SG11201706200UA - A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus - Google Patents
A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatusInfo
- Publication number
- SG11201706200UA SG11201706200UA SG11201706200UA SG11201706200UA SG11201706200UA SG 11201706200U A SG11201706200U A SG 11201706200UA SG 11201706200U A SG11201706200U A SG 11201706200UA SG 11201706200U A SG11201706200U A SG 11201706200UA SG 11201706200U A SG11201706200U A SG 11201706200UA
- Authority
- SG
- Singapore
- Prior art keywords
- fall
- chamber
- semiconductor devices
- cleaning semiconductor
- proof
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
- G08B21/18—Status alarms
- G08B21/182—Level alarms, e.g. alarms responsive to variables exceeding a threshold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/14—Measuring arrangements characterised by the use of mechanical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510081989.8A CN105983552B (en) | 2015-02-15 | 2015-02-15 | Anti-falling semiconductor cleaning device |
PCT/CN2015/089096 WO2016127635A1 (en) | 2015-02-15 | 2015-09-08 | A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201706200UA true SG11201706200UA (en) | 2017-08-30 |
Family
ID=56615285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201706200UA SG11201706200UA (en) | 2015-02-15 | 2015-09-08 | A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US10770315B2 (en) |
JP (1) | JP6591555B2 (en) |
KR (1) | KR102382343B1 (en) |
CN (2) | CN105983552B (en) |
SG (1) | SG11201706200UA (en) |
WO (1) | WO2016127635A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109158236B (en) * | 2018-08-20 | 2023-11-07 | 华电电力科学研究院有限公司 | High-pressure spray head for cleaning gas turbine and gas compressor of thermal power plant and cleaning method |
JP7437499B2 (en) * | 2019-11-01 | 2024-02-22 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | Substrate cleaning method and cleaning device |
CN117299666A (en) * | 2022-06-23 | 2023-12-29 | 盛美半导体设备(上海)股份有限公司 | Substrate processing apparatus |
Family Cites Families (36)
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US4064885A (en) * | 1976-10-26 | 1977-12-27 | Branson Ultrasonics Corporation | Apparatus for cleaning workpieces by ultrasonic energy |
US4326553A (en) * | 1980-08-28 | 1982-04-27 | Rca Corporation | Megasonic jet cleaner apparatus |
US5368054A (en) * | 1993-12-17 | 1994-11-29 | International Business Machines Corporation | Ultrasonic jet semiconductor wafer cleaning apparatus |
US5745946A (en) * | 1994-07-15 | 1998-05-05 | Ontrak Systems, Inc. | Substrate processing system |
US5950643A (en) * | 1995-09-06 | 1999-09-14 | Miyazaki; Takeshiro | Wafer processing system |
US5980647A (en) * | 1997-07-15 | 1999-11-09 | International Business Machines Corporation | Metal removal cleaning process and apparatus |
US6260562B1 (en) * | 1997-10-20 | 2001-07-17 | Dainippon Screen Mfg. Co., Ltd. | Substrate cleaning apparatus and method |
JP3333733B2 (en) * | 1998-02-20 | 2002-10-15 | 東京エレクトロン株式会社 | Cleaning equipment |
JP2001044467A (en) * | 1999-07-29 | 2001-02-16 | Kanegafuchi Chem Ind Co Ltd | System for cleaning integrated thin film solar cell |
US6495463B2 (en) * | 1999-09-28 | 2002-12-17 | Strasbaugh | Method for chemical mechanical polishing |
US6539952B2 (en) * | 2000-04-25 | 2003-04-01 | Solid State Equipment Corp. | Megasonic treatment apparatus |
JP2001334221A (en) * | 2000-05-26 | 2001-12-04 | Dainippon Screen Mfg Co Ltd | Substrate cleaning apparatus |
US6730176B2 (en) * | 2001-07-09 | 2004-05-04 | Birol Kuyel | Single wafer megasonic cleaner method, system, and apparatus |
US6848455B1 (en) * | 2002-04-22 | 2005-02-01 | Novellus Systems, Inc. | Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species |
US7185661B2 (en) * | 2002-05-06 | 2007-03-06 | Akrion Technologies, Inc. | Reciprocating megasonic probe |
