SG11201604511UA - Insulating layer for printed circuit board and printed circuit board - Google Patents

Insulating layer for printed circuit board and printed circuit board

Info

Publication number
SG11201604511UA
SG11201604511UA SG11201604511UA SG11201604511UA SG11201604511UA SG 11201604511U A SG11201604511U A SG 11201604511UA SG 11201604511U A SG11201604511U A SG 11201604511UA SG 11201604511U A SG11201604511U A SG 11201604511UA SG 11201604511U A SG11201604511U A SG 11201604511UA
Authority
SG
Singapore
Prior art keywords
circuit board
printed circuit
insulating layer
printed
board
Prior art date
Application number
SG11201604511UA
Other languages
English (en)
Inventor
Katsuya Tomizawa
Tomo Chiba
Meguru ITO
Eisuke Shiga
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of SG11201604511UA publication Critical patent/SG11201604511UA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2465/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulating Bodies (AREA)
  • Organic Insulating Materials (AREA)
SG11201604511UA 2014-01-07 2015-01-06 Insulating layer for printed circuit board and printed circuit board SG11201604511UA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014001046 2014-01-07
JP2014010653 2014-01-23
PCT/JP2015/050188 WO2015105109A1 (ja) 2014-01-07 2015-01-06 プリント配線板用絶縁層及びプリント配線板

Publications (1)

Publication Number Publication Date
SG11201604511UA true SG11201604511UA (en) 2016-07-28

Family

ID=53523934

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201604511UA SG11201604511UA (en) 2014-01-07 2015-01-06 Insulating layer for printed circuit board and printed circuit board
SG10201805388PA SG10201805388PA (en) 2014-01-07 2015-01-06 Insulating layer for printed circuit board and printed circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201805388PA SG10201805388PA (en) 2014-01-07 2015-01-06 Insulating layer for printed circuit board and printed circuit board

Country Status (8)

Country Link
US (1) US10292260B2 (de)
EP (1) EP3094162B1 (de)
JP (1) JP6504462B2 (de)
KR (2) KR102278716B1 (de)
CN (1) CN105900535B (de)
SG (2) SG11201604511UA (de)
TW (1) TWI642718B (de)
WO (1) WO2015105109A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017006895A1 (ja) * 2015-07-06 2017-01-12 三菱瓦斯化学株式会社 樹脂組成物、それを用いたプリプレグ、レジンシート、積層板、及びプリント配線板
CN107735417B (zh) * 2015-07-06 2020-06-26 三菱瓦斯化学株式会社 树脂组合物、使用该树脂组合物的预浸料或树脂片以及使用它们的层叠板和印刷电路板
EP3321325B1 (de) * 2015-07-06 2021-11-24 Mitsubishi Gas Chemical Company, Inc. Harzzusammensetzung, prepreg, metallfolienkaschiertes laminat und leiterplatte
CN107735409B (zh) * 2015-07-06 2020-08-11 三菱瓦斯化学株式会社 树脂组合物、使用该树脂组合物的预浸料或树脂片以及使用它们的层叠板和印刷电路板
JP6819921B2 (ja) * 2016-03-15 2021-01-27 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP6850548B2 (ja) * 2016-04-22 2021-03-31 三菱瓦斯化学株式会社 プリント配線板用樹脂組成物、プリプレグ、レジンシート、積層板、金属箔張積層板、及びプリント配線板
KR102058827B1 (ko) * 2016-12-28 2019-12-24 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 적층판, 금속박 피복 적층판, 프린트 배선판, 및 다층 프린트 배선판
TWI658077B (zh) * 2016-12-28 2019-05-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、疊層板、覆金屬箔疊層板、印刷配線板、及多層印刷配線板
TWI798194B (zh) * 2016-12-28 2023-04-11 日商三菱瓦斯化學股份有限公司 印刷電路板用樹脂組成物、預浸體、樹脂片、疊層板、覆金屬箔疊層板、印刷電路板、及多層印刷電路板
CN114196204A (zh) * 2016-12-28 2022-03-18 三菱瓦斯化学株式会社 预浸料、层叠板、覆金属箔层叠板、印刷电路板、及多层印刷电路板
KR20200087137A (ko) * 2017-11-16 2020-07-20 미츠비시 가스 가가쿠 가부시키가이샤 패터닝된 금속박 부착 적층체의 제조 방법 및 패터닝된 금속박 부착 적층체
WO2019111416A1 (ja) * 2017-12-08 2019-06-13 日立化成株式会社 プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ
KR102258616B1 (ko) * 2018-01-10 2021-05-28 주식회사 엘지화학 반도체 패키지용 절연층 제조방법 및 이에 의해 형성된 반도체 패키지용 절연층

