SG11201605180TA - Transfer device and control method of transfer device - Google Patents

Transfer device and control method of transfer device

Info

Publication number
SG11201605180TA
SG11201605180TA SG11201605180TA SG11201605180TA SG11201605180TA SG 11201605180T A SG11201605180T A SG 11201605180TA SG 11201605180T A SG11201605180T A SG 11201605180TA SG 11201605180T A SG11201605180T A SG 11201605180TA SG 11201605180T A SG11201605180T A SG 11201605180TA
Authority
SG
Singapore
Prior art keywords
transfer device
control method
transfer
control
Prior art date
Application number
SG11201605180TA
Other languages
English (en)
Inventor
Junichi Ito
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Publication of SG11201605180TA publication Critical patent/SG11201605180TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C13/00—Other constructional features or details
    • B66C13/18—Control systems or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control And Safety Of Cranes (AREA)
  • Carriers, Traveling Bodies, And Overhead Traveling Cranes (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
SG11201605180TA 2014-01-07 2014-10-29 Transfer device and control method of transfer device SG11201605180TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014000964 2014-01-07
PCT/JP2014/078748 WO2015104887A1 (fr) 2014-01-07 2014-10-29 Dispositif de transfert et procédé de commande de dispositif de transfert

Publications (1)

Publication Number Publication Date
SG11201605180TA true SG11201605180TA (en) 2016-08-30

Family

ID=53523729

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201605180TA SG11201605180TA (en) 2014-01-07 2014-10-29 Transfer device and control method of transfer device

Country Status (9)

Country Link
US (1) US9881824B2 (fr)
EP (1) EP3093258B1 (fr)
JP (1) JP6160711B2 (fr)
KR (1) KR101829650B1 (fr)
CN (1) CN105899444B (fr)
IL (1) IL246504B (fr)
SG (1) SG11201605180TA (fr)
TW (1) TWI630166B (fr)
WO (1) WO2015104887A1 (fr)

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JP6304122B2 (ja) * 2015-05-13 2018-04-04 株式会社ダイフク 物品搬送設備
KR102165426B1 (ko) * 2016-03-03 2020-10-14 무라다기카이가부시끼가이샤 반송 시스템
US11027949B2 (en) * 2016-05-20 2021-06-08 Murata Machinery, Ltd. Transport vehicle and transport method
JP6620707B2 (ja) * 2016-09-09 2019-12-18 株式会社ダイフク 物品搬送設備
DE102016121778A1 (de) * 2016-11-14 2018-05-17 Cl Schutzrechtsverwaltungs Gmbh Anlage zur additiven Herstellung dreidimensionaler Objekte
JP6946965B2 (ja) * 2017-11-22 2021-10-13 村田機械株式会社 搬送システム
US10418263B2 (en) * 2018-01-20 2019-09-17 Boris Kesil Overhead transportation system for transporting objects between multiple work stations
JP7040638B2 (ja) * 2018-10-29 2022-03-23 村田機械株式会社 天井搬送車及び天井搬送車システム
JP7224728B2 (ja) * 2019-04-23 2023-02-20 株式会社ディスコ 搬送システム
US11545379B2 (en) 2020-07-31 2023-01-03 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
CN112027542B (zh) * 2020-08-21 2023-07-14 上海新创达半导体设备技术有限公司 一种轨道小车的物料夹持装置
KR20220060028A (ko) * 2020-11-02 2022-05-11 삼성디스플레이 주식회사 적재부 및 그것을 포함하는 윈도우 제조 시스템
WO2024034175A1 (fr) * 2022-08-09 2024-02-15 村田機械株式会社 Véhicule de transport aérien
CN116344423B (zh) * 2023-05-29 2023-08-11 上海新创达半导体设备技术有限公司 基于无线供电的物料搬运天车及其控制方法

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JPS567807A (en) * 1979-06-29 1981-01-27 Mitsubishi Heavy Ind Ltd Fork device
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JP5429570B2 (ja) * 2010-03-08 2014-02-26 株式会社ダイフク 物品搬送設備
KR101359682B1 (ko) * 2010-04-02 2014-02-06 무라다기카이가부시끼가이샤 천장을 주행하는 반송차의 사이드 버퍼 및 반송차 시스템
EP2578528A4 (fr) * 2010-05-25 2013-12-25 Murata Machinery Ltd Véhicule se déplaçant au plafond et procédé permettant d'empêcher toute saillie depuis le véhicule se déplaçant au plafond
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JP5674041B2 (ja) * 2011-08-11 2015-02-18 株式会社ダイフク 物品搬送設備
JP5527619B2 (ja) * 2011-11-24 2014-06-18 株式会社ダイフク 天井設置型の物品搬送設備
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Also Published As

Publication number Publication date
JPWO2015104887A1 (ja) 2017-03-23
CN105899444B (zh) 2017-11-10
EP3093258A4 (fr) 2017-08-09
EP3093258B1 (fr) 2020-10-21
TWI630166B (zh) 2018-07-21
US9881824B2 (en) 2018-01-30
JP6160711B2 (ja) 2017-07-12
TW201540641A (zh) 2015-11-01
IL246504B (en) 2020-06-30
KR20160095062A (ko) 2016-08-10
EP3093258A1 (fr) 2016-11-16
IL246504A0 (en) 2016-08-31
CN105899444A (zh) 2016-08-24
WO2015104887A1 (fr) 2015-07-16
KR101829650B1 (ko) 2018-02-19
US20160329226A1 (en) 2016-11-10

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