CN105983552A - 一种防掉落的半导体清洗装置 - Google Patents

一种防掉落的半导体清洗装置 Download PDF

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CN105983552A
CN105983552A CN201510081989.8A CN201510081989A CN105983552A CN 105983552 A CN105983552 A CN 105983552A CN 201510081989 A CN201510081989 A CN 201510081989A CN 105983552 A CN105983552 A CN 105983552A
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cleaning apparatus
semiconductor cleaning
displacement detector
wave generator
detector
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CN105983552B (zh
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吴均
程成
王晖
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ACM (SHANGHAI) Inc
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Priority to JP2017542071A priority patent/JP6591555B2/ja
Priority to PCT/CN2015/089096 priority patent/WO2016127635A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
    • G08B21/18—Status alarms
    • G08B21/182—Level alarms, e.g. alarms responsive to variables exceeding a threshold
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
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    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
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    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
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    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
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Abstract

本发明涉及半导体生产和制造领域，更具体地说，涉及到一种防掉落的半导体清洗装置。该防掉落的半导体清洗装置包括：固定模组和喷头，以及声波发生器和位移探测器，其中，声波发生器与喷头搭配运作，该位移探测器包括固定端和测量端，其中位移探测器的固定端被固定在所述固定模组上，位移探测器的测量端为可伸缩的，声波发生器压紧位移探测器的测量端且与固定模组固定，该位移探测器感应测量端的伸缩量以检测所述声波发生器是否松动。采用本发明提供的半导体清洗装置，能够防止其中的声波发生装置掉落，从而避免了晶圆被砸碎的情况发生。

