CN107615450A - 压印装置、压印方法和制造产品的方法 - Google Patents

压印装置、压印方法和制造产品的方法 Download PDF

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Publication number
CN107615450A
CN107615450A CN201680027556.7A CN201680027556A CN107615450A CN 107615450 A CN107615450 A CN 107615450A CN 201680027556 A CN201680027556 A CN 201680027556A CN 107615450 A CN107615450 A CN 107615450A
Authority
CN
China
Prior art keywords
substrate
imprint
imprinting
pattern
holding unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680027556.7A
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English (en)
Chinese (zh)
Inventor
佐藤浩司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN107615450A publication Critical patent/CN107615450A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201680027556.7A 2015-05-13 2016-05-09 压印装置、压印方法和制造产品的方法 Pending CN107615450A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015098491A JP6562707B2 (ja) 2015-05-13 2015-05-13 インプリント装置、インプリント方法及び物品の製造方法
JP2015-098491 2015-05-13
PCT/JP2016/002271 WO2016181644A1 (en) 2015-05-13 2016-05-09 Imprint apparatus, imprinting method, and method of manufacturing product

Publications (1)

Publication Number Publication Date
CN107615450A true CN107615450A (zh) 2018-01-19

Family

ID=57248847

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680027556.7A Pending CN107615450A (zh) 2015-05-13 2016-05-09 压印装置、压印方法和制造产品的方法

Country Status (7)

Country Link
US (2) US20180136557A1 (https=)
JP (1) JP6562707B2 (https=)
KR (1) KR102089136B1 (https=)
CN (1) CN107615450A (https=)
SG (1) SG11201708862WA (https=)
TW (1) TWI629709B (https=)
WO (1) WO2016181644A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI840811B (zh) 2015-02-23 2024-05-01 日商尼康股份有限公司 基板處理系統及基板處理方法、以及元件製造方法
KR102688211B1 (ko) * 2015-02-23 2024-07-24 가부시키가이샤 니콘 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고 디바이스 제조 방법
HK1246871A1 (en) 2015-02-23 2018-09-14 Nikon Corporation Measurement device, lithography system and exposure device, and management method, superposition measurement method and device manufacturing method
JP7022615B2 (ja) * 2018-02-26 2022-02-18 キヤノン株式会社 インプリント方法、インプリント装置、モールドの製造方法、および、物品の製造方法
US11740554B2 (en) * 2018-10-11 2023-08-29 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
JP7327973B2 (ja) * 2019-03-29 2023-08-16 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7263088B2 (ja) * 2019-04-08 2023-04-24 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP7222811B2 (ja) * 2019-06-04 2023-02-15 キオクシア株式会社 インプリント装置、インプリント方法、及び半導体装置の製造方法
JP2024003899A (ja) * 2022-06-28 2024-01-16 キヤノン株式会社 インプリントシステム、基板、インプリント方法、レプリカモールド製造方法及び、物品の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050138988A1 (en) * 2003-12-29 2005-06-30 Asml Netherlands B.V. Lithographic apparatus, method of calibration, calibration plate, device manufacturing method, and device manufactured thereby
US20070252960A1 (en) * 2004-12-09 2007-11-01 Nikon Corporation Exposure Apparatus, Exposure Method, and Device Producing Method
US20100029084A1 (en) * 2008-07-29 2010-02-04 Takeshi Koshiba Pattern forming method and pattern forming device
US20100320631A1 (en) * 2009-06-23 2010-12-23 Masaru Suzuki Method of processing substrate and imprint device
JP2011091124A (ja) * 2009-10-21 2011-05-06 Ricoh Co Ltd 光インプリント方法
JP2011114309A (ja) * 2009-11-30 2011-06-09 Canon Inc インプリント装置
JP2011129720A (ja) * 2009-12-17 2011-06-30 Canon Inc インプリント装置、モールド及び物品の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8098362B2 (en) * 2007-05-30 2012-01-17 Nikon Corporation Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
JP2009088264A (ja) 2007-09-28 2009-04-23 Toshiba Corp 微細加工装置およびデバイス製造方法
US7815824B2 (en) * 2008-02-26 2010-10-19 Molecular Imprints, Inc. Real time imprint process diagnostics for defects
JP2012009831A (ja) * 2010-05-21 2012-01-12 Tokyo Electron Ltd インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP2012084732A (ja) * 2010-10-13 2012-04-26 Canon Inc インプリント方法及び装置
JP5754965B2 (ja) * 2011-02-07 2015-07-29 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP5498448B2 (ja) * 2011-07-21 2014-05-21 株式会社東芝 インプリント方法及びインプリントシステム
JP6412317B2 (ja) * 2013-04-24 2018-10-24 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
JP6494185B2 (ja) * 2013-06-26 2019-04-03 キヤノン株式会社 インプリント方法および装置
JP5909210B2 (ja) * 2013-07-11 2016-04-26 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6312379B2 (ja) * 2013-07-19 2018-04-18 キヤノン株式会社 リソグラフィ装置、リソグラフィ方法、リソグラフィシステム、プログラム、物品の製造方法
JP6282069B2 (ja) * 2013-09-13 2018-02-21 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JP2015079954A (ja) * 2013-09-13 2015-04-23 キヤノン株式会社 リソグラフィシステムおよび物品の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050138988A1 (en) * 2003-12-29 2005-06-30 Asml Netherlands B.V. Lithographic apparatus, method of calibration, calibration plate, device manufacturing method, and device manufactured thereby
US20070252960A1 (en) * 2004-12-09 2007-11-01 Nikon Corporation Exposure Apparatus, Exposure Method, and Device Producing Method
US20100029084A1 (en) * 2008-07-29 2010-02-04 Takeshi Koshiba Pattern forming method and pattern forming device
US20100320631A1 (en) * 2009-06-23 2010-12-23 Masaru Suzuki Method of processing substrate and imprint device
JP2011091124A (ja) * 2009-10-21 2011-05-06 Ricoh Co Ltd 光インプリント方法
JP2011114309A (ja) * 2009-11-30 2011-06-09 Canon Inc インプリント装置
JP2011129720A (ja) * 2009-12-17 2011-06-30 Canon Inc インプリント装置、モールド及び物品の製造方法

Also Published As

Publication number Publication date
WO2016181644A1 (en) 2016-11-17
US20180136557A1 (en) 2018-05-17
US20220026800A1 (en) 2022-01-27
TWI629709B (zh) 2018-07-11
KR102089136B1 (ko) 2020-03-13
SG11201708862WA (en) 2017-11-29
KR20180002818A (ko) 2018-01-08
TW201642318A (zh) 2016-12-01
JP2016213418A (ja) 2016-12-15
JP6562707B2 (ja) 2019-08-21

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Application publication date: 20180119