SG11201606128QA - Conductive adhesive composition - Google Patents
Conductive adhesive compositionInfo
- Publication number
- SG11201606128QA SG11201606128QA SG11201606128QA SG11201606128QA SG11201606128QA SG 11201606128Q A SG11201606128Q A SG 11201606128QA SG 11201606128Q A SG11201606128Q A SG 11201606128QA SG 11201606128Q A SG11201606128Q A SG 11201606128QA SG 11201606128Q A SG11201606128Q A SG 11201606128QA
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive composition
- conductive adhesive
- conductive
- composition
- adhesive
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C09J179/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014175974 | 2014-08-29 | ||
PCT/JP2015/072712 WO2016031552A1 (fr) | 2014-08-29 | 2015-08-10 | Composition adhésive électroconductrice |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201606128QA true SG11201606128QA (en) | 2016-09-29 |
Family
ID=55399449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201606128QA SG11201606128QA (en) | 2014-08-29 | 2015-08-10 | Conductive adhesive composition |
Country Status (10)
Country | Link |
---|---|
US (1) | US10563096B2 (fr) |
EP (1) | EP3187560B1 (fr) |
JP (1) | JP6391597B2 (fr) |
KR (1) | KR101952004B1 (fr) |
CN (2) | CN106574164A (fr) |
MY (1) | MY194517A (fr) |
PH (1) | PH12017500372B1 (fr) |
PT (1) | PT3187560T (fr) |
SG (1) | SG11201606128QA (fr) |
WO (1) | WO2016031552A1 (fr) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6462702B2 (ja) * | 2015-04-16 | 2019-01-30 | 古河電気工業株式会社 | 導電性接着フィルムおよびダイシングダイボンディングフィルム |
KR102618237B1 (ko) * | 2016-01-25 | 2023-12-28 | 세키스이가가쿠 고교가부시키가이샤 | 도전 재료 및 접속 구조체 |
CN109312200B (zh) | 2016-06-27 | 2023-11-17 | 三键有限公司 | 热固化型导电性胶粘剂 |
JP6428716B2 (ja) * | 2016-07-12 | 2018-11-28 | 千住金属工業株式会社 | 導電性接着剤、接合体および継手 |
WO2018013342A1 (fr) * | 2016-07-15 | 2018-01-18 | E. I. Du Pont De Nemours And Company | Adhésifs électroconducteurs |
CN109952356A (zh) * | 2016-11-10 | 2019-06-28 | 京瓷株式会社 | 半导体粘接用树脂组合物、半导体粘接用片以及使用其的半导体装置 |
TWI633639B (zh) * | 2016-11-15 | 2018-08-21 | 致伸科技股份有限公司 | 具有發光功能的指紋辨識模組及其製造方法 |
US20200063008A1 (en) * | 2016-12-09 | 2020-02-27 | Hitachi Chemical Company, Ltd. | Composition, adhesive, sintered body, joined body, and method of producing joined body |
WO2018105125A1 (fr) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | Composition, agent adhésif, corps fritté, et corps lié ainsi que procédé de fabrication de celui-ci |
WO2018105127A1 (fr) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | Corps lié ainsi que procédé de fabrication de celui-ci, composition pour frittage en phase liquide transitoire, et corps fritté |
CN110622258A (zh) * | 2017-06-01 | 2019-12-27 | 积水化学工业株式会社 | 导电材料以及连接结构体 |
