WO2020017048A1 - Composition, matériau d'assemblage, corps fritté, corps assemblé et procédé de fabrication de ce corps assemblé - Google Patents

Composition, matériau d'assemblage, corps fritté, corps assemblé et procédé de fabrication de ce corps assemblé Download PDF

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Publication number
WO2020017048A1
WO2020017048A1 PCT/JP2018/027382 JP2018027382W WO2020017048A1 WO 2020017048 A1 WO2020017048 A1 WO 2020017048A1 JP 2018027382 W JP2018027382 W JP 2018027382W WO 2020017048 A1 WO2020017048 A1 WO 2020017048A1
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Prior art keywords
composition
component
metal
composition according
resin
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PCT/JP2018/027382
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English (en)
Japanese (ja)
Inventor
貴耶 山本
史貴 上野
雅記 竹内
斉藤　晃一
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日立化成株式会社
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Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to PCT/JP2018/027382 priority Critical patent/WO2020017048A1/fr
Priority to JP2020530873A priority patent/JPWO2020017063A1/ja
Priority to PCT/JP2018/035435 priority patent/WO2020017063A1/fr
Publication of WO2020017048A1 publication Critical patent/WO2020017048A1/fr

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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08L101/00—Compositions of unspecified macromolecular compounds
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Definitions

  • the present invention relates to a composition, a bonding material, a sintered body, a bonded body, and a method for manufacturing a bonded body.
  • Lead-containing alloys solders
  • solders have conventionally been used as means for joining a semiconductor element and a support member when manufacturing a semiconductor device.
  • switching to a lead-free solder that does not contain lead or has a reduced lead content has been promoted in consideration of effects on the environment and living organisms.
  • a bonding material that has excellent low-temperature bonding properties and high-temperature connection reliability (sinters at low temperatures and has a high melting point after sintering), it is referred to as a transitional liquid phase sintered metal adhesive.
  • a joining material has been proposed (for example, see Patent Document 1, Non-Patent Document 1, and Non-Patent Document 2).
  • the sintered body obtained by sintering the transitional liquid phase sinterable metal adhesive reported so far may crack when subjected to a thermal cycle test, further improving the connection reliability at high temperatures. There is room for improvement.
  • One embodiment of the present invention has been made in view of the above-described conventional circumstances, and has a composition capable of forming a sintered body having excellent connection reliability at a high temperature by a transitional liquid phase sintering method, and a composition therefor.
  • An object of the present invention is to provide a bonding material to be contained, a sintered body using the composition, a bonded body, and a method for producing the same.
  • a composition comprising a metal component capable of transitional liquid phase sintering and an organic component, wherein the organic component does not have a peak in the heat generation direction in a range of less than 270 ° C. in differential scanning calorimetry (DSC). object.
  • DSC differential scanning calorimetry
  • the organic component includes a resin component.
  • the resin component includes a thermosetting resin.
  • the resin component has a weight average molecular weight of 300 or more.
  • ⁇ 5> The composition according to any one of ⁇ 2> to ⁇ 4>, wherein the resin component has a functional group equivalent of 150 or more.
  • ⁇ 6> The composition according to any one of ⁇ 1> to ⁇ 5>, wherein the metal component includes metal particles A having a melting point higher than 300 ° C and metal particles B having a melting point of 300 ° C or lower.
  • ⁇ 7> The composition according to ⁇ 6>, wherein the metal particles A include Cu.
  • ⁇ 8> The composition according to ⁇ 6> or ⁇ 7>, wherein the metal particles B include Sn.
  • ⁇ 10> A sintered body of the composition according to any one of ⁇ 1> to ⁇ 8>.
  • ⁇ 11> A joined body in which the element and the support member are joined via the sintered body according to ⁇ 10>.
  • ⁇ 12> The composition according to any one of ⁇ 1> to ⁇ 8> is applied to at least one of a position where the element is joined to the support member and a position where the device is joined to the support member.
  • Production of a joined body comprising: a step of forming a composition layer; a step of contacting the support member with the element via the composition layer; and a step of heating and sintering the composition layer.