Description

一种防掉落的半导体清洗装置
技术领域
本发明涉及半导体生产和制造领域，更具体地说，涉及一种防掉落的半导体清洗装置。
背景技术
随着科技的发展，半导体行业的清洗技术也日臻成熟。与传统的机械清洗不同的，半导体生产和加工设备的市场中出现了一大批采用更高新科技成果的清洗机台和清洗装置，其中的翘楚，当推超声波或兆声波清洗机台。
超声波或兆声波清洗机台的核心装置是设置在机台上的声波发生器，为了达到理想的清洗效果，声波清洗机台所采用的声波发生器通常以兆声波发生器居多。兆声波发生器搭配喷头共同运作，在高频振动效应以及清洗液的化学反应的作用下，清洗液分子随声波的推动高速且连续的冲击半导体晶圆的表面，使晶圆表面附着的微小的污染物颗粒被强制去除并进入清洗液。
作为半导体清洗装置的组件之一，兆声波发生器的体积和重量都比较大，且通常会与一固定模组相固定，在清洗液中来回运动。在清洗过程中，兆声波发生器基本都位于晶圆的上方，正对晶圆发射兆声波。在长期的使用过程中，如果兆声波发生器与固定模组连接的不牢，或发生松动，兆声波发生器很有可能在工艺进行时发生掉落，砸碎位于兆声波发生器下方的待清洗晶圆。而兆声波发生器在清洗过程中持续的运动，更增加了这一风险。一片晶圆价值数千美金，工艺优良的晶圆甚至可达上万美金，如果类似的掉落事件不加以控制和预防，将会对半导体生产厂商造成较大损失。
发明内容
本发明针对上述技术问题，给出了可行的解决方案，该方案主要涉及一种防掉落的半导体清洗装置。为了防范于未然，本发明提供了一种半导体清洗装置，能够在兆声波发生器掉落之前就对该情况有所预知，并及时的提醒操作人员停止清洗工艺，以便对松动的兆声波发生器进行加固。
为实现上述目的，本发明提供了如下技术方案：
一种防掉落的半导体清洗装置，包括固定模组和喷头，所述半导体清洗装置还包括声波发生器和位移探测器，所述声波发生器与所述喷头搭配运作，所述位移探测器包括固定端和测量端，所述位移探测器的固定端被固定在所述固定模组上，所述位移探测器的测量端为可伸缩的，所述声波发生器压紧所述位移探测器的测量端且与所述固定模组固定，所述位移探测器感应所述测量端的伸缩量以检测所述声波发生器是否松动。
进一步地，所述声波发生器与所述固定模组通过螺丝/螺母固定。
优选地，所述位移探测器被所述声波发生器压紧时所述测量端的伸缩量为零。
进一步地，所述位移探测器的精确度为0.01mm或更高。
优选地，所述声波发生器是兆声波发生器。
优选地，所述位移探测器的固定端抵住所述固定模组并与之固定。
优选地，所述半导体清洗装置上设置有警报器，所述警报器与所述位移探测器相连。
优选地，与所述位移探测器的测量端被压紧的状态相比，所述位移探测器感应到的所述测量端的伸缩量超过所述测量端被压紧的状态时的伸缩量一预设阈值时，所述位移探测器触发所述警报器。
进一步地，所述喷头喷射时所述声波发生器相应的发射声波。
进一步地，所述半导体清洗装置与一摆臂相连，所述摆臂带动所述半导体清洗装置移动。
本发明提供的半导体清洗装置，能够在长期使用的过程中监测到兆声波发生器的松动情况，当松动达到预设的条件下自动地提醒操作人员，对兆声波发生器进行加固，从而避免了意外的掉落事件发生，保护晶圆在清洗过程中不会被砸碎。
附图说明
图1是本发明半导体清洗装置的立体图。
图2是本发明半导体清洗装置去除掉固定模组后的立体图。
图3是本发明半导体清洗装置的另一立体图。
图4是本发明半导体清洗装置去除掉声波发生器后的立体图。
图5是本发明半导体清洗装置的位移探测器的示意图。
图6是本发明半导体清洗装置的声波发生器的示意图。
具体实施方式
公众及技术人员可以参考本发明申请的附图，并结合具体实施例对本方案进行理解，并期待众位在本发明申请为基础专利的态势下浮现出相应更多的衍生专利，以造福社会，进一步促进社会生产力向前发展。
图1-图6是本发明具体实施例的示意图。
图1和图3是本发明半导体清洗装置的立体图，两幅视图分别从斜上方向和斜下方向两个角度展示了该半导体清洗装置的结构特征。从图中可以看到，本实施例中的半导体清洗装置包括固定模组101和喷头102。固定模组101的顶部设置有警报器104，固定模组101的底部设置有兆声波发生器106，该兆声波发生器106大致呈扇形。喷头102设置在固定模组101的一端并位于兆声波发生器106的前面。
如果将固定模组101去除，如图2所示，由此可以看到该半导体清洗装置的内部结构。该半导体清洗装置具有一个位移探测器105，位移探测器105设置在固定模组101和兆声波发生器106之间并与警报器104相连。半导体清洗装置与一摆臂103固定连接，在晶圆清洗过程中，半导体清洗装置随摆臂103在晶圆上方移动。
由于传统的清洗装置要么采用机械式的清洗方式，要么虽然采用了声波发生器的结构，但却没有设置防掉落的部件，所以均存在一定的缺陷。而本发明的半导体清洗装置，由于安装了位移探测器105，能够及时的预知可能发生的掉落危险，从而起到了很好的保护晶圆的作用。位移探测器105设置在该半导体清洗装置的内部、固定模组101和兆声波发生器106之间，位置关系如图4所示。而如图5所示的，该位移探测器105具有两个端，分别为上方的固定端107和下方的测量端108，其中的测量端108为一个可伸缩的接触式探头。
其具体工作原理在于，固定端107被固定，通常情况下抵住固定模组101并与固定模组101固定为一体，以限制位移探测器105自身发生位移影响测量结果；而下方的测量端108则被兆声波发生器106抵住并压紧，通常情况下，将处于压紧状态下的位移探测器105的读数设定为0，以方便控制和读数，此时测量端108的伸缩量即为0。兆声波发生器106与固定模组101固定在一起，作为一种可选且简单可靠的方式，通常会采取螺丝/螺母固定的方式将二者螺接在一起。由于兆声波发生器106在清洗过程中长期浸泡在清洗液中，并时常在清洗液中移动，随着时间的推移，个别螺丝或螺母会发生松动，并有可能最终脱落而导致兆声波发生器106掉落并砸毁晶圆。而如果采用本发明的设计，由于兆声波发生器106和固定模组101紧密的固定在一起，并共同压紧位移探测器105，所以当松动情况发生时，位移探测器105的测量端108会产生一定的伸缩量并被位移探测器105所探测感应，从而能够提早的预警和防范兆声波发生器106的掉落。这种位移探测器105的灵敏度非常之高，通常能够达到0.01mm的精确度，即即使兆声波发生器106松动而导致位移探测器105的测量端108仅产生了0.01mm的伸缩，也能够被位移探测器105准确的探测和度量，从而保证了预警效果。根据实际的使用情况，发现一般将预警的临界值设置为伸缩量超过压紧状态下的伸缩量0.10mm采取措施对兆声波发生器106进行紧固较为合理，能够确保兆声波发生器106不会发生掉落。即如果压紧状态下位移探测器105的读数为0，而经过一段时间的使用之后，位移探测器105的读数上升至0.10mm及以上时，说明测量端108产生的伸缩量已经比较大了，兆声波发生器106存在掉落的风险，此时位移探测器105即可发出信号传递至警报器104报警，以提醒操作人员对兆声波发生器106加以紧固。
当然的，虽然本实施例中警报器104设置在该半导体清洗装置上，而实际上该警报器104也可以设置在整个清洗机台的其他位置，具体视方便而定。另外，可以发现的是，本实施例的声波发生器虽以兆声波发生器106为例，但如果换做其他类型的声波发生器，也并不影响整个半导体清洗装置的防掉落功能的实现。
选用兆声波发生器106是以为兆声波相较于其他频率的声波具有更好的清洗效果，图6是本发明具体实施例中兆声波发生器106的结构示意图，在清洗过程中，兆声波发生器106通常与喷头102一起配合，同时使用。
以上实施例旨在示例性的说明本发明的原理及功效，并非用于限制本发明的技术方案，本领域及相关领域的从业技术人员可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变，但仍然归属于本发明的发明构思之内。

