JP2017512386A - 基板両面処理システム及び方法 - Google Patents
基板両面処理システム及び方法 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 389
- 238000012545 processing Methods 0.000 title claims abstract description 129
- 238000000034 method Methods 0.000 title claims description 51
- 238000011068 loading method Methods 0.000 claims abstract description 36
- 238000012546 transfer Methods 0.000 claims abstract description 31
- 239000000969 carrier Substances 0.000 claims description 42
- 230000005291 magnetic effect Effects 0.000 claims description 26
- 239000000696 magnetic material Substances 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims 1
- 230000005298 paramagnetic effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 91
- 230000008569 process Effects 0.000 description 45
- 230000007246 mechanism Effects 0.000 description 31
- 239000000872 buffer Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 239000011521 glass Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 230000032258 transport Effects 0.000 description 11
- 238000000151 deposition Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 9
- 238000013461 design Methods 0.000 description 9
- 230000033001 locomotion Effects 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000009977 dual effect Effects 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 230000007717 exclusion Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 230000036961 partial effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- KPLQYGBQNPPQGA-UHFFFAOYSA-N cobalt samarium Chemical compound [Co].[Sm] KPLQYGBQNPPQGA-UHFFFAOYSA-N 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 1
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005513 bias potential Methods 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002907 paramagnetic material Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000005654 stationary process Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Abstract
Description
図11は、図8の実施形態に対応する単一ウエハサセプタ1105の実施形態を示す。ウエハは、その周縁で凹部1132に載置されている。破線で示すマグネット1134は、ウエハの全周でキャリア内に設けられる。位置合わせピン1160は外マスクをサセプタ1105に位置合わせするために用いられる。外マスクの実施形態は、下側からの視点で図12に示される。外マスク1245は、プレス加工されたシート金属で製造される。外マスク1245は、キャリア1205の位置合わせピン1260に対応する位置合わせ孔又は凹部1262を有する。外マスク1245は、サセプタを被覆して保護するように配置される。
Claims (24)
- 真空処理チャンバで基板を処理するためのシステムであって、
複数のキャリアと、複数の磁化ローラと、フリッピングステーションとを含み、
前記キャリアのそれぞれは、前記システム全体にわたって基板を支持して移送するように構成され、
前記キャリアのそれぞれは、各基板の両面を露出させながら基板を保持するためのクリップを含み、
前記キャリアのそれぞれは、その両端における2つの常磁性コモンレールを含み、
前記複数の磁化ローラは、前記コモンレールを係合して磁気的に保持することにより、前記キャリアを前記システム全体にわたって移送し、
前記フリッピングステーションは、回転軸に連結される回転可能なフレームを含み、前記複数の磁化ローラのサブセットは、前記フレームの両端に配置される、システム。 - 前記キャリアのそれぞれは、1×n(ここで、nは1より大きい整数である)基板の線形アレイを支持するように構成される、請求項1に記載のシステム。
- 前記キャリアのそれぞれは、異なるサイズの様々な基板を保持するように構成される2つのスライドレールをさらに含む、請求項1に記載のシステム。
- 前記スライドレールは、閉鎖位置においてバネで付勢される、請求項3に記載のシステム。
