SG11201606935VA - System and method for bi-facial processing of substrates - Google Patents

System and method for bi-facial processing of substrates

Info

Publication number
SG11201606935VA
SG11201606935VA SG11201606935VA SG11201606935VA SG11201606935VA SG 11201606935V A SG11201606935V A SG 11201606935VA SG 11201606935V A SG11201606935V A SG 11201606935VA SG 11201606935V A SG11201606935V A SG 11201606935VA SG 11201606935V A SG11201606935V A SG 11201606935VA
Authority
SG
Singapore
Prior art keywords
substrates
facial processing
facial
processing
Prior art date
Application number
SG11201606935VA
Other languages
English (en)
Inventor
Terry Bluck
Vinay Shah
Ian Latchford
Alexandru Riposan
Original Assignee
Intevac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Publication of SG11201606935VA publication Critical patent/SG11201606935VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
SG11201606935VA 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates SG11201606935VA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461942594P 2014-02-20 2014-02-20
US201461943999P 2014-02-24 2014-02-24
PCT/US2015/016799 WO2015127191A1 (fr) 2014-02-20 2015-02-20 Système et procédé pour le traitement bifacial de substrats

Publications (1)

Publication Number Publication Date
SG11201606935VA true SG11201606935VA (en) 2016-10-28

Family

ID=53879007

Family Applications (3)

Application Number Title Priority Date Filing Date
SG11201606935VA SG11201606935VA (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates
SG10201807710WA SG10201807710WA (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates
SG10201807691XA SG10201807691XA (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates

Family Applications After (2)

Application Number Title Priority Date Filing Date
SG10201807710WA SG10201807710WA (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates
SG10201807691XA SG10201807691XA (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates

Country Status (8)

Country Link
EP (1) EP3108030B1 (fr)
JP (1) JP6522667B2 (fr)
KR (1) KR102327286B1 (fr)
CN (1) CN106460164B (fr)
MY (1) MY181905A (fr)
SG (3) SG11201606935VA (fr)
TW (1) TWI696231B (fr)
WO (1) WO2015127191A1 (fr)

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EP2839052A4 (fr) 2012-04-19 2015-06-10 Intevac Inc Agencement à double masque pour fabrication de cellule solaire
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
EP2852469B1 (fr) 2012-04-26 2019-04-24 Intevac, Inc. Architecture de système de traitement sous vide
US9543114B2 (en) 2014-08-05 2017-01-10 Intevac, Inc. Implant masking and alignment system with rollers
MY190638A (en) * 2015-10-01 2022-04-29 Intevac Inc Wafer plate and mask arrangement for substrate fabrication
KR20190088493A (ko) * 2016-11-18 2019-07-26 어플라이드 머티어리얼스, 인코포레이티드 헤테로접합 태양 전지 형성을 위한 교환 및 플립 챔버 설계
WO2018113671A1 (fr) * 2016-12-19 2018-06-28 P2I Ltd Gabarit pour processus de modification de surface
DE102017106373A1 (de) * 2017-03-24 2018-09-27 Nexwafe Gmbh Prozesskammerführung, Prozesskammer und Verfahren zum Führen eines Substratträgers in eine Prozessposition
CN107245755B (zh) * 2017-04-21 2019-05-21 深圳技术大学 适用于多样品同步实验的光辅助电化学刻蚀装置
KR102006435B1 (ko) * 2017-09-01 2019-08-01 주식회사 한화 보트 장치
TWI679506B (zh) * 2018-09-14 2019-12-11 富揚鋼構有限公司 鋼構建材之翻轉加工規劃方法
CN108315697B (zh) * 2018-01-16 2019-12-10 电子科技大学 一种双面双轴织构MgO薄膜的制备方法
KR101962738B1 (ko) * 2018-04-23 2019-03-27 (주)에이디엠 시트분리장치 및 이를 구비한 마스크 제조 시스템
WO2019205351A1 (fr) * 2018-04-24 2019-10-31 君泰创新（北京）科技有限公司 Appareil de revêtement double face et unité de traitement de plaque de support associée
CN108766916A (zh) * 2018-04-28 2018-11-06 东莞帕萨电子装备有限公司 离子注入跑片装置及离子注入跑片方法
WO2019228611A1 (fr) * 2018-05-29 2019-12-05 Applied Materials, Inc. Procédés de manipulation de masques dans un système sous vide, et système sous vide
KR102549429B1 (ko) * 2018-05-31 2023-06-28 어플라이드 머티어리얼스, 인코포레이티드 디지털 리소그래피 시스템들 상에서의 다중-기판 프로세싱
CN110600412A (zh) * 2018-06-12 2019-12-20 君泰创新（北京）科技有限公司 定位传输机构及定位传输生产系统
US11414748B2 (en) * 2019-09-25 2022-08-16 Intevac, Inc. System with dual-motion substrate carriers
TWI693871B (zh) * 2019-01-29 2020-05-11 友威科技股份有限公司 立式連續蝕刻機
US20220181194A1 (en) 2019-03-27 2022-06-09 Yaskawa Europe Technology Ltd. Semiconductor flipper
KR20210081794A (ko) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 회전 구동 장치, 이를 포함하는 성막 시스템, 전자 디바이스 제조방법, 및 성막 시스템에 사용되는 피반송체 캐리어
KR102593602B1 (ko) * 2021-01-06 2023-10-23 한화솔루션 주식회사 웨이퍼 보트 및 웨이퍼 보트용 플레이트
CN112631087B (zh) * 2021-01-25 2022-04-22 苏州源卓光电科技有限公司 一种双面加工系统及加工方法
CN114005775A (zh) * 2021-10-29 2022-02-01 德鸿半导体设备(浙江)有限公司 基片的处理系统及方法
CN114750057B (zh) * 2022-06-13 2022-09-02 富芯微电子有限公司 一种复合快恢复二极管生产用的背面减薄设备及工艺

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EP2852469B1 (fr) * 2012-04-26 2019-04-24 Intevac, Inc. Architecture de système de traitement sous vide
KR20150048089A (ko) * 2012-04-26 2015-05-06 인테벡, 인코포레이티드 물리 기상 증착 처리용 협소 소스

Also Published As

Publication number Publication date
EP3108030B1 (fr) 2018-09-12
JP2017512386A (ja) 2017-05-18
KR102327286B1 (ko) 2021-11-16
CN106460164B (zh) 2019-02-22
TWI696231B (zh) 2020-06-11
KR20160137989A (ko) 2016-12-02
SG10201807691XA (en) 2018-10-30
WO2015127191A1 (fr) 2015-08-27
CN106460164A (zh) 2017-02-22
JP6522667B2 (ja) 2019-05-29
EP3108030A1 (fr) 2016-12-28
MY181905A (en) 2021-01-13
EP3108030A4 (fr) 2017-08-23
TW201541546A (zh) 2015-11-01
SG10201807710WA (en) 2018-10-30

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