TW201614676A - Conductive composition - Google Patents

Conductive composition

Info

Publication number
TW201614676A
TW201614676A TW104119631A TW104119631A TW201614676A TW 201614676 A TW201614676 A TW 201614676A TW 104119631 A TW104119631 A TW 104119631A TW 104119631 A TW104119631 A TW 104119631A TW 201614676 A TW201614676 A TW 201614676A
Authority
TW
Taiwan
Prior art keywords
conductive composition
epoxy resin
hardener
lactone
electrically conductive
Prior art date
Application number
TW104119631A
Other languages
Chinese (zh)
Inventor
Hans-Werner Hagedorn
Yvonne Loewer
Tanja Dickel
Katja Stenger
Ling Xin Yong
qing wei Zhang
Sebastian Fritzsche
Michael Schaefer
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
Heraeus Materials Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg, Heraeus Materials Singapore Pte Ltd filed Critical Heraeus Deutschland Gmbh & Co Kg
Publication of TW201614676A publication Critical patent/TW201614676A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

An electrically conductive composition comprising (a) metal containing particles, (b) at least one epoxy resin, (c) at least one hardener for the at least one epoxy resin, and (d) at least one lactone.
TW104119631A 2014-07-29 2015-06-17 Conductive composition TW201614676A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201404443QA SG10201404443QA (en) 2014-07-29 2014-07-29 Conductive composition

Publications (1)

Publication Number Publication Date
TW201614676A true TW201614676A (en) 2016-04-16

Family

ID=53887172

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104119631A TW201614676A (en) 2014-07-29 2015-06-17 Conductive composition

Country Status (3)

Country Link
SG (1) SG10201404443QA (en)
TW (1) TW201614676A (en)
WO (1) WO2016018191A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102645616B1 (en) * 2015-10-15 2024-03-11 헨켈 아게 운트 코. 카게아아 Use of nickel and nickel-containing alloys as conductive fillers in adhesive formulations
DE102017008925A1 (en) * 2017-09-25 2019-03-28 Hexion GmbH Imprägnierharzmischung
CN112371150B (en) * 2020-10-26 2021-09-17 厦门大学 Nickel-aluminum bimetal nitrogen-carbon doped catalyst, preparation method thereof and application thereof in catalyzing levulinic acid hydrogenation to prepare gamma-valerolactone

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920371A (en) * 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd Conductive adhesive
JPS59130004A (en) * 1983-01-18 1984-07-26 三井東圧化学株式会社 Silver paste
KR101036353B1 (en) * 2009-04-14 2011-05-23 엘지이노텍 주식회사 Screen Printable Adhesive Paste for Semiconductor Packaging
CN101792627A (en) * 2010-03-10 2010-08-04 彩虹集团公司 Shielding electrically conductive printing ink and preparation method thereof

Also Published As

Publication number Publication date
SG10201404443QA (en) 2016-02-26
WO2016018191A1 (en) 2016-02-04

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