JP6561115B2 - ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法 - Google Patents

ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法 Download PDF

Info

Publication number
JP6561115B2
JP6561115B2 JP2017507318A JP2017507318A JP6561115B2 JP 6561115 B2 JP6561115 B2 JP 6561115B2 JP 2017507318 A JP2017507318 A JP 2017507318A JP 2017507318 A JP2017507318 A JP 2017507318A JP 6561115 B2 JP6561115 B2 JP 6561115B2
Authority
JP
Japan
Prior art keywords
dicing sheet
adhesive layer
sensitive adhesive
pressure
acrylic polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017507318A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2016151913A1 (ja
Inventor
卓生 西田
卓生 西田
明徳 佐藤
明徳 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of JPWO2016151913A1 publication Critical patent/JPWO2016151913A1/ja
Application granted granted Critical
Publication of JP6561115B2 publication Critical patent/JP6561115B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2017507318A 2015-03-26 2015-10-20 ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法 Active JP6561115B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015065364 2015-03-26
JP2015065364 2015-03-26
PCT/JP2015/079515 WO2016151913A1 (ja) 2015-03-26 2015-10-20 ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法

Publications (2)

Publication Number Publication Date
JPWO2016151913A1 JPWO2016151913A1 (ja) 2018-01-18
JP6561115B2 true JP6561115B2 (ja) 2019-08-14

Family

ID=56978788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017507318A Active JP6561115B2 (ja) 2015-03-26 2015-10-20 ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法

Country Status (6)

Country Link
JP (1) JP6561115B2 (ko)
KR (1) KR102394516B1 (ko)
CN (1) CN107078038B (ko)
SG (1) SG11201707934QA (ko)
TW (1) TWI702271B (ko)
WO (1) WO2016151913A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110036459B (zh) * 2016-12-07 2023-07-14 古河电气工业株式会社 半导体加工用带
WO2019130616A1 (ja) * 2017-12-28 2019-07-04 日東電工株式会社 積層体の製造方法
JP7328807B2 (ja) * 2019-06-26 2023-08-17 日東電工株式会社 ダイシングテープ、及び、ダイシングダイボンドフィルム
JP2021118330A (ja) * 2020-01-29 2021-08-10 日東電工株式会社 マスキング材
JP2021119592A (ja) * 2020-01-30 2021-08-12 リンテック株式会社 ワーク加工用シートおよび加工済みワークの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002203822A (ja) * 2000-12-28 2002-07-19 Lintec Corp 脆性部材の加工方法および両面粘着シート
JP2005229040A (ja) 2004-02-16 2005-08-25 Denki Kagaku Kogyo Kk 半導体基盤固定用粘着シート
EP1719807A4 (en) * 2004-02-27 2009-03-11 Lintec Corp PRESSURE-SENSITIVE ADHESIVE SHEET
JP2009246302A (ja) * 2008-03-31 2009-10-22 Lintec Corp ダイソートテープ
JP2012180494A (ja) * 2011-02-10 2012-09-20 Nitto Denko Corp 自発巻回性粘着シート及び切断体の製造方法
JP5975621B2 (ja) * 2011-11-02 2016-08-23 リンテック株式会社 ダイシングシートおよび半導体チップの製造方法
MY186486A (en) * 2012-05-25 2021-07-22 Lintec Corp Dicing sheet
JP6081094B2 (ja) * 2012-07-13 2017-02-15 リンテック株式会社 ダイシングシート
JP5633543B2 (ja) * 2012-07-27 2014-12-03 株式会社豊田自動織機 車両用ドア構造
TWI621682B (zh) * 2013-03-11 2018-04-21 Lintec Corp 黏接片以及被加工的有關設備的部材之製作方法

Also Published As

Publication number Publication date
SG11201707934QA (en) 2017-10-30
CN107078038A (zh) 2017-08-18
CN107078038B (zh) 2020-04-17
WO2016151913A1 (ja) 2016-09-29
TW201704393A (zh) 2017-02-01
KR102394516B1 (ko) 2022-05-04
TWI702271B (zh) 2020-08-21
KR20170131338A (ko) 2017-11-29
JPWO2016151913A1 (ja) 2018-01-18

Similar Documents

Publication Publication Date Title
JP6139515B2 (ja) ダイシングシート
JP6081094B2 (ja) ダイシングシート
JP6561115B2 (ja) ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法
JP6609473B2 (ja) 粘着シートおよび加工されたデバイス関連部材の製造方法
JP6744930B2 (ja) ダイシングシートおよび当該ダイシングシートを用いるチップの製造方法
JP5414953B1 (ja) ダイシングシートおよびデバイスチップの製造方法
WO2015133420A1 (ja) 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法
JP6317744B2 (ja) ダイシングシート
JP6522617B2 (ja) ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法
JPWO2016088677A1 (ja) 粘着シート、および加工物の製造方法
JP6673734B2 (ja) ガラスダイシング用粘着シートおよびその製造方法
JPWO2015141555A6 (ja) ダイシングシートおよび当該ダイシングシートを用いるチップの製造方法
JP2017179025A (ja) ガラスダイシング用粘着シートおよびその製造方法
JP6561114B2 (ja) ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法
JP6087122B2 (ja) ダイシングシート
CN107236474B (zh) 玻璃切割用粘着片材及其制造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180723

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190625

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190722

R150 Certificate of patent or registration of utility model

Ref document number: 6561115

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250