SG11201610849XA - Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board - Google Patents
Resin composition, prepreg, metallic foil-clad laminate, and printed wiring boardInfo
- Publication number
- SG11201610849XA SG11201610849XA SG11201610849XA SG11201610849XA SG11201610849XA SG 11201610849X A SG11201610849X A SG 11201610849XA SG 11201610849X A SG11201610849X A SG 11201610849XA SG 11201610849X A SG11201610849X A SG 11201610849XA SG 11201610849X A SG11201610849X A SG 11201610849XA
- Authority
- SG
- Singapore
- Prior art keywords
- prepreg
- resin composition
- wiring board
- printed wiring
- clad laminate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2463/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0266—Size distribution
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014147700 | 2014-07-18 | ||
PCT/JP2015/070147 WO2016010033A1 (fr) | 2014-07-18 | 2015-07-14 | Composition de résine, préimprégné, stratifié revêtu d'une feuille métallique, et carte à câblage imprimé |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201610849XA true SG11201610849XA (en) | 2017-02-27 |
Family
ID=55078523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201610849XA SG11201610849XA (en) | 2014-07-18 | 2015-07-14 | Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board |
Country Status (8)
Country | Link |
---|---|
US (1) | US11161979B2 (fr) |
EP (1) | EP3170868B1 (fr) |
JP (1) | JP5991445B2 (fr) |
KR (1) | KR102238207B1 (fr) |
CN (1) | CN106536635B (fr) |
SG (1) | SG11201610849XA (fr) |
TW (1) | TWI654227B (fr) |
WO (1) | WO2016010033A1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018124158A1 (fr) * | 2016-12-28 | 2018-07-05 | 三菱瓦斯化学株式会社 | Préimprégné, carte stratifiée, carte stratifiée plaquée de feuille métallique, carte de circuit imprimé, et carte de circuit imprimé multicouche |
JP2018131541A (ja) * | 2017-02-15 | 2018-08-23 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板 |
TWI678393B (zh) * | 2017-09-07 | 2019-12-01 | 台燿科技股份有限公司 | 樹脂組成物、以及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
JP2019099710A (ja) * | 2017-12-05 | 2019-06-24 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール |
EP3744788B1 (fr) * | 2017-12-29 | 2024-01-10 | Shengyi Technology Co., Ltd | Composition de résine, préimprégné, stratifié et stratifié revêtu d'une feuille métallique |
JP7076263B2 (ja) * | 2018-03-30 | 2022-05-27 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 |
EP3862390B1 (fr) * | 2018-10-02 | 2024-03-20 | Namics Corporation | Composition de résine, film fixé à un substrat, corps stratifié métal/résine et dispositif semi-conducteur |
JP2020169291A (ja) * | 2019-04-05 | 2020-10-15 | 信越化学工業株式会社 | スラリー組成物、該スラリー組成物の硬化物、該硬化物を用いた基板、フィルム、及びプリプレグ |
EP4026865B1 (fr) * | 2019-09-06 | 2023-08-09 | Panasonic Intellectual Property Management Co., Ltd. | Composition de résine, préimprégné, film revêtu de résine, feuille métallique revêtue de résine, feuille stratifiée plaquée de métal, et carte de circuit imprimé |
JPWO2021079900A1 (fr) * | 2019-10-25 | 2021-04-29 | ||
WO2021192680A1 (fr) * | 2020-03-25 | 2021-09-30 | 三菱瓦斯化学株式会社 | Composition de résine, préimprégné, feuille de résine, carte stratifiée, carte stratifiée plaquée de feuille métallique et carte de circuit imprimé |
WO2021246231A1 (fr) * | 2020-06-01 | 2021-12-09 | 三菱瓦斯化学株式会社 | Hydrate de molybdate de zinc d'ammonium pour matériau électronique, composition de résine pour matériau électronique, préimprégné, feuille de résine, carte stratifiée, carte stratifiée revêtue d'une feuille métallique, et carte de circuit imprimé |
