SG11201707934QA - Dicing sheet, method for producing dicing sheet, and method for producing mold chips - Google Patents

Dicing sheet, method for producing dicing sheet, and method for producing mold chips

Info

Publication number
SG11201707934QA
SG11201707934QA SG11201707934QA SG11201707934QA SG11201707934QA SG 11201707934Q A SG11201707934Q A SG 11201707934QA SG 11201707934Q A SG11201707934Q A SG 11201707934QA SG 11201707934Q A SG11201707934Q A SG 11201707934QA SG 11201707934Q A SG11201707934Q A SG 11201707934QA
Authority
SG
Singapore
Prior art keywords
producing
dicing sheet
mold chips
chips
sheet
Prior art date
Application number
SG11201707934QA
Other languages
English (en)
Inventor
Takuo Nishida
Akinori Sato
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201707934QA publication Critical patent/SG11201707934QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
SG11201707934QA 2015-03-26 2015-10-20 Dicing sheet, method for producing dicing sheet, and method for producing mold chips SG11201707934QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015065364 2015-03-26
PCT/JP2015/079515 WO2016151913A1 (ja) 2015-03-26 2015-10-20 ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法

Publications (1)

Publication Number Publication Date
SG11201707934QA true SG11201707934QA (en) 2017-10-30

Family

ID=56978788

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707934QA SG11201707934QA (en) 2015-03-26 2015-10-20 Dicing sheet, method for producing dicing sheet, and method for producing mold chips

Country Status (6)

Country Link
JP (1) JP6561115B2 (ko)
KR (1) KR102394516B1 (ko)
CN (1) CN107078038B (ko)
SG (1) SG11201707934QA (ko)
TW (1) TWI702271B (ko)
WO (1) WO2016151913A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6928852B2 (ja) * 2016-12-07 2021-09-01 古河電気工業株式会社 半導体加工用テープ
CN110509624A (zh) * 2017-12-28 2019-11-29 日东电工株式会社 层叠体的制造方法
JP7328807B2 (ja) * 2019-06-26 2023-08-17 日東電工株式会社 ダイシングテープ、及び、ダイシングダイボンドフィルム
JP2021118330A (ja) * 2020-01-29 2021-08-10 日東電工株式会社 マスキング材
JP2021119592A (ja) * 2020-01-30 2021-08-12 リンテック株式会社 ワーク加工用シートおよび加工済みワークの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002203822A (ja) * 2000-12-28 2002-07-19 Lintec Corp 脆性部材の加工方法および両面粘着シート
JP2005229040A (ja) 2004-02-16 2005-08-25 Denki Kagaku Kogyo Kk 半導体基盤固定用粘着シート
EP1719807A4 (en) * 2004-02-27 2009-03-11 Lintec Corp PRESSURE-SENSITIVE ADHESIVE SHEET
JP2009246302A (ja) * 2008-03-31 2009-10-22 Lintec Corp ダイソートテープ
JP2012180494A (ja) * 2011-02-10 2012-09-20 Nitto Denko Corp 自発巻回性粘着シート及び切断体の製造方法
JP5975621B2 (ja) * 2011-11-02 2016-08-23 リンテック株式会社 ダイシングシートおよび半導体チップの製造方法
WO2013175987A1 (ja) * 2012-05-25 2013-11-28 リンテック株式会社 ダイシングシート
JP6081094B2 (ja) * 2012-07-13 2017-02-15 リンテック株式会社 ダイシングシート
JP5633543B2 (ja) * 2012-07-27 2014-12-03 株式会社豊田自動織機 車両用ドア構造
JP6609473B2 (ja) * 2013-03-11 2019-11-20 リンテック株式会社 粘着シートおよび加工されたデバイス関連部材の製造方法

Also Published As

Publication number Publication date
CN107078038A (zh) 2017-08-18
WO2016151913A1 (ja) 2016-09-29
KR102394516B1 (ko) 2022-05-04
CN107078038B (zh) 2020-04-17
JP6561115B2 (ja) 2019-08-14
TWI702271B (zh) 2020-08-21
KR20170131338A (ko) 2017-11-29
TW201704393A (zh) 2017-02-01
JPWO2016151913A1 (ja) 2018-01-18

Similar Documents

Publication Publication Date Title
ZA201804360B (en) Integrated system and method for producing methanol product
SG10201603903QA (en) Wafer producing method
SG10201603714RA (en) Wafer producing method
SG10201605092PA (en) Wafer producing method
SG10201604080XA (en) Wafer producing method
SG10201600557XA (en) Wafer producing method
SG10201600555UA (en) Wafer producing method
SG10201510273SA (en) Wafer producing method
SG10201600552YA (en) Wafer producing method
SG10201510271QA (en) Wafer producing method
SG10201601981YA (en) Wafer producing method
SG10201601975SA (en) Wafer producing method
IL266044B (en) Method for the production of 3-alkylsulfanyl-2-chloro-n-(1-alkyl-h1-tetrazol-5-yl)-4-trifluoromethyl-benzamides
EP3357598A4 (en) METHOD OF CUTTING USING A PRESS MATRIZE
SG11201609596TA (en) Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece
EP3385857A4 (en) Die and package, and manufacturing method for die and producing method for package
EP3511369C0 (en) PROCESS FOR MAKING A FOIL
SG11201707934QA (en) Dicing sheet, method for producing dicing sheet, and method for producing mold chips
HK1249098A1 (zh) 用於生產氟美他酚的方法
IL265779B (en) A method to generate cyclopropyl-converted acetophenones
EP3254769A4 (en) Separation device, and method for producing water absorbability-imparted material
SG11201606808UA (en) Method for producing semiconductor device, and wire-bonding device
SG11201707933RA (en) Dicing sheet, method for producing dicing sheet, and method for producing mold chips
IL251714A0 (en) Semiconductor device and method of manufacturing the same
SG11201701075UA (en) Method for producing dip-formed article, and dip-formed article