  • a composition capable of forming a sintered body having excellent connection reliability at a high temperature by a transitional liquid phase sintering method, a bonding material containing the composition, and a composition using the composition
  • the present invention provides a sintered body, a joined body, and a method of manufacturing the same.
  • the present invention is not limited to the following embodiments.
  • the components including the element steps and the like
  • the numerical ranges indicated by using “to” include the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the upper limit or lower limit described in one numerical range may be replaced with the upper limit or lower limit of the numerical range described in other stages.
  • the upper limit or the lower limit of the numerical range may be replaced with the value shown in the embodiment.
  • the content of each component in the composition when there are a plurality of substances corresponding to each component in the composition, unless otherwise specified, the total of the plurality of substances present in the composition Means content.
  • the particle size of each component in the composition when there are a plurality of types of particles corresponding to each component in the composition, unless otherwise specified, a mixture of the plurality of types of particles present in the composition Means the value of
  • the term "layer" includes, when observing a region where the layer exists, in addition to a case where the layer is formed over the entire region and a case where the layer is formed only on a part of the region. included.
  • composition of the present disclosure contains a metal component capable of transitional liquid phase sintering and an organic component, and the organic component has a peak in the heat generation direction in a range of less than 270 ° C. in differential scanning calorimetry (DSC). No composition.
  • the composition used as the transitional liquid phase sintering type metal adhesive includes, in addition to the metal component, a resin component for forming the composition into a paste, a flux component for removing an oxide film on the bonding surface, a solvent, and the like. Contains as an organic component.
  • a resin that causes a polymerization reaction such as a thermosetting resin
  • the polymerization reaction of the resin component due to heating during sintering, the reaction between the functional group of the resin component and the functional group on the metal surface, etc. may be promoted.
  • the flux component acts on As a result, it is considered that the oxide film removing action by the flux component is reduced, the progress of the transitional liquid phase sintering is inhibited by the reaction between the metal surface and the resin component, and the bonding strength is reduced.
  • composition of the present disclosure uses an organic component that does not have a peak in the heat generation direction in a range of less than 270 ° C. in DSC, whereby the reaction of the organic component due to heating during sintering is suppressed. As a result, it is considered that consumption of the flux component is suppressed, sufficient bonding strength is obtained, and connection reliability at high temperatures is improved.
  • the method for preventing the organic component from having a peak in the heat generation direction in a range of less than 270 ° C. in DSC is not particularly limited.
  • a resin having low reactivity with other organic components may be used as a resin component included as an organic component.
  • a mixture containing at least a resin component contained in an organic component and at least one selected from the group consisting of a rosin and an activator does not have a peak in an exothermic direction in a range of less than 270 ° C. in DSC.
  • the composition of the present disclosure contains a metal component capable of transitional liquid phase sintering.
  • “Transitional liquid phase sintering” in the present disclosure is also referred to as “Transient Liquid Phase Sintering (TLPS)” and is a liquid obtained by heating a metal interface having a relatively low melting point (low melting point metal) among particles having different melting points.
  • TLPS Transient Liquid Phase Sintering
  • This refers to a phenomenon in which the formation of a metal compound (alloying) by both metals proceeds due to phase transition and reaction diffusion of a metal having a relatively high melting point (high melting point metal) into the liquid phase.
  • a metal component capable of transitional liquid phase sintering a combination of metals having different melting points (combination of a low melting point metal and a high melting point metal) capable of transitional liquid phase sintering is given.
  • the combination of metals capable of transitional liquid phase sintering is not particularly limited.
  • a combination of a low-melting metal and a high-melting metal is Sn and Cu, a combination of In and Au, and a combination of Sn and Co, respectively.
  • Sn and Ni There are certain combinations and combinations of Sn and Ni.
  • the combination of metals capable of transitional liquid phase sintering may be a combination of two metals or a combination of three or more metals.
  • the metal component capable of transitional liquid phase sintering preferably includes metal particles A having a melting point higher than 300 ° C. and metal particles B having a melting point of 300 ° C. or lower.
  • the melting point of the metal particles A is more preferably 500 ° C. or higher, and further preferably 800 ° C. or higher.
