WO2020017064A1 - Composition, matériau de liaison, compact fritté, ensemble et procédé de production d'ensemble - Google Patents

Composition, matériau de liaison, compact fritté, ensemble et procédé de production d'ensemble Download PDF

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Publication number
WO2020017064A1
WO2020017064A1 PCT/JP2018/035436 JP2018035436W WO2020017064A1 WO 2020017064 A1 WO2020017064 A1 WO 2020017064A1 JP 2018035436 W JP2018035436 W JP 2018035436W WO 2020017064 A1 WO2020017064 A1 WO 2020017064A1
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WO
WIPO (PCT)
Prior art keywords
composition
metal
component
metal particles
rosin
Prior art date
Application number
PCT/JP2018/035436
Other languages
English (en)
Japanese (ja)
Inventor
史貴 上野
斉藤　晃一
雅記 竹内
貴耶 山本
秀明 山岸
将太 梅崎
洋子 坂入
Original Assignee
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to JP2020530874A priority Critical patent/JPWO2020017064A1/ja
Publication of WO2020017064A1 publication Critical patent/WO2020017064A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Definitions

  • ⁇ 3> The composition according to ⁇ 1> or ⁇ 2>, wherein the metal particles A include Cu.
  • the metal particles B include Sn.
  • ⁇ 5> A bonding material containing the composition according to any one of ⁇ 1> to ⁇ 4>.
  • ⁇ 6> A sintered body of the composition according to any one of ⁇ 1> to ⁇ 4>.
  • ⁇ 7> A joined body in which the element and the support member are joined via the sintered body according to ⁇ 6>.
  • the metal component capable of transitional liquid phase sintering may include Cu (melting point: 1085 ° C.) as metal particles A and Sn (melting point: 231.9 ° C.) as metal particles B. May be included.
  • the metal component containing Cu and Sn generates a Cu—Sn intermetallic compound (Cu 6 Sn 5 ) by sintering. Since this generation reaction proceeds at around 250 ° C., sintering by general equipment such as a reflow furnace is possible.
  • the composition of the present disclosure may contain a resin component as an organic component.
  • a resin component as an organic component.
  • the sintered body of the present disclosure is obtained by sintering the composition of the present disclosure.
  • the method for sintering the composition of the present disclosure is not particularly limited.
  • the electric resistivity of the sintered body is preferably 1 ⁇ 10 ⁇ 4 ⁇ ⁇ cm or less.

Abstract

Cette composition contient : un composant métallique qui peut subir un frittage en phase liquide transitoire ; et un composant organique. Le composant métallique contient : des particules métalliques A ayant un point de fusion supérieur à 300 °C ; et des particules métalliques B ayant un point de fusion ne dépassant pas 300 °C. Le composant organique contient de la rosine, et la teneur en rosine pour 1m2 de la surface de l'ensemble du composant métallique se situe dans la plage de 0,09 g à 0,17 g.
PCT/JP2018/035436 2018-07-20 2018-09-25 Composition, matériau de liaison, compact fritté, ensemble et procédé de production d'ensemble WO2020017064A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020530874A JPWO2020017064A1 (ja) 2018-07-20 2018-09-25 組成物、接合材料、焼結体、接合体及び接合体の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPPCT/JP2018/027383 2018-07-20
PCT/JP2018/027383 WO2020017049A1 (fr) 2018-07-20 2018-07-20 Composition, matériau de liaison, produit compact fritté, ensemble, et procédé de production d'ensemble

Publications (1)

Publication Number Publication Date
WO2020017064A1 true WO2020017064A1 (fr) 2020-01-23

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2018/027383 WO2020017049A1 (fr) 2018-07-20 2018-07-20 Composition, matériau de liaison, produit compact fritté, ensemble, et procédé de production d'ensemble
PCT/JP2018/035436 WO2020017064A1 (fr) 2018-07-20 2018-09-25 Composition, matériau de liaison, compact fritté, ensemble et procédé de production d'ensemble

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/027383 WO2020017049A1 (fr) 2018-07-20 2018-07-20 Composition, matériau de liaison, produit compact fritté, ensemble, et procédé de production d'ensemble

Country Status (2)

Country Link
JP (1) JPWO2020017064A1 (fr)
WO (2) WO2020017049A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356630A (ja) * 2001-05-30 2002-12-13 Dowa Mining Co Ltd 低温焼成用銅粉または導電ペースト用銅粉
JP2012216855A (ja) * 2010-11-19 2012-11-08 Murata Mfg Co Ltd 接続対象物の接続方法および電子装置の製造方法
JP2014054663A (ja) * 2012-09-13 2014-03-27 Tamura Seisakusho Co Ltd フラックス組成物、ソルダーペースト組成物及びプリント配線基板
JP2015098052A (ja) * 2013-10-16 2015-05-28 三井金属鉱業株式会社 半田合金及び半田粉
WO2016039056A1 (fr) * 2014-09-09 2016-03-17 株式会社村田製作所 Composition métallique et matériau de liaison

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356630A (ja) * 2001-05-30 2002-12-13 Dowa Mining Co Ltd 低温焼成用銅粉または導電ペースト用銅粉
JP2012216855A (ja) * 2010-11-19 2012-11-08 Murata Mfg Co Ltd 接続対象物の接続方法および電子装置の製造方法
JP2014054663A (ja) * 2012-09-13 2014-03-27 Tamura Seisakusho Co Ltd フラックス組成物、ソルダーペースト組成物及びプリント配線基板
JP2015098052A (ja) * 2013-10-16 2015-05-28 三井金属鉱業株式会社 半田合金及び半田粉
WO2016039056A1 (fr) * 2014-09-09 2016-03-17 株式会社村田製作所 Composition métallique et matériau de liaison

Also Published As

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JPWO2020017064A1 (ja) 2021-08-12
WO2020017049A1 (fr) 2020-01-23

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