SG11201703882RA - Uv curable cmp polishing pad and method of manufacture - Google Patents

Uv curable cmp polishing pad and method of manufacture

Info

Publication number
SG11201703882RA
SG11201703882RA SG11201703882RA SG11201703882RA SG11201703882RA SG 11201703882R A SG11201703882R A SG 11201703882RA SG 11201703882R A SG11201703882R A SG 11201703882RA SG 11201703882R A SG11201703882R A SG 11201703882RA SG 11201703882R A SG11201703882R A SG 11201703882RA
Authority
SG
Singapore
Prior art keywords
curable
manufacture
polishing pad
cmp polishing
cmp
Prior art date
Application number
SG11201703882RA
Other languages
English (en)
Inventor
Mahendra Christopher Orilall
Rajeev Bajaj
Fred C Redeker
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201703882RA publication Critical patent/SG11201703882RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polymerisation Methods In General (AREA)
SG11201703882RA 2014-12-18 2015-11-19 Uv curable cmp polishing pad and method of manufacture SG11201703882RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/575,608 US10086500B2 (en) 2014-12-18 2014-12-18 Method of manufacturing a UV curable CMP polishing pad
PCT/US2015/061647 WO2016099791A1 (en) 2014-12-18 2015-11-19 Uv curable cmp polishing pad and method of manufacture

Publications (1)

Publication Number Publication Date
SG11201703882RA true SG11201703882RA (en) 2017-07-28

Family

ID=56127289

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703882RA SG11201703882RA (en) 2014-12-18 2015-11-19 Uv curable cmp polishing pad and method of manufacture

Country Status (7)

Country Link
US (2) US10086500B2 (zh)
JP (1) JP6676640B2 (zh)
KR (1) KR102438955B1 (zh)
CN (1) CN107000170B (zh)
SG (1) SG11201703882RA (zh)
TW (1) TWI675869B (zh)
WO (1) WO2016099791A1 (zh)

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Publication number Priority date Publication date Assignee Title
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN108290267B (zh) 2015-10-30 2021-04-20 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10456886B2 (en) 2016-01-19 2019-10-29 Applied Materials, Inc. Porous chemical mechanical polishing pads
US11002530B2 (en) 2016-09-20 2021-05-11 Applied Materials, Inc. Tiltable platform for additive manufacturing of a polishing pad
KR101857435B1 (ko) * 2016-12-15 2018-05-15 한국생산기술연구원 다공성 구조체를 가진 정반 및 그것의 제작방법
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
WO2021034849A1 (en) * 2019-08-21 2021-02-25 Applied Materials, Inc. Additive manufacturing of polishing pads
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
KR102636521B1 (ko) * 2020-07-16 2024-02-15 한국생산기술연구원 다공성 돌출 패턴을 포함하는 화학-기계적 연마 패드 및 그 제조 방법
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN115319649B (zh) * 2022-09-03 2023-08-04 深圳市永霖科技有限公司 一种用于玻璃抛光pu抛光砂纸及其制备方法

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US5378251A (en) * 1991-02-06 1995-01-03 Minnesota Mining And Manufacturing Company Abrasive articles and methods of making and using same
CA2113318A1 (en) 1993-01-28 1994-07-29 Robert J. Jantschek Abrasive attachment system for rotative abrading applications
ZA9410384B (en) * 1994-04-08 1996-02-01 Ultimate Abrasive Syst Inc Method for making powder preform and abrasive articles made therefrom
JP2002057130A (ja) * 2000-08-14 2002-02-22 Three M Innovative Properties Co Ｃｍｐ用研磨パッド
KR100394572B1 (ko) 2000-12-28 2003-08-14 삼성전자주식회사 복합특성을 가지는 씨엠피 패드구조와 그 제조방법
US6863774B2 (en) 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
JP2004259728A (ja) * 2003-02-24 2004-09-16 Toray Ind Inc 研磨パッド
JP3769581B1 (ja) 2005-05-18 2006-04-26 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
US7261625B2 (en) * 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
TWI410314B (zh) 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
US7494519B2 (en) * 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US7169031B1 (en) 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article
JP2007067143A (ja) * 2005-08-31 2007-03-15 Asahi Kasei Electronics Co Ltd 研磨パッド用感光性樹脂組成物
CN101966697B (zh) * 2006-04-19 2015-04-22 东洋橡胶工业株式会社 抛光垫的制造方法
US20080146129A1 (en) * 2006-12-08 2008-06-19 Makoto Kouzuma Fast break-in polishing pad and a method of making the same
CN101284952B (zh) * 2007-04-12 2011-03-23 北京有色金属研究总院 化学机械抛光磨料粒子CeO2及其制备方法
JP5242427B2 (ja) 2009-01-20 2013-07-24 東洋ゴム工業株式会社 研磨パッド及びその製造方法
SG181890A1 (en) * 2009-12-22 2012-07-30 3M Innovative Properties Co Polishing pad and method of making the same
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
EP2757577A4 (en) * 2011-09-16 2015-05-20 Toray Industries POLISHING CUSHION
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Also Published As

Publication number Publication date
KR20170096113A (ko) 2017-08-23
US10086500B2 (en) 2018-10-02
US20190009388A1 (en) 2019-01-10
KR102438955B1 (ko) 2022-09-02
CN107000170B (zh) 2021-09-24
JP6676640B2 (ja) 2020-04-08
TW201629128A (zh) 2016-08-16
JP2018502452A (ja) 2018-01-25
WO2016099791A1 (en) 2016-06-23
TWI675869B (zh) 2019-11-01
US20160176021A1 (en) 2016-06-23
CN107000170A (zh) 2017-08-01

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