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JP3173332B2 (ja) 1995-03-13 2001-06-04 新神戸電機株式会社 金属箔張り積層板の製造法
JPH1072752A (ja) 1996-05-15 1998-03-17 Matsushita Electric Ind Co Ltd プリント配線板用不織布基材とこれを用いたプリプレグ
JP2004335661A (ja) 2003-05-06 2004-11-25 Risho Kogyo Co Ltd プリント配線用プリプレグ及び積層板
TWI391424B (zh) * 2005-01-12 2013-04-01 Taiyo Holdings Co Ltd A hardened resin composition for inkjet and a hardened product thereof, and a printed circuit board using the same
JP5024205B2 (ja) 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 プリプレグ及び積層板
CN100540577C (zh) * 2007-08-02 2009-09-16 华东理工大学 含硅芳炔改性树脂
KR20110045040A (ko) * 2008-08-08 2011-05-03 헨켈 코포레이션 저온 경화 조성물
CN102379164A (zh) 2009-04-01 2012-03-14 住友电木株式会社 印刷线路板制造方法、印刷线路板、多层印刷线路板以及半导体封装
JP5696302B2 (ja) 2009-09-25 2015-04-08 パナソニックＩｐマネジメント株式会社 インターポーザ用の金属張積層板とそれを用いた半導体パッケージ
TW201204548A (en) 2010-02-05 2012-02-01 Sumitomo Bakelite Co Prepreg, laminate, printed wiring board, and semiconductor device
JP5654912B2 (ja) * 2011-03-18 2015-01-14 パナソニックＩｐマネジメント株式会社 イミド樹脂組成物およびその製造方法、プリプレグ、金属張積層板並びにプリント配線板
EP2716676B1 (de) * 2011-05-27 2016-04-13 Mitsubishi Gas Chemical Company, Inc. Harzzusammensetzung, prepreg und laminat
KR101877088B1 (ko) * 2011-05-31 2018-07-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그 및 적층판
JP2013001807A (ja) 2011-06-16 2013-01-07 Panasonic Corp 電子回路基板材料用樹脂組成物、プリプレグ及び積層板
FR2977382A1 (fr) 2011-06-29 2013-01-04 Thomson Licensing Filtre stop bande a rejection elevee et duplexeur utilisant de tels filtres
WO2013005847A1 (ja) * 2011-07-07 2013-01-10 日立化成工業株式会社 接着フィルム、該接着フィルムを用いた多層プリント配線板、及び該多層プリント配線板の製造方法
SG189246A1 (en) * 2011-07-08 2013-05-31 Mitsui Chemicals Inc Polyimide resin composition and laminate including same
JPWO2013008667A1 (ja) 2011-07-11 2015-02-23 三菱瓦斯化学株式会社 硬化性樹脂組成物およびそれを用いた硬化物の製造方法
JP3173332U (ja) 2011-11-17 2012-02-02 奇▲こう▼科技股▲ふん▼有限公司 含油軸受ファン構造
JP2013216884A (ja) 2012-03-14 2013-10-24 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、プリプレグ及び積層板

Also Published As

Publication number Publication date
KR102278716B1 (ko) 2021-07-16
TWI642718B (zh) 2018-12-01
CN105900535A (zh) 2016-08-24
JP6504462B2 (ja) 2019-04-24
US10292260B2 (en) 2019-05-14
SG10201805388PA (en) 2018-07-30
WO2015105109A1 (ja) 2015-07-16
JPWO2015105109A1 (ja) 2017-03-23
EP3094162A1 (de) 2016-11-16
EP3094162B1 (de) 2023-08-09
KR20200014946A (ko) 2020-02-11
EP3094162A4 (de) 2017-09-06
US20160309582A1 (en) 2016-10-20
CN105900535B (zh) 2019-06-07
KR102075195B1 (ko) 2020-02-07
TW201533137A (zh) 2015-09-01
KR20160105782A (ko) 2016-09-07

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