  • the melting point of the metal particles B is more preferably 250 ° C. or less.
  • the metal component capable of transitional liquid phase sintering may include Cu (melting point: 1085 ° C.) as metal particles A and Sn (melting point: 231.9 ° C.) as metal particles B. May be included.
  • the metal component containing Cu and Sn produces a copper-tin metal compound (Cu 6 Sn 5 ) by sintering. Since this generation reaction proceeds at around 250 ° C., sintering by general equipment such as a reflow furnace is possible.
  • the metal component includes the metal particles A and the metal particles B is not particularly limited.
  • the metal particles A and the metal particles B may each be a single metal state, or one or both of the metal particles A and the metal particles B may be in an alloy state. Further, the metal particles A and the metal particles B may contain the same kind of metal element.
  • the metal particles A may include Cu
  • the metal particles B may include an alloy containing Su.
  • An example in which Sn is in an alloy state includes an alloy (SAC) composed of Su, Ag, and Cu.
  • the composition of the SAC is not particularly limited, and examples thereof include Sn-3.0Ag-0.5Cu.
  • an alloy represented by Sn-AX-BY indicates that the alloy containing Sn contains A mass% of the element X and B mass% of the element Y in the alloy containing Sn.
  • the melting point (liquid phase transition temperature) of the alloy represented by Sn-3.0Ag-0.5Cu is about 217 ° C.
  • the ratio of the metal particles A to the metal particles B in the metal component is not particularly limited.
  • the ratio of the metal particles A in the metal component is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 67% by mass or more of the entire metal component.
  • the metal particles A and the metal particles B contained in the metal component may each be composed of only one kind of metal, or may be composed of two or more kinds of metals.
  • the metal particle A or the metal particle B is composed of two or more kinds of metals, even if the metal particle is a combination (mixture) of metal particles containing each of the two or more kinds of metals, the two or more kinds of metals are the same metal. It may be contained in the particles or a combination thereof.
  • the configuration of metal particles containing two or more metals in the same metal particle is not particularly limited.
  • it may be a metal particle composed of an alloy of two or more metals or a metal particle composed of a simple substance of two or more metals.
  • Metal particles composed of a simple substance of two or more metals can be obtained, for example, by forming a layer containing the other metal on the surface of the metal particle containing one metal by plating, vapor deposition, or the like.
  • the same metal particles are applied to the surface of a metal particle containing one metal by applying particles containing the other metal in a dry manner using a force mainly composed of an impact force in a high-speed airflow to combine the two.
  • Metal particles containing two or more metals therein can also be obtained.
  • the average particle size of the metal particles is not particularly limited.
  • the average particle size of the metal particles is preferably 0.5 ⁇ m to 80 ⁇ m, more preferably 1 ⁇ m to 50 ⁇ m, and still more preferably 1 ⁇ m to 30 ⁇ m.
  • the average particle size of the metal particles refers to a volume average particle size measured by a laser diffraction type particle size distribution analyzer (for example, LS ⁇ 13 ⁇ 320 type laser scattering diffraction particle size distribution analyzer, Beckman Coulter, Inc.). Specifically, metal particles are added to 125 g of a solvent (terpineol) in a range of 0.01% by mass to 0.3% by mass to prepare a dispersion. About 100 ml of this dispersion is poured into a cell and measured at 25 ° C. The particle size distribution is measured with the refractive index of the solvent being 1.48.
  • a laser diffraction type particle size distribution analyzer for example, LS ⁇ 13 ⁇ 320 type laser scattering diffraction particle size distribution analyzer, Beckman Coulter, Inc.
  • the content of the metal component in the composition is not particularly limited.
  • the ratio by mass of the metal component to the entire composition is preferably 80% by mass or more, more preferably 85% by mass or more, and even more preferably 88% by mass or more.
  • the ratio by mass of the metal component to the entire composition may be 98% by mass or less.
  • compositions of the present disclosure contain an organic component.
  • effects such as improvement of printability when the composition of the present disclosure is used as a paste can be obtained.
  • the DSC measurement of the organic component is performed using a platinum pan and heating from 25 ° C. to 300 ° C. at a rate of 20 ° C./min under a nitrogen stream of 50 ml / min.
