SG11201706200UA - A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus - Google Patents

A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus

Info

Publication number
SG11201706200UA
SG11201706200UA SG11201706200UA SG11201706200UA SG11201706200UA SG 11201706200U A SG11201706200U A SG 11201706200UA SG 11201706200U A SG11201706200U A SG 11201706200UA SG 11201706200U A SG11201706200U A SG 11201706200UA SG 11201706200U A SG11201706200U A SG 11201706200UA
Authority
SG
Singapore
Prior art keywords
fall
chamber
semiconductor devices
cleaning semiconductor
proof
Prior art date
Application number
SG11201706200UA
Other languages
English (en)
Inventor
Zhenming Chu
Xi Wang
Hui Wang
Shena Jia
Jun Wu
Fuping Chen
Xuejun Li
Original Assignee
Acm Res (Shanghai) Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res (Shanghai) Inc filed Critical Acm Res (Shanghai) Inc
Publication of SG11201706200UA publication Critical patent/SG11201706200UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
    • G08B21/18—Status alarms
    • G08B21/182—Level alarms, e.g. alarms responsive to variables exceeding a threshold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/14—Measuring arrangements characterised by the use of mechanical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Emergency Management (AREA)
  • Business, Economics & Management (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
SG11201706200UA 2015-02-15 2015-09-08 A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus SG11201706200UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510081989.8A CN105983552B (zh) 2015-02-15 2015-02-15 一种防掉落的半导体清洗装置
PCT/CN2015/089096 WO2016127635A1 (en) 2015-02-15 2015-09-08 A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus

Publications (1)

Publication Number Publication Date
SG11201706200UA true SG11201706200UA (en) 2017-08-30

Family

ID=56615285

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201706200UA SG11201706200UA (en) 2015-02-15 2015-09-08 A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus

Country Status (6)

Country Link
US (1) US10770315B2 (ja)
JP (1) JP6591555B2 (ja)
KR (1) KR102382343B1 (ja)
CN (2) CN105983552B (ja)
SG (1) SG11201706200UA (ja)
WO (1) WO2016127635A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109158236B (zh) * 2018-08-20 2023-11-07 华电电力科学研究院有限公司 一种热电厂燃机压气机清洗用高压喷头及清洗方法
JP7437499B2 (ja) * 2019-11-01 2024-02-22 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 基板の洗浄方法及び洗浄装置
CN117299666A (zh) * 2022-06-23 2023-12-29 盛美半导体设备(上海)股份有限公司 基板处理设备

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US4064885A (en) * 1976-10-26 1977-12-27 Branson Ultrasonics Corporation Apparatus for cleaning workpieces by ultrasonic energy
US4326553A (en) * 1980-08-28 1982-04-27 Rca Corporation Megasonic jet cleaner apparatus
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
US5745946A (en) * 1994-07-15 1998-05-05 Ontrak Systems, Inc. Substrate processing system
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system
US5980647A (en) * 1997-07-15 1999-11-09 International Business Machines Corporation Metal removal cleaning process and apparatus
US6260562B1 (en) * 1997-10-20 2001-07-17 Dainippon Screen Mfg. Co., Ltd. Substrate cleaning apparatus and method
JP3333733B2 (ja) * 1998-02-20 2002-10-15 東京エレクトロン株式会社 洗浄装置
JP2001044467A (ja) * 1999-07-29 2001-02-16 Kanegafuchi Chem Ind Co Ltd 集積型薄膜太陽電池の洗浄装置
US6495463B2 (en) * 1999-09-28 2002-12-17 Strasbaugh Method for chemical mechanical polishing
US6539952B2 (en) * 2000-04-25 2003-04-01 Solid State Equipment Corp. Megasonic treatment apparatus
JP2001334221A (ja) * 2000-05-26 2001-12-04 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US6730176B2 (en) * 2001-07-09 2004-05-04 Birol Kuyel Single wafer megasonic cleaner method, system, and apparatus
US6848455B1 (en) * 2002-04-22 2005-02-01 Novellus Systems, Inc. Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species
US7185661B2 (en) * 2002-05-06 2007-03-06 Akrion Technologies, Inc. Reciprocating megasonic probe
JP2003340386A (ja) * 2002-05-23 2003-12-02 Toshiba Corp 超音波洗浄装置及び超音波洗浄方法
CN108490741A (zh) * 2004-06-09 2018-09-04 株式会社尼康 曝光装置及元件制造方法
US20070175502A1 (en) * 2004-07-30 2007-08-02 I.P. Foundry, Inc. Apparatus and method for delivering acoustic energy through a liquid stream to a target object for disruptive surface cleaning or treating effects
US7784478B2 (en) * 2006-01-20 2010-08-31 Akrion Systems Llc Acoustic energy system, method and apparatus for processing flat articles
JP5132108B2 (ja) * 2006-02-02 2013-01-30 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2007290111A (ja) * 2006-03-29 2007-11-08 Ebara Corp 研磨方法および研磨装置
JP4700570B2 (ja) * 2006-07-14 2011-06-15 株式会社新川 ボンディング装置並びにボンディングツール先端部の洗浄方法及びプログラム
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KR100964871B1 (ko) * 2008-07-07 2010-06-23 세메스 주식회사 패드 컨디셔닝 유닛 및 이를 구비한 매엽식 기판 연마 장치
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Also Published As

Publication number Publication date
CN107210208B (zh) 2020-05-19
WO2016127635A1 (en) 2016-08-18
US10770315B2 (en) 2020-09-08
CN107210208A (zh) 2017-09-26
JP6591555B2 (ja) 2019-10-16
CN105983552B (zh) 2019-12-24
JP2018506858A (ja) 2018-03-08
KR20170113595A (ko) 2017-10-12
KR102382343B1 (ko) 2022-04-04
CN105983552A (zh) 2016-10-05
US20180033654A1 (en) 2018-02-01

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