- 前記キャリアは、前記真空処理チャンバ内において垂直方向に移送される、請求項1に記載のシステム。
- 処理完了後に、前記キャリアをロードステーションに戻すためのコンベアをさらに含む、請求項1に記載のシステム。
- 前記コンベアは、大気環境において前記真空処理チャンバの上方を通過する、請求項6に記載のシステム。
- 前記複数の磁化ローラのそれぞれは回転シャフトを含み、前記回転シャフトは、交互の磁気極性でその回転シャフトに取り付けられた複数の磁気ホイールを有する、請求項1に記載のシステム。
- 前記回転シャフトのそれぞれは、可撓性テンションエレメントによって回転する、請求項8に記載のシステム。
- 前記可撓性テンションエレメントは、ベルト又はチェーンを含む、請求項9に記載のシステム。
- ロード/アンロードステーションと連結するキャリアエレベータをさらに含む、請求項1に記載のシステム。
- 前記キャリアエレベータは、複数の垂直配向コンベアベルトを含み、各コンベアベルトは、前記コモンレールに係合するように延びている複数のピンを有する、請求項11に記載のシステム。
- 前記ロード/アンロードステーションは、転入基板コンベアと、送出基板コンベアと、基板ロードリフターと、基板アンロードリフターと、前記キャリアがその基板を取り外すように作動されるように構成されるキャリアクチュエータとを含む、請求項11に記載のシステム。
- 前記キャリアにマスクをロードするためのマスクロード器具をさらに含む、請求項13に記載のシステム。
- 前記ロード/アンロードステーションは、上部キャリア移送部と、前記上部キャリア移送部の下方において垂直方向に離間する下部キャリア移送部とを含み、前記転入基板コンベア及び前記送出基板コンベアは、前記上部キャリア移送部と前記下部キャリア移送部との間に垂直に位置するスペースを通過する、請求項13に記載のシステム。
- 前記ロード/アンロードステーションは、前記キャリアにロードされた基板を位置合わせするように構成される伸縮自在な基板位置合わせピンをさらに含む、請求項11に記載のシステム。
- 異なるサイズ及び異なる種類の基板とともに使用され得る汎用キャリアであって、
前記汎用キャリアの両端に1つずつ設けられ、移送器具と係合するための2つの走行レールと、
前記走行レールの端部にそれぞれ接続された2つの細長いサイドバーと、
前記サイドバーに設けられ、基板の表面に接触することなく基板を保持するために基板のエッジと係合するように構成される複数の保持クリップと、
各前記走行レールに設けられ、それぞれスライド操作を利用して対応するサイドバーを開閉するように構成される2つのアクチュエータと、
所望のスライド位置において対応するサイドバーをロックするように、アクチュエータに設けられるロッキング器具とを含む、汎用キャリア。 - 前記サイドバーに設けられる複数の支持クリップをさらに含む、請求項17に記載の汎用キャリア。
- 前記アクチュエータは、磁性材料からなるキャリアクランプを含む、請求項17に記載の汎用キャリア。
- 前記アクチュエータは、溝付き面を有するクランプバーをさらに含み、前記クランプバーは、所望の位置においてクランプをロックするように、前記キャリアクランプの底部における溝付き面と係合する、請求項19に記載の汎用キャリア。
- 前記アクチュエータは、前記キャリアクランプをクランプバーと接触させるように押し付けるように構成されるバネをさらに含む、請求項20に記載の汎用キャリア。
- 前記アクチュエータは、リニアレールに載置されるためのリニアベアリングを有するスライドブロックを含む、請求項21に記載の汎用キャリア。
- 前記アクチュエータは、リニアレールに載置されるためのリニアベアリングを有するスライドブロックを含む、請求項17に記載の汎用キャリア。
- キャリアに基板をロードするための方法であって、
空キャリアをローディング位置に移動させることと、
キャリアクランプを電磁石と係合し、前記電磁石を通電することにより、前記キャリアクランプをクランプバーから上昇させることと、
摺動電磁石を通電し、キャリアのサイドレールが開かれるようにリニアスライドを摺動させることと、
基板をキャリアサイドレールの間にロードすることと、
摺動電磁石を作動し、バネクリップが基板のエッジでその基板を保持するように、一定の距離を移動することによってキャリアサイドレールを閉じることと、
電磁石に対する通電を停止することにより、キャリアサイドレールを選ばれた基板サイズに必要な距離で強固に保持するように、キャリアクランプをクランプバーに係合することとを含む、方法。
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US61/943,999 | 2014-02-24 | ||
PCT/US2015/016799 WO2015127191A1 (en) | 2014-02-20 | 2015-02-20 | System and method for bi-facial processing of substrates |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190025419A (ko) * | 2017-09-01 | 2019-03-11 | 주식회사 한화 | 보트 장치 |
JP2021526237A (ja) * | 2018-05-31 | 2021-09-30 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | デジタルリソグラフィシステムでのマルチ基板処理 |
WO2022149840A1 (ko) * | 2021-01-06 | 2022-07-14 | 한화솔루션 주식회사 | 웨이퍼 보트 및 웨이퍼 보트용 플레이트 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9525099B2 (en) | 2012-04-19 | 2016-12-20 | Intevac, Inc. | Dual-mask arrangement for solar cell fabrication |
US9502276B2 (en) | 2012-04-26 | 2016-11-22 | Intevac, Inc. | System architecture for vacuum processing |