US20230017960A1 (en) * | 2021-07-09 | 2023-01-19 | Canon Kabushiki Kaisha | Inkjet recording head and method for producing same |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0460548A3 (en) * | 1990-06-08 | 1993-03-24 | Amp-Akzo Corporation | Printed circuits and base materials precatalyzed for etal deposition |
JP4083257B2 (ja) * | 1997-03-19 | 2008-04-30 | 株式会社ジーシー | 歯科充填用レジン組成物 |
US6387604B2 (en) * | 1998-01-28 | 2002-05-14 | Konica Corporation | Processing method of thermally developable photosensitive material |
JP2001348488A (ja) | 2000-06-06 | 2001-12-18 | Matsushita Electric Works Ltd | 熱伝導性樹脂組成物、プリプレグ、放熱性回路基板及び放熱性発熱部品 |
JP3848919B2 (ja) * | 2000-09-21 | 2006-11-22 | ローム アンド ハース カンパニー | 疎水的に変性された粘土ポリマーナノ複合材 |
US20030134212A1 (en) * | 2001-12-26 | 2003-07-17 | Eastman Kodak Company | Element with antistat layer |
JP2003213019A (ja) | 2002-01-24 | 2003-07-30 | Sumitomo Bakelite Co Ltd | プリプレグ及びそれを用いたプリント配線板 |
JP2006008843A (ja) * | 2004-06-25 | 2006-01-12 | Nippon Chem Ind Co Ltd | 非晶質アルミノシリケート粒子、絶縁性向上剤組成物及び絶縁性樹脂組成物 |
FR2877948B1 (fr) * | 2004-11-12 | 2007-01-05 | Arkema Sa | Procede de synthese de poudres de polyamide |
TWI324168B (en) * | 2006-03-17 | 2010-05-01 | Chang Chun Plastics Co Ltd | Flame retarding thermoset epoxy resin composition |
CN101054460A (zh) * | 2006-04-14 | 2007-10-17 | 长春人造树脂厂股份有限公司 | 阻燃热固环氧树脂组合物 |
TWI342323B (en) | 2007-01-22 | 2011-05-21 | Chang Chun Plastics Co Ltd | Thermoset resin modified polyimide resin composition |
CN101220160B (zh) * | 2007-12-07 | 2012-03-14 | 广东生益科技股份有限公司 | 一种应用于印制电路多层板的半固化片 |
CN101368077B (zh) | 2008-10-09 | 2011-11-30 | 腾辉电子(苏州)有限公司 | 一种环氧树脂胶液 |
JP5849948B2 (ja) * | 2010-06-02 | 2016-02-03 | 三菱瓦斯化学株式会社 | 樹脂組成物およびこれを用いたプリプレグ及び積層板 |
EP2666821A4 (fr) * | 2011-01-20 | 2017-07-12 | Mitsubishi Gas Chemical Company, Inc. | Composition de résine, préimprégné et stratifié |
KR101901473B1 (ko) * | 2011-05-13 | 2018-09-21 | 다우 글로벌 테크놀로지스 엘엘씨 | 절연 배합물 |
CN103917596A (zh) * | 2011-11-07 | 2014-07-09 | 三菱瓦斯化学株式会社 | 树脂组合物、使用了其的预浸料和层压板 |
JP6332036B2 (ja) | 2012-11-28 | 2018-05-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板、金属箔張積層板、及びプリント配線板 |
JP2014167053A (ja) | 2013-02-28 | 2014-09-11 | 3M Innovative Properties Co | 高熱伝導性プリプレグ、プリプレグを用いた配線板および多層配線板、ならびに多層配線板を用いた半導体装置 |
ES2662019T3 (es) | 2013-10-15 | 2018-04-05 | Lanxess Deutschland Gmbh | Masas de moldeo termoplásticas |
-
2015
- 2015-07-14 EP EP15821543.4A patent/EP3170868B1/fr active Active
- 2015-07-14 WO PCT/JP2015/070147 patent/WO2016010033A1/fr active Application Filing
- 2015-07-14 US US15/322,929 patent/US11161979B2/en active Active
- 2015-07-14 SG SG11201610849XA patent/SG11201610849XA/en unknown
- 2015-07-14 CN CN201580039316.4A patent/CN106536635B/zh active Active
- 2015-07-14 JP JP2015555321A patent/JP5991445B2/ja active Active
- 2015-07-14 KR KR1020167036968A patent/KR102238207B1/ko active IP Right Grant
- 2015-07-17 TW TW104123169A patent/TWI654227B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP3170868A4 (fr) | 2018-04-04 |
US20170145213A1 (en) | 2017-05-25 |
EP3170868B1 (fr) | 2019-04-24 |
KR20170032243A (ko) | 2017-03-22 |
WO2016010033A1 (fr) | 2016-01-21 |
CN106536635B (zh) | 2020-02-28 |
CN106536635A (zh) | 2017-03-22 |
EP3170868A1 (fr) | 2017-05-24 |
TWI654227B (zh) | 2019-03-21 |
KR102238207B1 (ko) | 2021-04-08 |
JP5991445B2 (ja) | 2016-09-14 |
US11161979B2 (en) | 2021-11-02 |
JPWO2016010033A1 (ja) | 2017-04-27 |
TW201609901A (zh) | 2016-03-16 |
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