SG11201601265YA - Polishing Composition and Method for Producing Same - Google Patents
Polishing Composition and Method for Producing SameInfo
- Publication number
- SG11201601265YA SG11201601265YA SG11201601265YA SG11201601265YA SG11201601265YA SG 11201601265Y A SG11201601265Y A SG 11201601265YA SG 11201601265Y A SG11201601265Y A SG 11201601265YA SG 11201601265Y A SG11201601265Y A SG 11201601265YA SG 11201601265Y A SG11201601265Y A SG 11201601265YA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- producing same
- producing
- same
- polishing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013204466 | 2013-09-30 | ||
PCT/JP2014/075123 WO2015046163A1 (ja) | 2013-09-30 | 2014-09-22 | 研磨用組成物およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601265YA true SG11201601265YA (en) | 2016-03-30 |
Family
ID=52743299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601265YA SG11201601265YA (en) | 2013-09-30 | 2014-09-22 | Polishing Composition and Method for Producing Same |
Country Status (8)
Country | Link |
---|---|
US (1) | US10227518B2 (zh) |
EP (1) | EP3053977B1 (zh) |
JP (1) | JP5892638B2 (zh) |
KR (1) | KR102239131B1 (zh) |
CN (1) | CN105593330B (zh) |
SG (1) | SG11201601265YA (zh) |
TW (1) | TWI617655B (zh) |
WO (1) | WO2015046163A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5920840B2 (ja) * | 2013-09-30 | 2016-05-18 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびその製造方法 |
JP6185432B2 (ja) * | 2014-06-24 | 2017-08-23 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
US10179870B2 (en) * | 2014-12-05 | 2019-01-15 | 3M Innovative Properties Company | Abrasive composition |
US20190241766A1 (en) * | 2016-09-29 | 2019-08-08 | Kao Corporation | Polishing liquid composition |
JP6879798B2 (ja) * | 2017-03-30 | 2021-06-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
EP3790706A4 (en) * | 2018-05-07 | 2022-02-16 | Applied Materials, Inc. | CHEMICAL MECHANICAL POLISHING PADS WITH ADJUSTABLE HYDROPHIL AND ZETA POTENTIAL |
JP7356248B2 (ja) | 2019-03-28 | 2023-10-04 | 株式会社フジミインコーポレーテッド | リンス用組成物およびリンス方法 |
CN112872916B (zh) * | 2020-12-28 | 2023-03-10 | 富联裕展科技(深圳)有限公司 | 抛光系统及抛光方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5349023A (en) * | 1991-12-12 | 1994-09-20 | Kuraray Co., Ltd. | Vinyl alcohol copolymer having terminal amino group |
JP3996314B2 (ja) | 1999-03-26 | 2007-10-24 | 三洋化成工業株式会社 | 研磨用砥粒分散剤および研磨用スラリー |
JP2001240850A (ja) | 2000-02-29 | 2001-09-04 | Sanyo Chem Ind Ltd | 研磨用砥粒分散剤および研磨用スラリー |
JP4076012B2 (ja) | 2002-04-10 | 2008-04-16 | 株式会社日本触媒 | 化学機械研磨用水系分散体 |
US7378479B2 (en) * | 2002-09-13 | 2008-05-27 | Lubrizol Advanced Materials, Inc. | Multi-purpose polymers, methods and compositions |
US20040241130A1 (en) * | 2002-09-13 | 2004-12-02 | Krishnan Tamareselvy | Multi-purpose polymers, methods and compositions |
US8466243B2 (en) * | 2003-07-11 | 2013-06-18 | Sekisui Specialty Chemicals America, Llc | Vinyl alcohol copolymers for use in aqueous dispersions and melt extruded articles |
JP4292117B2 (ja) | 2004-07-15 | 2009-07-08 | Jsr株式会社 | 化学機械研磨用水系分散体及び化学機械研磨方法 |
CN101311205A (zh) * | 2004-07-23 | 2008-11-26 | 日立化成工业株式会社 | Cmp研磨剂以及衬底的研磨方法 |
US20070218811A1 (en) | 2004-09-27 | 2007-09-20 | Hitachi Chemical Co., Ltd. | Cmp polishing slurry and method of polishing substrate |
CN101032001B (zh) | 2004-09-28 | 2011-12-28 | 日立化成工业株式会社 | Cmp抛光剂以及衬底的抛光方法 |
ES2341285T3 (es) * | 2005-07-19 | 2010-06-17 | Nektar Therapeutics | Metodo para preparar maleimidas polimericas. |
RS53847B1 (en) * | 2005-07-29 | 2015-08-31 | Nektar Therapeutics | PROCEDURES FOR OBTAINING POLYMER REAGENTS |
CA2678401A1 (en) * | 2007-02-22 | 2008-08-28 | Biovectra Inc. | Process for purification of water soluble polymers |
JP2009070904A (ja) * | 2007-09-11 | 2009-04-02 | Mitsui Chemicals Inc | 研磨用組成物 |
JP2008147688A (ja) * | 2008-01-15 | 2008-06-26 | Jsr Corp | 化学機械研磨用水系分散体及び化学機械研磨方法 |
KR20100123678A (ko) * | 2008-02-18 | 2010-11-24 | 제이에스알 가부시끼가이샤 | 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법 |
KR101461261B1 (ko) * | 2008-02-18 | 2014-11-12 | 제이에스알 가부시끼가이샤 | 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법 |
JP2010016344A (ja) * | 2008-02-18 | 2010-01-21 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
WO2010036358A1 (en) * | 2008-09-26 | 2010-04-01 | Rhodia Operations | Abrasive compositions for chemical mechanical polishing and methods for using same |
MY154861A (en) * | 2008-12-22 | 2015-08-14 | Kao Corp | Polishing liquid composition for magnetic-disk substrate |
US20130017744A1 (en) * | 2010-03-30 | 2013-01-17 | Daikin Industries, Ltd. | Graft copolymer and repellent composition |
-
2014
- 2014-09-22 KR KR1020167004813A patent/KR102239131B1/ko active IP Right Grant
- 2014-09-22 CN CN201480053941.XA patent/CN105593330B/zh active Active
- 2014-09-22 WO PCT/JP2014/075123 patent/WO2015046163A1/ja active Application Filing
- 2014-09-22 JP JP2015539213A patent/JP5892638B2/ja active Active
- 2014-09-22 EP EP14846825.9A patent/EP3053977B1/en active Active
- 2014-09-22 US US14/917,734 patent/US10227518B2/en active Active
- 2014-09-22 SG SG11201601265YA patent/SG11201601265YA/en unknown
- 2014-09-26 TW TW103133562A patent/TWI617655B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN105593330A (zh) | 2016-05-18 |
KR20160063320A (ko) | 2016-06-03 |
WO2015046163A1 (ja) | 2015-04-02 |
EP3053977A1 (en) | 2016-08-10 |
JPWO2015046163A1 (ja) | 2017-03-09 |
EP3053977B1 (en) | 2019-09-11 |
US20160215189A1 (en) | 2016-07-28 |
US10227518B2 (en) | 2019-03-12 |
TW201525120A (zh) | 2015-07-01 |
JP5892638B2 (ja) | 2016-03-23 |
KR102239131B1 (ko) | 2021-04-12 |
EP3053977A4 (en) | 2017-03-29 |
CN105593330B (zh) | 2018-06-19 |
TWI617655B (zh) | 2018-03-11 |
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