  • the organic component is not particularly limited as long as it does not have a peak in the heat generation direction in a range of less than 270 ° C. in DSC.
  • a resin component, a flux component, a solvent and the like can be mentioned.
  • the content of the organic component in the composition is not particularly limited.
  • the proportion by mass of the organic component in the entire composition is preferably less than 20% by mass, more preferably less than 15% by mass, and even more preferably less than 12% by mass.
  • the ratio by mass of the organic component to the whole composition may be more than 2% by mass. If the proportion based on the mass of the organic component is more than 2% by mass, printability tends to be hardly impaired when the composition of the present disclosure is used as a paste.
  • the composition of the present disclosure may contain a resin component as an organic component.
  • a resin component as an organic component.
  • the resin component contained in the composition may be a thermoplastic resin, a thermosetting resin, or a combination thereof.
  • the resin component may be in the state of a monomer having a functional group capable of causing a polymerization reaction by heating or in the state of a polymer that has already been polymerized.
  • thermosetting resin examples include a resin having a functional group such as an epoxy group, an acryloyl group, a methacryloyl group, a hydroxy group, a vinyl group, a carboxy group, an amino group, a maleimide group, an acid anhydride group, a thiol group, and a thionyl group.
  • a resin having a functional group such as an epoxy group, an acryloyl group, a methacryloyl group, a hydroxy group, a vinyl group, a carboxy group, an amino group, a maleimide group, an acid anhydride group, a thiol group, and a thionyl group.
  • thermosetting resin examples include an epoxy resin, an oxazine resin, a bismaleimide resin, a phenol resin, an unsaturated polyester resin, and a silicone resin. Of these, epoxy resins are preferred.
  • epoxy resin for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, naphthalene type epoxy resin, biphenol type epoxy resin, Biphenyl novolak type epoxy resins and cycloaliphatic epoxy resins are exemplified.
  • the resin component may be used alone or in combination of two or more.
  • the resin component preferably has a weight average molecular weight of 300 or more, more preferably 350 or more.
  • the weight average molecular weight of the resin component is 300 or more, the number of functional groups in the organic component is not too large, and the self-polymerization of the resin component, the reaction between the resin component and the metal component, and the like tend to be suppressed. As a result, it is considered that the inhibition of the transitional liquid phase sintering of the metal component is further suppressed.
  • the upper limit of the weight average molecular weight of the resin component is not particularly limited.
  • the weight average molecular weight of the resin component is measured using gel permeation chromatography using polystyrene as a standard substance.
  • the resin component preferably has a functional group equivalent (molecular weight per functional group) of 150 or more, more preferably 200 or more, and even more preferably 250 or more.
  • a functional group equivalent of the resin component is 150 or more, the number of functional groups in the organic component is not too large, and the self-polymerization of the resin component and the reaction between the resin component and the metal component tend to be suppressed. As a result, it is considered that the inhibition of the transitional liquid phase sintering of the metal component is further suppressed.
  • the upper limit of the functional group equivalent of the resin component is not particularly limited.
  • the functional group equivalent of the resin component may be a value measured by a known method according to the type of the functional group.
  • the functional group equivalent epoxy equivalent
  • the functional group equivalent may be a value measured according to JIS # K7236: 2001.
  • the ratio of the resin component to the entire organic component is not particularly limited. For example, it may be 0.1% by mass to 50% by mass of the whole organic component.
  • the composition of the present disclosure may contain a flux component as an organic component.
  • the flux component means an organic component capable of exerting a flux action (an action of removing an oxide film), and its type is not particularly limited. Specific examples of the flux component include a rosin, an activator, a thixotropic agent, and an antioxidant.
  • One type of flux component may be used alone, or two or more types may be used in combination.
  • rosin include dehydroabietic acid, dihydroabietic acid, neoabietic acid, dihydropimaric acid, pimaric acid, isopimaric acid, tetrahydroabietic acid, and parastolic acid.
  • activator include aminodecanoic acid, pentane-1,5-dicarboxylic acid, triethanolamine, diphenylacetic acid, sebacic acid, phthalic acid, benzoic acid, dibromosalicylic acid, anisic acid, iodosalicylic acid, picolinic acid and the like.
