造方法

Also Published As

Publication number Publication date
WO2016181644A1 (en) 2016-11-17
US20180136557A1 (en) 2018-05-17
US20220026800A1 (en) 2022-01-27
TWI629709B (zh) 2018-07-11
KR102089136B1 (ko) 2020-03-13
KR20180002818A (ko) 2018-01-08
TW201642318A (zh) 2016-12-01
JP2016213418A (ja) 2016-12-15
JP6562707B2 (ja) 2019-08-21
CN107615450A (zh) 2018-01-19

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