SG11201705286VA - Silicon wafer edge protection device - Google Patents

Silicon wafer edge protection device

Info

Publication number
SG11201705286VA
SG11201705286VA SG11201705286VA SG11201705286VA SG11201705286VA SG 11201705286V A SG11201705286V A SG 11201705286VA SG 11201705286V A SG11201705286V A SG 11201705286VA SG 11201705286V A SG11201705286V A SG 11201705286VA SG 11201705286V A SG11201705286V A SG 11201705286VA
Authority
SG
Singapore
Prior art keywords
protection device
silicon wafer
wafer edge
edge protection
silicon
Prior art date
Application number
SG11201705286VA
Other languages
English (en)
Inventor
Xu Zhou
Haicang Cui
Fei Ni
Lili Ge
Original Assignee
Shanghai Micro Electronics Equipment (Group) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment (Group) Co Ltd filed Critical Shanghai Micro Electronics Equipment (Group) Co Ltd
Publication of SG11201705286VA publication Critical patent/SG11201705286VA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Vibration Prevention Devices (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG11201705286VA 2014-12-30 2015-12-27 Silicon wafer edge protection device SG11201705286VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410857409.5A CN105807575B (zh) 2014-12-30 2014-12-30 一种硅片边缘保护装置
PCT/CN2015/099084 WO2016107507A1 (zh) 2014-12-30 2015-12-27 一种硅片边缘保护装置

Publications (1)

Publication Number Publication Date
SG11201705286VA true SG11201705286VA (en) 2017-07-28

Family

ID=56284262

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201705286VA SG11201705286VA (en) 2014-12-30 2015-12-27 Silicon wafer edge protection device

Country Status (6)

Country Link
US (1) US9964864B2 (zh)
JP (1) JP6371911B2 (zh)
CN (1) CN105807575B (zh)
SG (1) SG11201705286VA (zh)
TW (1) TWI569358B (zh)
WO (1) WO2016107507A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107219728B (zh) * 2017-07-31 2020-09-29 中国振华集团永光电子有限公司（国营第八七三厂） 一种防止硅片翘片的光刻方法
CN110609448B (zh) * 2018-06-14 2020-12-01 上海微电子装备（集团）股份有限公司 一种硅片边缘保护装置
DE102019213914A1 (de) * 2019-09-12 2021-03-18 Carl Zeiss Smt Gmbh Vorrichtung zur Reinigung einer Oberfläche im Inneren eines optischen Systems
JP7045353B2 (ja) * 2019-10-02 2022-03-31 株式会社アルバック 基板搬送装置、および、基板搬送方法
CN112859531B (zh) * 2019-11-28 2022-06-03 上海微电子装备（集团）股份有限公司 交接力测量装置及方法、光刻机
CN112530843B (zh) * 2020-11-30 2022-11-04 四川立泰电子有限公司 大功率管三极管自动剪脚设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3554186B2 (ja) * 1998-04-08 2004-08-18 キヤノン株式会社 露光装置、デバイス製造方法および反力受け方法
TWI223734B (en) * 1999-12-21 2004-11-11 Asml Netherlands Bv Crash prevention in positioning apparatus for use in lithographic projection apparatus
US6440219B1 (en) * 2000-06-07 2002-08-27 Simplus Systems Corporation Replaceable shielding apparatus
JP2003109999A (ja) * 2001-09-28 2003-04-11 Hitachi Kokusai Electric Inc 基板処理装置
US6680774B1 (en) * 2001-10-09 2004-01-20 Ultratech Stepper, Inc. Method and apparatus for mechanically masking a workpiece
EP1477852A1 (en) * 2003-05-16 2004-11-17 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7310132B2 (en) * 2006-03-17 2007-12-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2009239018A (ja) * 2008-03-27 2009-10-15 Orc Mfg Co Ltd 投影露光装置
CN101487990B (zh) * 2009-02-27 2011-04-13 上海微电子装备有限公司 带边缘曝光保护的工件台
CN102012639B (zh) * 2009-09-04 2013-09-11 上海微电子装备有限公司 一种硅片边缘保护方法与装置
CN102141735B (zh) * 2010-01-28 2012-12-12 上海微电子装备有限公司 硅片边缘保护装置及其应用方法
CN103098171B (zh) * 2010-09-13 2016-01-20 株式会社Orc制作所 投影曝光装置
CN103293862B (zh) * 2012-02-22 2015-04-15 上海微电子装备有限公司 硅片边缘保护装置
CN103901733B (zh) 2012-12-28 2017-02-22 上海微电子装备有限公司 曝光装置
CN203774252U (zh) 2013-12-12 2014-08-13 上海华虹宏力半导体制造有限公司 应用于激光退火机器的边缘保护装置

Also Published As

Publication number Publication date
US9964864B2 (en) 2018-05-08
JP2018501519A (ja) 2018-01-18
CN105807575B (zh) 2017-08-25
JP6371911B2 (ja) 2018-08-08
WO2016107507A1 (zh) 2016-07-07
US20170357162A1 (en) 2017-12-14
TW201624603A (zh) 2016-07-01
TWI569358B (zh) 2017-02-01
CN105807575A (zh) 2016-07-27

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