  • the thixotropic agent examples include 12-hydroxystearic acid, 12-hydroxystearic acid triglyceride, ethylenebisstearic acid amide, hexamethylenebisoleic acid amide, N, N'-distearyladipic acid amide and the like.
  • Specific examples of the antioxidant include a hindered phenol-based antioxidant, a phosphorus-based antioxidant, and a hydroxylamine-based antioxidant.
  • the ratio of the flux component to the entire organic component is not particularly limited. For example, it may be 0.1% by mass to 50% by mass of the whole organic component.
  • the composition of the present disclosure may contain a solvent as an organic component.
  • the solvent is preferably a polar solvent, and from the viewpoint of preventing drying of the composition in the step of applying the composition, it is preferably a solvent having a boiling point of 200 ° C or higher. It is more preferable that the solvent has a boiling point of 300 ° C. or less in order to suppress generation of voids during sintering.
  • solvents examples include terpineol, stearyl alcohol, tripropylene glycol methyl ether, diethylene glycol, diethylene glycol monoethyl ether (ethoxyethoxyethanol), diethylene glycol monohexyl ether, diethylene glycol monomethyl ether, dipropylene glycol-n-propyl ether, Alcohols such as dipropylene glycol-n-butyl ether, tripropylene glycol-n-butyl ether, 1,3-butanediol, 1,4-butanediol, propylene glycol phenyl ether, 2- (2-butoxyethoxy) ethanol; Tributylate, 4-methyl-1,3-dioxolan-2-one, ⁇ -butyrolactone, diethylene glycol Esters such as ethyl ether acetate, dipropylene glycol methyl ether acetate, diethylene glycol monobutyl ether acetate and glycerin tria
  • the proportion of the solvent in the whole organic component is not particularly limited. For example, it may be 0.1% by mass to 50% by mass of the whole organic component.
  • the method for producing the composition of the present disclosure is not particularly limited. For example, it can be obtained by mixing components constituting the composition of the present disclosure, and further performing a treatment such as stirring, melting, and dispersion.
  • the apparatus for mixing, stirring, dispersing, and the like is not particularly limited, and includes a three-roll mill, a planetary mixer, a planetary mixer, a rotation-revolution-type stirring apparatus, a grinder, a twin-screw kneader, A thin shear disperser or the like can be used. Further, these devices may be used in appropriate combination. During the above treatment, heating may be performed as necessary. After the treatment, the maximum particle size of the composition may be adjusted by filtration. Filtration can be performed using a filtration device. Examples of the filter for filtration include a metal mesh, a metal filter, and a nylon mesh.
  • composition of the present disclosure is used, for example, as a joining material for joining an element constituting a semiconductor device, an electronic component, or the like and a support member.
  • applications of the composition of the present disclosure are not limited to these.
  • the bonding material of the present disclosure contains the composition of the present disclosure.
  • the composition of the present disclosure can be used as a bonding material as it is, or may be used as a bonding material by adding other components as necessary.
  • Preferred embodiments of the bonding material of the present disclosure are the same as those of the composition of the present disclosure described above.
  • the sintered body of the present disclosure is obtained by sintering the composition of the present disclosure.
  • the method for sintering the composition of the present disclosure is not particularly limited.
  • the electric resistivity of the sintered body is preferably 1 ⁇ 10 ⁇ 4 ⁇ ⁇ cm or less.
  • the joined body of the present disclosure is one in which the element and the support member are joined via the sintered body of the present disclosure.
  • the support member is not particularly limited, and a material in which the material of the portion where the elements are joined is metal is used. Examples of the metal as the material of the portion where the elements are joined include gold, silver, copper, nickel, and the like. Further, among the above, a plurality of metals may be patterned on the base material to form a support member. Specific examples of the support member include a lead frame, a wired tape carrier, a rigid wiring board, a flexible wiring board, a wired glass substrate, a wired silicon wafer, and a wafer level CSP (Wafer Level Chip Size Package).
