SG11201703882RA - Uv curable cmp polishing pad and method of manufacture - Google Patents

Uv curable cmp polishing pad and method of manufacture

Info

Publication number
SG11201703882RA
SG11201703882RA SG11201703882RA SG11201703882RA SG11201703882RA SG 11201703882R A SG11201703882R A SG 11201703882RA SG 11201703882R A SG11201703882R A SG 11201703882RA SG 11201703882R A SG11201703882R A SG 11201703882RA SG 11201703882R A SG11201703882R A SG 11201703882RA
Authority
SG
Singapore
Prior art keywords
curable
manufacture
polishing pad
cmp polishing
cmp
Prior art date
Application number
SG11201703882RA
Inventor
Mahendra Christopher Orilall
Rajeev Bajaj
Fred C Redeker
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201703882RA publication Critical patent/SG11201703882RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polymerisation Methods In General (AREA)
SG11201703882RA 2014-12-18 2015-11-19 Uv curable cmp polishing pad and method of manufacture SG11201703882RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/575,608 US10086500B2 (en) 2014-12-18 2014-12-18 Method of manufacturing a UV curable CMP polishing pad
PCT/US2015/061647 WO2016099791A1 (en) 2014-12-18 2015-11-19 Uv curable cmp polishing pad and method of manufacture

Publications (1)

Publication Number Publication Date
SG11201703882RA true SG11201703882RA (en) 2017-07-28

Family

ID=56127289

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703882RA SG11201703882RA (en) 2014-12-18 2015-11-19 Uv curable cmp polishing pad and method of manufacture

Country Status (7)

Country Link
US (2) US10086500B2 (en)
JP (1) JP6676640B2 (en)
KR (1) KR102438955B1 (en)
CN (1) CN107000170B (en)
SG (1) SG11201703882RA (en)
TW (1) TWI675869B (en)
WO (1) WO2016099791A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR102630261B1 (en) 2014-10-17 2024-01-29 어플라이드 머티어리얼스, 인코포레이티드 Cmp pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
JP6940495B2 (en) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Equipment and methods for forming abrasive articles with the desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN113146464A (en) 2016-01-19 2021-07-23 应用材料公司 Porous chemical mechanical polishing pad
US11137243B2 (en) 2016-09-20 2021-10-05 Applied Materials, Inc. Two step curing of polishing pad material in additive manufacturing
KR101857435B1 (en) * 2016-12-15 2018-05-15 한국생산기술연구원 Surface plate having porous structure and method for manufacturing the same
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
CN114502324B (en) * 2019-08-21 2024-05-03 应用材料公司 Additive manufacturing of polishing pads
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
KR102636521B1 (en) * 2020-07-16 2024-02-15 한국생산기술연구원 Chemical-mechanical polishing pad including porous protruding pattern and method for preparing the same
KR102570825B1 (en) * 2020-07-16 2023-08-28 한국생산기술연구원 Polishing pad including porous protruding pattern and polishing apparatus including the same
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN115319649B (en) * 2022-09-03 2023-08-04 深圳市永霖科技有限公司 PU polishing sand paper for glass polishing and preparation method thereof

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US5378251A (en) * 1991-02-06 1995-01-03 Minnesota Mining And Manufacturing Company Abrasive articles and methods of making and using same
CA2113318A1 (en) 1993-01-28 1994-07-29 Robert J. Jantschek Abrasive attachment system for rotative abrading applications
ZA9410384B (en) * 1994-04-08 1996-02-01 Ultimate Abrasive Syst Inc Method for making powder preform and abrasive articles made therefrom
JP2002057130A (en) * 2000-08-14 2002-02-22 Three M Innovative Properties Co Polishing pad for cmp
KR100394572B1 (en) 2000-12-28 2003-08-14 삼성전자주식회사 multi characterized CMP pad structure and method for fabricating same
US6863774B2 (en) 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
JP2004259728A (en) * 2003-02-24 2004-09-16 Toray Ind Inc Polishing pad
JP3769581B1 (en) 2005-05-18 2006-04-26 東洋ゴム工業株式会社 Polishing pad and manufacturing method thereof
US7261625B2 (en) * 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
TWI410314B (en) 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 Apparatus for forming a porous reaction injection molded chemical mechanical polishing pad
US7169031B1 (en) 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article
US7494519B2 (en) * 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
JP2007067143A (en) * 2005-08-31 2007-03-15 Asahi Kasei Electronics Co Ltd Photosensitive resin composition for polishing pad
CN101966697B (en) * 2006-04-19 2015-04-22 东洋橡胶工业株式会社 Manufacturing method of polishing pad
US20080146129A1 (en) * 2006-12-08 2008-06-19 Makoto Kouzuma Fast break-in polishing pad and a method of making the same
CN101284952B (en) * 2007-04-12 2011-03-23 北京有色金属研究总院 Abrasive grain CeO2 for chemical and mechanical buffing and method for preparing same
JP5242427B2 (en) 2009-01-20 2013-07-24 東洋ゴム工業株式会社 Polishing pad and manufacturing method thereof
WO2011087737A2 (en) * 2009-12-22 2011-07-21 3M Innovative Properties Company Polishing pad and method of making the same
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
JPWO2013039203A1 (en) * 2011-09-16 2015-03-26 東レ株式会社 Polishing pad
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Also Published As

Publication number Publication date
US20160176021A1 (en) 2016-06-23
US10086500B2 (en) 2018-10-02
TW201629128A (en) 2016-08-16
JP2018502452A (en) 2018-01-25
KR20170096113A (en) 2017-08-23
WO2016099791A1 (en) 2016-06-23
KR102438955B1 (en) 2022-09-02
TWI675869B (en) 2019-11-01
US20190009388A1 (en) 2019-01-10
JP6676640B2 (en) 2020-04-08
CN107000170A (en) 2017-08-01
CN107000170B (en) 2021-09-24

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