SG10201404443QA - Conductive composition - Google Patents

Conductive composition

Info

Publication number
SG10201404443QA
SG10201404443QA SG10201404443QA SG10201404443QA SG10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA
Authority
SG
Singapore
Prior art keywords
conductive composition
conductive
composition
Prior art date
Application number
SG10201404443QA
Inventor
Hagedorn Hans-Werner
Lower Yvonne
Dickel Tanja
Stenger Katja
Xin Yong Ling
Wei Teo Keng
Fritzsche Sebastian
Schafer Michael
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
Heraeus Materials Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg, Heraeus Materials Singapore Pte Ltd filed Critical Heraeus Deutschland Gmbh & Co Kg
Priority to SG10201404443QA priority Critical patent/SG10201404443QA/en
Priority to TW104119631A priority patent/TW201614676A/en
Priority to PCT/SG2015/000131 priority patent/WO2016018191A1/en
Publication of SG10201404443QA publication Critical patent/SG10201404443QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG10201404443QA 2014-07-29 2014-07-29 Conductive composition SG10201404443QA (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG10201404443QA SG10201404443QA (en) 2014-07-29 2014-07-29 Conductive composition
TW104119631A TW201614676A (en) 2014-07-29 2015-06-17 Conductive composition
PCT/SG2015/000131 WO2016018191A1 (en) 2014-07-29 2015-06-19 Epoxy resin-based electroconductive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201404443QA SG10201404443QA (en) 2014-07-29 2014-07-29 Conductive composition

Publications (1)

Publication Number Publication Date
SG10201404443QA true SG10201404443QA (en) 2016-02-26

Family

ID=53887172

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201404443QA SG10201404443QA (en) 2014-07-29 2014-07-29 Conductive composition

Country Status (3)

Country Link
SG (1) SG10201404443QA (en)
TW (1) TW201614676A (en)
WO (1) WO2016018191A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3362530A4 (en) * 2015-10-15 2019-06-05 Henkel IP & Holding GmbH Use of nickel and nickel-containing alloys as conductive fillers in adhesive formulations
DE102017008925A1 (en) * 2017-09-25 2019-03-28 Hexion GmbH Imprägnierharzmischung
CN112371150B (en) * 2020-10-26 2021-09-17 厦门大学 Nickel-aluminum bimetal nitrogen-carbon doped catalyst, preparation method thereof and application thereof in catalyzing levulinic acid hydrogenation to prepare gamma-valerolactone

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920371A (en) * 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd Conductive adhesive
JPS59130004A (en) * 1983-01-18 1984-07-26 三井東圧化学株式会社 Silver paste
KR101036353B1 (en) * 2009-04-14 2011-05-23 엘지이노텍 주식회사 Screen Printable Adhesive Paste for Semiconductor Packaging
CN101792627A (en) * 2010-03-10 2010-08-04 彩虹集团公司 Shielding electrically conductive printing ink and preparation method thereof

Also Published As

Publication number Publication date
TW201614676A (en) 2016-04-16
WO2016018191A1 (en) 2016-02-04

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