  • the elements are not particularly limited, and include active elements such as semiconductor chips, transistors, diodes, light emitting diodes, and thyristors, and passive elements such as capacitors, resistors, resistor arrays, coils, and switches.
  • examples of the joined body of the present disclosure include a semiconductor device and an electronic component.
  • Specific examples of the semiconductor device include a diode, a rectifier, a thyristor, a metal oxide semiconductor (MOS) gate driver, a power switch, a power oxide semiconductor field-effect transistor (IGBT), and an IGBT (insulator transistor).
  • Examples include a power module including a fast recovery diode, a transmitter, an amplifier, and an LED module.
  • the method for manufacturing a joined body according to the present disclosure includes forming a composition layer by applying the composition of the present disclosure to at least one of a portion of the support member where the device is joined and a portion of the device where the device is joined to the support member. Performing, contacting the support member with the element via the composition layer, and heating and sintering the composition layer.
  • the step of applying the composition to form the composition layer may include the step of drying the applied composition.
  • a composition layer is formed by applying the composition of the present disclosure to at least one of a portion of the support member where the element is bonded and a portion of the device where the device is bonded to the support member.
  • the method for applying the composition include a coating method and a printing method.
  • a coating method for applying the composition for example, dipping, spray coating, bar coating, die coating, comma coating, slit coating, and application using an applicator can be used.
  • a printing method for printing the composition for example, a dispenser method, a stencil printing method, an intaglio printing method, a screen printing method, a needle dispenser method, and a jet dispenser method can be used.
  • the composition layer formed by applying the composition is preferably dried from the viewpoint of suppressing the flow of the composition and the generation of voids during heating.
  • a method for drying the composition layer drying by standing at room temperature (for example, 25 ° C.), drying by heating, or drying under reduced pressure can be used.
  • room temperature for example, 25 ° C.
  • heating or vacuum drying hot plate, hot air dryer, hot air heating furnace, nitrogen dryer, infrared dryer, infrared heating furnace, far infrared heating furnace, microwave heating device, laser heating device, electromagnetic heating device , A heater heating device, a steam heating furnace, a hot plate pressing device, or the like.
  • the temperature and time for drying can be appropriately adjusted according to the type and amount of the solvent used. For example, drying at 50 ° C. to 180 ° C.
  • the element and the supporting member are brought into contact with each other, whereby the element and the supporting member are bonded to each other with the composition layer interposed therebetween.
  • the step of drying the applied composition may be performed before or after the step of bringing the support member into contact with the element.
  • a sintered body is formed by heating the composition layer.
  • the sintering of the composition layer may be performed by a heat treatment or a heat and pressure treatment.
  • heating treatment hot plate, hot air dryer, hot air heating furnace, nitrogen dryer, infrared dryer, infrared heating furnace, far infrared heating furnace, microwave heating device, laser heating device, electromagnetic heating device, heater heating An apparatus, a steam heating furnace, or the like can be used.
  • a hot plate press device or the like may be used, or the above-described heating treatment may be performed while applying pressure.
  • the heating temperature in the sintering of the composition layer can be selected according to the type and content of the components contained in the composition.
  • the melting point is preferably equal to or higher than the melting point of the low melting point metal.
  • the temperature is preferably 180 ° C. or higher, more preferably 190 ° C. or higher, and further preferably 220 ° C. or higher.
  • the upper limit of the heating temperature is not particularly limited, but may be, for example, 300 ° C. or lower.
  • the heating time in the sintering of the composition layer can be selected according to the type and content of the components contained in the composition. For example, the duration is preferably from 5 seconds to 10 hours, more preferably from 1 minute to 30 minutes, even more preferably from 3 minutes to 10 minutes.
  • the sintering of the composition layer is preferably performed in an atmosphere having a low oxygen concentration.
  • the low oxygen concentration atmosphere refers to a state in which the oxygen concentration is 1000 ppm or less, and preferably 500 ppm or less.
  • Each component shown in Table 1 was mixed in an amount (unit: g) shown in Table 1 to prepare a composition. Details of the components shown in Table 1 are as follows.