US10062600B2 (en) | 2012-04-26 | 2018-08-28 | Intevac, Inc. | System and method for bi-facial processing of substrates |
CN106688088B (zh) | 2014-08-05 | 2020-01-10 | 因特瓦克公司 | 注入掩膜及对齐 |
KR102447219B1 (ko) * | 2015-10-01 | 2022-09-23 | 인테벡, 인코포레이티드 | 기판 제조를 위한 웨이퍼 플레이트 및 마스크 배열 |
KR20190088493A (ko) * | 2016-11-18 | 2019-07-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 헤테로접합 태양 전지 형성을 위한 교환 및 플립 챔버 설계 |
CN211805637U (zh) * | 2016-12-19 | 2020-10-30 | P2I有限公司 | 用于表面改性工艺的夹具及包含夹具的组件 |
DE102017106373A1 (de) * | 2017-03-24 | 2018-09-27 | Nexwafe Gmbh | Prozesskammerführung, Prozesskammer und Verfahren zum Führen eines Substratträgers in eine Prozessposition |
CN107245755B (zh) * | 2017-04-21 | 2019-05-21 | 深圳技术大学 | 适用于多样品同步实验的光辅助电化学刻蚀装置 |
TWI679506B (zh) * | 2018-09-14 | 2019-12-11 | 富揚鋼構有限公司 | 鋼構建材之翻轉加工規劃方法 |
CN108315697B (zh) * | 2018-01-16 | 2019-12-10 | 电子科技大学 | 一种双面双轴织构MgO薄膜的制备方法 |
KR101962738B1 (ko) * | 2018-04-23 | 2019-03-27 | (주)에이디엠 | 시트분리장치 및 이를 구비한 마스크 제조 시스템 |
WO2019205351A1 (zh) * | 2018-04-24 | 2019-10-31 | 君泰创新(北京)科技有限公司 | 双面镀膜设备及其载板处理单元 |
CN108766916A (zh) * | 2018-04-28 | 2018-11-06 | 东莞帕萨电子装备有限公司 | 离子注入跑片装置及离子注入跑片方法 |
WO2019228611A1 (en) * | 2018-05-29 | 2019-12-05 | Applied Materials, Inc. | Methods of handling masks in a vacuum system, and vacuum system |
CN110600412A (zh) * | 2018-06-12 | 2019-12-20 | 君泰创新(北京)科技有限公司 | 定位传输机构及定位传输生产系统 |
US11414748B2 (en) * | 2019-09-25 | 2022-08-16 | Intevac, Inc. | System with dual-motion substrate carriers |
TWI693871B (zh) * | 2019-01-29 | 2020-05-11 | 友威科技股份有限公司 | 立式連續蝕刻機 |
JP2022524886A (ja) | 2019-03-27 | 2022-05-10 | ヤスカワ ユーロップ テクノロジー リミテッド | 半導体反転装置 |
KR20210081794A (ko) * | 2019-12-24 | 2021-07-02 | 캐논 톡키 가부시키가이샤 | 회전 구동 장치, 이를 포함하는 성막 시스템, 전자 디바이스 제조방법, 및 성막 시스템에 사용되는 피반송체 캐리어 |
CN112631087B (zh) * | 2021-01-25 | 2022-04-22 | 苏州源卓光电科技有限公司 | 一种双面加工系统及加工方法 |
CN114005775A (zh) * | 2021-10-29 | 2022-02-01 | 德鸿半导体设备(浙江)有限公司 | 基片的处理系统及方法 |
CN114750057B (zh) * | 2022-06-13 | 2022-09-02 | 富芯微电子有限公司 | 一种复合快恢复二极管生产用的背面减薄设备及工艺 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011243955A (ja) * | 2010-03-30 | 2011-12-01 | Sumitomo Chemical Co Ltd | 基板搬送機構および偏光フィルムの貼合装置における搬送手段を備えた基板支持装置 |
WO2013163622A1 (en) * | 2012-04-26 | 2013-10-31 | Intevac, Inc. | System architecture for vacuum processing |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3775644A (en) * | 1972-09-20 | 1973-11-27 | Communications Satellite Corp | Adjustable microstrip substrate holder |
WO1994001354A1 (en) * | 1992-07-07 | 1994-01-20 | Ebara Corporation | Magnetically levitated carrying apparatus |
JP3732250B2 (ja) * | 1995-03-30 | 2006-01-05 | キヤノンアネルバ株式会社 | インライン式成膜装置 |
US6083566A (en) * | 1998-05-26 | 2000-07-04 | Whitesell; Andrew B. | Substrate handling and processing system and method |