EP3638439B1 (fr) * | 2017-06-12 | 2024-01-17 | Ormet Circuits, Inc. | Compositions adhésives métalliques ayant de bonnes durées de fonctionnement et une bonne conductivité thermique, procédés pour les fabriquer et utilisations associées |
JP6660921B2 (ja) * | 2017-09-14 | 2020-03-11 | 株式会社タムラ製作所 | 電子基板の製造方法 |
DE102017216878A1 (de) * | 2017-09-25 | 2019-03-28 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Klebstoffs und einer Klebung, insbesondere in Form einer Kleberschicht innerhalb einer Batteriezelle |
CN108749244B (zh) * | 2018-06-07 | 2020-07-14 | 浙江欣麟新材料技术有限公司 | 一种光学高柔性导电玻璃膜及其制备方法 |
WO2020017048A1 (fr) * | 2018-07-20 | 2020-01-23 | 日立化成株式会社 | Composition, matériau d'assemblage, corps fritté, corps assemblé et procédé de fabrication de ce corps assemblé |
JP7210849B2 (ja) * | 2018-08-14 | 2023-01-24 | 株式会社レゾナック | 接着剤組成物及び半導体装置の製造方法 |
JP7407714B2 (ja) * | 2018-12-04 | 2024-01-04 | 古河電気工業株式会社 | リフロー対応ダイシングテープ |
JP7230554B2 (ja) * | 2019-02-08 | 2023-03-01 | 株式会社レゾナック | 接着剤組成物、接着フィルム、接着シート、並びに半導体装置及びその製造方法 |
JP7354252B2 (ja) * | 2019-07-16 | 2023-10-02 | 古河電気工業株式会社 | 接合フィルム、ウエハ加工用テープ、接合体の製造方法、接合体および貼合体 |
WO2021142748A1 (fr) * | 2020-01-17 | 2021-07-22 | 深圳市首骋新材料科技有限公司 | Adhésif conducteur à base de résine époxyde, son procédé de préparation et son application |
KR102584580B1 (ko) * | 2020-09-09 | 2023-10-05 | 한국전자통신연구원 | 도전 접착제용 조성물, 이의 경화물을 포함하는 반도체 패키지, 및 이를 이용한 반도체 패키지의 제조 방법 |
KR102449786B1 (ko) * | 2021-03-09 | 2022-09-29 | 성균관대학교산학협력단 | 무전해 도금 처리된 pcb 배선의 부식 방지 첨가제 |
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JPH0616524B2 (ja) | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | 半導体ウエハ固定用接着薄板 |
DE3433851C2 (de) | 1984-09-14 | 1987-01-08 | Gurit-Essex Ag, Freienbach | Chemisch härtbare Harze aus 1-Oxa-3-aza-tetralin-Gruppen enthaltenden Verbindungen und cycloaliphatischen Epoxid-harzen, Verfahren zu deren Herstellung sowie Verwendung solcher Harze |
DE58909626D1 (de) | 1988-07-18 | 1996-04-25 | Gurit Essex Ag | Zu schwerentflammbaren und hochtemperaturbeständigen Kunststoffen härtbare Harze und Verfahren zu deren Herstellung |
EP0493310A1 (fr) | 1990-12-21 | 1992-07-01 | Gurit-Essex AG | Résines durcissables ayant des propriétés ignifuges à l'état durci et leur utilisation |
JP3791403B2 (ja) * | 2000-12-04 | 2006-06-28 | 富士電機ホールディングス株式会社 | 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物 |
GB2380964B (en) * | 2001-09-04 | 2005-01-12 | Multicore Solders Ltd | Lead-free solder paste |
JP4412578B2 (ja) * | 2003-05-09 | 2010-02-10 | 富士通株式会社 | 熱伝導性材料およびそれを用いた熱伝導性接合体とその製造方法 |
JP4047304B2 (ja) | 2003-10-22 | 2008-02-13 | 三井金属鉱業株式会社 | 微粒銀粒子付着銀粉及びその微粒銀粒子付着銀粉の製造方法 |
JP4063271B2 (ja) * | 2004-11-30 | 2008-03-19 | 松下電器産業株式会社 | 半田ペーストおよび半田付け方法 |
JP2006199937A (ja) * | 2004-12-15 | 2006-08-03 | Tamura Kaken Co Ltd | 導電性接着剤、これを用いた導電部及び電子部品モジュール |