  • Metal component 1 Cu particles having an average particle size of 5 ⁇ m
  • Metal component 2 Cu particles having an average particle size of 25 ⁇ m
  • Metal component 3 Metal particle mixture having an average particle size of 3 ⁇ m (mixing ratio: Sn 96.5% by mass, Ag 3.0% by mass, Cu 0.5% by mass)
  • Metal component 4 Metal particle mixture having an average particle size of 25 ⁇ m (mixing ratio: Sn 96.5% by mass, Ag 3.0% by mass, Cu 0.5% by mass)
  • Organic component 1 epoxy resin (trade name “jER828” of Mitsubishi Chemical Corporation, Mw: 380, epoxy equivalent: 190)
  • Organic component 2 Epoxy resin (trade name “YX7108” of Mitsubishi Chemical Corporation, Mw: 40000, epoxy equivalent: 8000)
  • Organic component 3 Epoxy resin (trade name “AER9000” of Asahi Kasei Corporation, epoxy equivalent: 350)
  • Organic component 4 Rosin (acrylated rosin)
  • Organic component 5 thixotropic agent (hydroxystearic acid)
  • Organic component 6 Activator (triethanolamine)
  • Organic component 7 Antioxidant (Hindered phenolic antioxidant, trade name “Irganox 1010” of BASF)
  • Organic component 8 solvent (diethylene glycol monohexyl ether)
  • the prepared composition was applied to a copper lead frame using sharp tweezers to form a composition layer.
  • An Si chip having a size of 2 mm ⁇ 2 mm and a gold-plated surface was placed on the composition layer, and lightly pressed with tweezers to obtain a sample of the composition before sintering.
  • After the sample before sintering was dried on a hot plate at 100 ° C. for 30 minutes, it was set on a conveyor of a nitrogen reflow apparatus (Tamura Seisakusho Co., Ltd .: 1 zone 50 cm, 7 zone configuration, under a nitrogen stream), and the oxygen concentration was 200 ppm. It was conveyed at a speed of 0.3 m / min below.
  • the sample was heated at 250 ° C. or more for 1 minute or more to obtain a sintered sample of the composition.
  • a universal bond tester 4000 series, manufactured by DAGE
  • the Si chip was pressed horizontally at a measurement speed of 500 ⁇ m / s and a measurement height of 100 ⁇ m, and the die-share of a sintered sample of the composition was performed.
  • the strength was measured.
  • the average of the results of the nine measurements was taken as the die shear strength. If the die shear strength is less than 20 MPa, it can be said that the adhesion is poor. Table 1 shows the results.
  • the sintered products prepared using the compositions of Examples 1 and 2 containing an organic component having no peak in the exothermic direction in a range of less than 270 ° C. in DSC were less than 270 ° C. in DSC.
  • Comparative Example 1 including an organic component having a peak in the heat generation direction in the range the connection reliability under high temperature conditions (300 ° C. ⁇ 5 ° C.) in the cooling / heating cycle was excellent.

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Abstract

L'invention concerne une composition contenant un composant métallique pouvant être fritté en phase liquide transitoire, et un composant organique, le composant organique ne présentant pas de pic exothermique dans une plage inférieure à 270°C en calorimétrie différentielle à balayage (ACD).
PCT/JP2018/027382 2018-07-20 2018-07-20 Composition, matériau d'assemblage, corps fritté, corps assemblé et procédé de fabrication de ce corps assemblé WO2020017048A1 (fr)

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PCT/JP2018/027382 WO2020017048A1 (fr) 2018-07-20 2018-07-20 Composition, matériau d'assemblage, corps fritté, corps assemblé et procédé de fabrication de ce corps assemblé
JP2020530873A JPWO2020017063A1 (ja) 2018-07-20 2018-09-25 組成物、接合材料、焼結体、接合体及び接合体の製造方法
PCT/JP2018/035435 WO2020017063A1 (fr) 2018-07-20 2018-09-25 Composition, matériau d'assemblage, corps fritté, corps assemblé et procédé de fabrication de ce corps assemblé

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Citations (5)

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Publication number Priority date Publication date Assignee Title
WO2016031552A1 (fr) * 2014-08-29 2016-03-03 古河電気工業株式会社 Composition adhésive électroconductrice
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