SG11201609249XA - Bonding apparatus and bonding method - Google Patents

Bonding apparatus and bonding method

Info

Publication number
SG11201609249XA
SG11201609249XA SG11201609249XA SG11201609249XA SG11201609249XA SG 11201609249X A SG11201609249X A SG 11201609249XA SG 11201609249X A SG11201609249X A SG 11201609249XA SG 11201609249X A SG11201609249X A SG 11201609249XA SG 11201609249X A SG11201609249X A SG 11201609249XA
Authority
SG
Singapore
Prior art keywords
bonding
bonding method
bonding apparatus
Prior art date
Application number
SG11201609249XA
Other languages
English (en)
Inventor
Shigeru Hayata
Rei Ando
Yasushi Sato
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201609249XA publication Critical patent/SG11201609249XA/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75702—Means for aligning in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8113—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/81132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8313—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/83132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Microscoopes, Condenser (AREA)
SG11201609249XA 2014-05-07 2015-04-28 Bonding apparatus and bonding method SG11201609249XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014096338 2014-05-07
PCT/JP2015/062813 WO2015170645A1 (ja) 2014-05-07 2015-04-28 ボンディング装置およびボンディング方法

Publications (1)

Publication Number Publication Date
SG11201609249XA true SG11201609249XA (en) 2016-12-29

Family

ID=54392497

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201609249XA SG11201609249XA (en) 2014-05-07 2015-04-28 Bonding apparatus and bonding method

Country Status (7)

Country Link
US (1) US20170148759A1 (ko)
JP (1) JP6286726B2 (ko)
KR (1) KR101897088B1 (ko)
CN (1) CN106663636B (ko)
SG (1) SG11201609249XA (ko)
TW (1) TWI545663B (ko)
WO (1) WO2015170645A1 (ko)

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TWI580511B (zh) * 2014-06-10 2017-05-01 Shinkawa Kk A bonding device, and a method of estimating the placement position of the engagement tool
KR102056656B1 (ko) 2016-01-28 2019-12-17 야마하하쓰도키 가부시키가이샤 다이 픽업 장치
US10882298B2 (en) * 2016-11-07 2021-01-05 Asm Technology Singapore Pte Ltd System for adjusting relative positions between components of a bonding apparatus
CN108986167B (zh) * 2017-06-05 2022-01-11 梭特科技股份有限公司 置晶设备的校正方法及使用该方法的置晶设备
TWI684235B (zh) 2017-07-12 2020-02-01 日商新川股份有限公司 相對於第二物體來定位第一物體的裝置和方法
WO2019044819A1 (ja) * 2017-08-28 2019-03-07 株式会社新川 対象物に対して移動体を直線移動させる装置および方法
JP7033878B2 (ja) * 2017-10-16 2022-03-11 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
TWI697656B (zh) * 2017-12-20 2020-07-01 日商新川股份有限公司 線形狀檢查裝置以及線形狀檢查方法
TWI716925B (zh) * 2018-07-06 2021-01-21 日商新川股份有限公司 半導體晶粒的拾取系統
KR102134069B1 (ko) * 2018-07-17 2020-07-14 주식회사 에프에스티 웨이퍼 정렬 장치, 웨이퍼 정렬 방법 및 웨이퍼 정렬 장치의 보정 방법
JP6644115B2 (ja) * 2018-07-23 2020-02-12 アスリートＦａ株式会社 実装装置及び実装方法
JP6968762B2 (ja) * 2018-07-23 2021-11-17 Ｔｏｗａ株式会社 搬送機構、電子部品製造装置、搬送方法および電子部品の製造方法
JP7022340B2 (ja) * 2018-08-01 2022-02-18 日本電気硝子株式会社 カメラのキャリブレーション方法、キャリブレーション装置及びキャリブレーション用ターゲット
TWI744849B (zh) * 2019-04-15 2021-11-01 日商新川股份有限公司 接合裝置以及接合頭的移動量補正方法
CN110246771B (zh) * 2019-06-18 2021-06-15 武汉新芯集成电路制造有限公司 一种晶圆键合的设备及方法
KR102545300B1 (ko) 2019-06-24 2023-06-16 삼성전자주식회사 콜렛 장치 및 이를 이용한 반도체 장치의 제조 방법
US10861819B1 (en) * 2019-07-05 2020-12-08 Asm Technology Singapore Pte Ltd High-precision bond head positioning method and apparatus
CN112447555B (zh) * 2019-08-29 2024-05-14 芝浦机械电子装置株式会社 电子零件的安装装置
JP7291586B2 (ja) * 2019-09-19 2023-06-15 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
US11776930B2 (en) * 2019-12-16 2023-10-03 Asmpt Singapore Pte. Ltd. Die bond head apparatus with die holder motion table
TWI775198B (zh) * 2019-12-17 2022-08-21 日商新川股份有限公司 半導體裝置的製造裝置以及半導體裝置的製造方法
US11552031B2 (en) 2020-03-13 2023-01-10 Asmpt Singapore Pte. Ltd. High precision bonding apparatus comprising heater
CN111370353B (zh) * 2020-03-26 2023-05-05 长江存储科技有限责任公司 晶圆键合设备及晶圆键合设备运行状态的检测方法
JP2022052009A (ja) * 2020-09-23 2022-04-04 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP2022071993A (ja) * 2020-10-29 2022-05-17 アスリートＦａ株式会社 電子部品接合装置
CN112945092B (zh) * 2021-01-27 2023-03-28 深圳市卓兴半导体科技有限公司 一种多工位设备的模板定位方法及系统
JP2022124134A (ja) * 2021-02-15 2022-08-25 株式会社ディスコ 被加工物の加工方法
KR102580842B1 (ko) * 2022-10-31 2023-09-20 제너셈(주) 프레스의 이동량 결정 방법

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Also Published As

Publication number Publication date
CN106663636B (zh) 2019-05-14
WO2015170645A1 (ja) 2015-11-12
JPWO2015170645A1 (ja) 2017-04-20
KR20160147045A (ko) 2016-12-21
TW201606881A (zh) 2016-02-16
CN106663636A (zh) 2017-05-10
TWI545663B (zh) 2016-08-11
US20170148759A1 (en) 2017-05-25
KR101897088B1 (ko) 2018-09-10
JP6286726B2 (ja) 2018-03-07

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