Claims (10)

1.一种防掉落的半导体清洗装置，包括固定模组和喷头，其特征在于，所述半导体清洗装置还包括声波发生器和位移探测器，所述声波发生器与所述喷头搭配运作，所述位移探测器包括固定端和测量端，所述位移探测器的固定端被固定在所述固定模组上，所述位移探测器的测量端为可伸缩的，所述声波发生器压紧所述位移探测器的测量端且与所述固定模组固定，所述位移探测器感应所述测量端的伸缩量以检测所述声波发生器是否松动。
2.根据权利要求1所述的防掉落的半导体清洗装置，其特征在于，所述声波发生器与所述固定模组通过螺丝/螺母固定。
3.根据权利要求1所述的防掉落的半导体清洗装置，其特征在于，所述位移探测器被所述声波发生器压紧时所述测量端的伸缩量为零。
4.根据权利要求1所述的防掉落的半导体清洗装置，其特征在于，所述位移探测器的精确度为0.01mm或更高。
5.根据权利要求1所述的防掉落的半导体清洗装置，其特征在于，所述声波发生器是兆声波发生器。
6.根据权利要求1所述的防掉落的半导体清洗装置，其特征在于，所述位移探测器的固定端抵住所述固定模组并与之固定。
7.根据权利要求1所述的防掉落的半导体清洗装置，其特征在于，所述半导体清洗装置上设置有警报器，所述警报器与所述位移探测器相连。
8.根据权利要求7所述的防掉落的半导体清洗装置，其特征在于，与所述位移探测器的测量端被压紧的状态相比，所述位移探测器感应到的所述测量端的伸缩量超过所述测量端被压紧的状态时的伸缩量一预设阈值时，所述位移探测器触发所述警报器。
9.根据权利要求1所述的防掉落的半导体清洗装置，其特征在于，所述喷头喷射时所述声波发生器相应的发射声波。
10.根据权利要求1所述的防掉落的半导体清洗装置，其特征在于，所述半导体清洗装置与一摆臂相连，所述摆臂带动所述半导体清洗装置移动。
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US15/550,971 US10770315B2 (en) 2015-02-15 2015-09-08 Fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus
JP2017542071A JP6591555B2 (ja) 2015-02-15 2015-09-08 落下防止機能を有する半導体デバイス洗浄装置、および、その装置を備えるチャンバ
SG11201706200UA SG11201706200UA (en) 2015-02-15 2015-09-08 A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus
PCT/CN2015/089096 WO2016127635A1 (en) 2015-02-15 2015-09-08 A fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus
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