US6753534B2 (en) * | 2000-12-08 | 2004-06-22 | Nikon Corporation | Positioning stage with stationary and movable magnet tracks |
US6783534B2 (en) * | 2002-07-29 | 2004-08-31 | Hamid M. Mehdizadeh | Bone wax applicator |
KR100707390B1 (ko) * | 2005-12-19 | 2007-04-13 | 주식회사 아바코 | 기판 이송장치 |
US20090194026A1 (en) * | 2008-01-31 | 2009-08-06 | Burrows Brian H | Processing system for fabricating compound nitride semiconductor devices |
NL2001910C (en) * | 2008-08-22 | 2010-03-10 | Otb Solar Bv | Conveyor assembly and method for conveying a substrate. |
JP5582895B2 (ja) * | 2010-07-09 | 2014-09-03 | キヤノンアネルバ株式会社 | 基板ホルダーストッカ装置及び基板処理装置並びに該基板ホルダーストッカ装置を用いた基板ホルダー移動方法 |
TW201327712A (zh) * | 2011-11-01 | 2013-07-01 | Intevac Inc | 以電漿處理太陽能電池晶圓之系統架構 |
WO2013101851A1 (en) * | 2011-12-27 | 2013-07-04 | Intevac, Inc. | System architecture for combined static and pass-by processing |
TW201346050A (zh) * | 2012-02-06 | 2013-11-16 | Tokyo Electron Ltd | 成膜裝置及成膜方法 |
US9525099B2 (en) * | 2012-04-19 | 2016-12-20 | Intevac, Inc. | Dual-mask arrangement for solar cell fabrication |
TWI515320B (zh) * | 2012-04-26 | 2016-01-01 | 因特瓦克公司 | 供物理氣相沈積製程使用之窄型濺鍍源 |
-
2015
- 2015-02-20 SG SG10201807691XA patent/SG10201807691XA/en unknown
- 2015-02-20 CN CN201580018902.0A patent/CN106460164B/zh not_active Expired - Fee Related
- 2015-02-20 SG SG11201606935VA patent/SG11201606935VA/en unknown
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- 2015-02-20 KR KR1020167024317A patent/KR102327286B1/ko active IP Right Grant
- 2015-02-20 MY MYPI2016703040A patent/MY181905A/en unknown
- 2015-02-20 WO PCT/US2015/016799 patent/WO2015127191A1/en active Application Filing
- 2015-02-20 EP EP15751417.5A patent/EP3108030B1/en not_active Not-in-force
- 2015-02-20 SG SG10201807710WA patent/SG10201807710WA/en unknown
- 2015-02-24 TW TW104105775A patent/TWI696231B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011243955A (ja) * | 2010-03-30 | 2011-12-01 | Sumitomo Chemical Co Ltd | 基板搬送機構および偏光フィルムの貼合装置における搬送手段を備えた基板支持装置 |
WO2013163622A1 (en) * | 2012-04-26 | 2013-10-31 | Intevac, Inc. | System architecture for vacuum processing |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190025419A (ko) * | 2017-09-01 | 2019-03-11 | 주식회사 한화 | 보트 장치 |
KR102006435B1 (ko) | 2017-09-01 | 2019-08-01 | 주식회사 한화 | 보트 장치 |
JP2021526237A (ja) * | 2018-05-31 | 2021-09-30 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | デジタルリソグラフィシステムでのマルチ基板処理 |
JP7212701B2 (ja) | 2018-05-31 | 2023-01-25 | アプライド マテリアルズ インコーポレイテッド | デジタルリソグラフィシステムでのマルチ基板処理 |
WO2022149840A1 (ko) * | 2021-01-06 | 2022-07-14 | 한화솔루션 주식회사 | 웨이퍼 보트 및 웨이퍼 보트용 플레이트 |
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TWI696231B (zh) | 2020-06-11 |
SG10201807691XA (en) | 2018-10-30 |
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