JPWO2008023452A1 (ja) * | 2006-08-25 | 2010-01-07 | 住友ベークライト株式会社 | 接着テープ、接合体および半導体パッケージ |
KR101056558B1 (ko) * | 2006-08-28 | 2011-08-11 | 가부시키가이샤 무라타 세이사쿠쇼 | 도전성 접합재료 및 전자장치 |
US7422707B2 (en) * | 2007-01-10 | 2008-09-09 | National Starch And Chemical Investment Holding Corporation | Highly conductive composition for wafer coating |
JP2010059387A (ja) * | 2008-08-04 | 2010-03-18 | Hitachi Chem Co Ltd | 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置 |
US7837370B2 (en) | 2008-10-10 | 2010-11-23 | Koninklijke Philips Electronics N.V. | Low profile side emission TIR lens for LED |
KR100977163B1 (ko) * | 2009-03-23 | 2010-08-20 | 덕산하이메탈(주) | 솔더 접착제와 그 제조 방법 및 이를 포함하는 전자 장치 |
JP5485239B2 (ja) | 2010-09-17 | 2014-05-07 | 古河電気工業株式会社 | 銅微粒子の製造方法 |
JP2012102077A (ja) | 2010-10-14 | 2012-05-31 | Sumitomo Chemical Co Ltd | 有害生物防除用組成物及び有害生物防除方法 |
CN103328596A (zh) * | 2011-01-27 | 2013-09-25 | 日立化成株式会社 | 导电性粘接剂组合物、连接体及太阳能电池模块 |
WO2012102077A1 (fr) | 2011-01-27 | 2012-08-02 | 日立化成工業株式会社 | Composition adhésive conductrice, connecteur, et module à cellule solaire |
KR20140012650A (ko) | 2011-02-24 | 2014-02-03 | 데쿠세리아루즈 가부시키가이샤 | 열전도성 접착제 |
US9583453B2 (en) * | 2012-05-30 | 2017-02-28 | Ormet Circuits, Inc. | Semiconductor packaging containing sintering die-attach material |
CN104995231B (zh) * | 2013-02-21 | 2017-02-15 | 株式会社村田制作所 | 固化剂、含有该固化剂的热固性树脂组合物、使用该热固性树脂组合物的接合方法、以及热固性树脂的固化温度的控制方法 |
-
2015
- 2015-08-10 SG SG11201606128QA patent/SG11201606128QA/en unknown
- 2015-08-10 KR KR1020167033471A patent/KR101952004B1/ko active IP Right Grant
- 2015-08-10 EP EP15837005.6A patent/EP3187560B1/fr active Active
- 2015-08-10 CN CN201580045105.1A patent/CN106574164A/zh active Pending
- 2015-08-10 CN CN202110423369.3A patent/CN113214757A/zh active Pending
- 2015-08-10 MY MYPI2016702286A patent/MY194517A/en unknown
- 2015-08-10 JP JP2015557251A patent/JP6391597B2/ja active Active
- 2015-08-10 PT PT158370056T patent/PT3187560T/pt unknown
- 2015-08-10 WO PCT/JP2015/072712 patent/WO2016031552A1/fr active Application Filing
-
2017
- 2017-02-09 US US15/428,384 patent/US10563096B2/en active Active
- 2017-02-28 PH PH12017500372A patent/PH12017500372B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3187560A4 (fr) | 2018-03-07 |
PH12017500372A1 (en) | 2017-07-17 |
EP3187560B1 (fr) | 2024-01-17 |
JP6391597B2 (ja) | 2018-09-19 |
EP3187560A1 (fr) | 2017-07-05 |
CN113214757A (zh) | 2021-08-06 |
MY194517A (en) | 2022-11-30 |
KR20170005431A (ko) | 2017-01-13 |
WO2016031552A1 (fr) | 2016-03-03 |
KR101952004B1 (ko) | 2019-02-25 |
PH12017500372B1 (en) | 2017-07-17 |
PT3187560T (pt) | 2024-04-11 |
JPWO2016031552A1 (ja) | 2017-04-27 |
CN106574164A (zh) | 2017-04-19 |
US10563096B2 (en) | 2020-02-18 |
US20170152410A1 (en) | 2017-06-01 |
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