JP2003340386A (en) * | 2002-05-23 | 2003-12-02 | Toshiba Corp | Ultrasonic cleaning apparatus and method therefor |
CN103605262B (en) * | 2004-06-09 | 2016-06-29 | 株式会社尼康 | Exposure device and maintaining method thereof and manufacturing method |
US20070175502A1 (en) * | 2004-07-30 | 2007-08-02 | I.P. Foundry, Inc. | Apparatus and method for delivering acoustic energy through a liquid stream to a target object for disruptive surface cleaning or treating effects |
JP4959721B2 (en) * | 2006-01-20 | 2012-06-27 | アクリオン テクノロジーズ インク | Acoustic energy system, method and apparatus for processing flat objects |
JP5132108B2 (en) * | 2006-02-02 | 2013-01-30 | 株式会社Sokudo | Substrate processing equipment |
JP2007290111A (en) * | 2006-03-29 | 2007-11-08 | Ebara Corp | Polishing method and polishing device |
JP4700570B2 (en) * | 2006-07-14 | 2011-06-15 | 株式会社新川 | Bonding apparatus, bonding tool tip cleaning method and program |
KR100800174B1 (en) * | 2006-10-20 | 2008-02-01 | 한국기계연구원 | Wafer cleaning module using megasonic |
US8052797B2 (en) * | 2006-10-24 | 2011-11-08 | Asahi Glass Company, Limited | Method for removing foreign matter from substrate surface |
US8327861B2 (en) * | 2006-12-19 | 2012-12-11 | Lam Research Corporation | Megasonic precision cleaning of semiconductor process equipment components and parts |
TWI421933B (en) * | 2007-05-16 | 2014-01-01 | Lam Res Corp | Apparatus and method for ultrasonic wet treatment of plate-like articles |
US7913561B2 (en) * | 2008-02-05 | 2011-03-29 | Olympus Medical Systems Corp. | Ultrasonic wave vibrating apparatus |
KR100964871B1 (en) * | 2008-07-07 | 2010-06-23 | 세메스 주식회사 | Pad conditioning unit and single type substrate polishing apparatus using the same |
KR20120018296A (en) * | 2009-03-31 | 2012-03-02 | 에이씨엠 리서치 (상하이) 인코포레이티드 | Methods and apparatus for cleaning semiconductor wafers |
EP2270838B1 (en) * | 2009-07-02 | 2019-06-12 | IMEC vzw | Method and apparatus for controlling optimal operation of acoustic cleaning |
US9044794B2 (en) * | 2009-12-31 | 2015-06-02 | Lam Research Ag | Ultrasonic cleaning fluid, method and apparatus |
US9721754B2 (en) * | 2011-04-26 | 2017-08-01 | Carl Zeiss Smt Gmbh | Method and apparatus for processing a substrate with a focused particle beam |
CN202290654U (en) * | 2011-10-10 | 2012-07-04 | 北京七星华创电子股份有限公司 | Mega sonic cleaning head and mega sonic cleaning system comprising same |
US9385020B2 (en) * | 2011-12-19 | 2016-07-05 | SCREEN Holdings Co., Ltd. | Substrate holding and rotating device, substrate treatment apparatus including the device, and substrate treatment method |
US9821348B2 (en) * | 2013-10-22 | 2017-11-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for water edge exposure and backside cleaning |
JP6386769B2 (en) * | 2014-04-16 | 2018-09-05 | 株式会社荏原製作所 | Substrate drying apparatus, control program, and substrate drying method |
-
2015
- 2015-02-15 CN CN201510081989.8A patent/CN105983552B/en active Active
- 2015-09-08 WO PCT/CN2015/089096 patent/WO2016127635A1/en active Application Filing
- 2015-09-08 CN CN201580075716.0A patent/CN107210208B/en active Active
- 2015-09-08 SG SG11201706200UA patent/SG11201706200UA/en unknown
- 2015-09-08 JP JP2017542071A patent/JP6591555B2/en active Active
- 2015-09-08 US US15/550,971 patent/US10770315B2/en active Active
- 2015-09-08 KR KR1020177023766A patent/KR102382343B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN105983552A (en) | 2016-10-05 |
JP6591555B2 (en) | 2019-10-16 |
CN107210208B (en) | 2020-05-19 |
WO2016127635A1 (en) | 2016-08-18 |
US20180033654A1 (en) | 2018-02-01 |
KR20170113595A (en) | 2017-10-12 |
CN105983552B (en) | 2019-12-24 |
CN107210208A (en) | 2017-09-26 |
JP2018506858A (en) | 2018-03-08 |
KR102382343B1 (en) | 2022-04-04 |
US10770315B2 (en) | 2020-09-08 |
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