SG11201509762WA - Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device - Google Patents
Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component deviceInfo
- Publication number
- SG11201509762WA SG11201509762WA SG11201509762WA SG11201509762WA SG11201509762WA SG 11201509762W A SG11201509762W A SG 11201509762WA SG 11201509762W A SG11201509762W A SG 11201509762WA SG 11201509762W A SG11201509762W A SG 11201509762WA SG 11201509762W A SG11201509762W A SG 11201509762WA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- heat dissipation
- electronic component
- inorganic particles
- dissipation member
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title 1
- 230000002209 hydrophobic effect Effects 0.000 title 1
- 239000010954 inorganic particle Substances 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/06—Aluminium compounds
- C07F5/069—Aluminium compounds without C-aluminium linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3063—Treatment with low-molecular organic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/82—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by IR- or Raman-data
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/40—Compounds of aluminium
- C09C1/407—Aluminium oxides or hydroxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013114552 | 2013-05-30 | ||
PCT/JP2014/062055 WO2014192499A1 (ja) | 2013-05-30 | 2014-05-01 | 疎水性無機粒子、放熱部材用樹脂組成物および電子部品装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201509762WA true SG11201509762WA (en) | 2015-12-30 |
Family
ID=51988537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201509762WA SG11201509762WA (en) | 2013-05-30 | 2014-05-01 | Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160137772A1 (ja) |
JP (1) | JP6380388B2 (ja) |
KR (1) | KR20160014024A (ja) |
CN (1) | CN105264022A (ja) |
SG (1) | SG11201509762WA (ja) |
TW (1) | TWI503359B (ja) |
WO (1) | WO2014192499A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2700900B2 (es) | 2016-08-05 | 2021-02-08 | Korea Advanced Inst Sci & Tech | Catalizador de reformado seco que usa un soporte de oxido metalico y procedimiento para preparar gas de sintesis usando el mismo |
CN106947298A (zh) * | 2017-03-17 | 2017-07-14 | 苏州大学张家港工业技术研究院 | 一种纳米氧化铝的亲油性改性方法 |
WO2018181601A1 (ja) * | 2017-03-28 | 2018-10-04 | 日立化成株式会社 | 封止用エポキシ樹脂組成物及び電子部品装置 |
WO2018181838A1 (ja) * | 2017-03-31 | 2018-10-04 | Jnc株式会社 | 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法 |
CN112399995B (zh) * | 2018-07-26 | 2022-04-29 | 住友化学株式会社 | 热塑性树脂制结构体 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7803347B2 (en) * | 2005-07-01 | 2010-09-28 | Tohoku Techno Arch Co., Ltd. | Organically modified fine particles |
JP3925932B2 (ja) * | 2004-01-08 | 2007-06-06 | 株式会社 東北テクノアーチ | 有機修飾金属酸化物ナノ粒子の製造法 |
JP5507984B2 (ja) * | 2009-12-09 | 2014-05-28 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物、このエポキシ樹脂組成物が使用された半導体装置、このエポキシ樹脂組成物の製造方法 |
JP2011236110A (ja) * | 2010-04-12 | 2011-11-24 | Nitto Denko Corp | 有機無機複合粒子、粒子分散液、粒子分散樹脂組成物および有機無機複合粒子の製造方法 |
JP5589856B2 (ja) * | 2011-01-07 | 2014-09-17 | 信越化学工業株式会社 | 透明性に優れる熱伝導性シリコーン組成物及び硬化物 |
JP2012253151A (ja) * | 2011-06-01 | 2012-12-20 | Toyota Industries Corp | 電子機器 |
KR20160016916A (ko) * | 2013-05-30 | 2016-02-15 | 스미또모 베이크라이트 가부시키가이샤 | 소수성 무기 입자, 방열 부재용 수지 조성물 및 전자 부품 장치 |
JP6380386B2 (ja) * | 2013-05-30 | 2018-08-29 | 住友ベークライト株式会社 | 放熱部材用樹脂組成物および電子部品装置 |
-
2014
- 2014-05-01 WO PCT/JP2014/062055 patent/WO2014192499A1/ja active Application Filing
- 2014-05-01 SG SG11201509762WA patent/SG11201509762WA/en unknown
- 2014-05-01 CN CN201480031365.9A patent/CN105264022A/zh active Pending
- 2014-05-01 JP JP2015519758A patent/JP6380388B2/ja not_active Expired - Fee Related
- 2014-05-01 KR KR1020157036794A patent/KR20160014024A/ko not_active Application Discontinuation
- 2014-05-01 US US14/894,604 patent/US20160137772A1/en not_active Abandoned
- 2014-05-06 TW TW103116055A patent/TWI503359B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN105264022A (zh) | 2016-01-20 |
WO2014192499A1 (ja) | 2014-12-04 |
KR20160014024A (ko) | 2016-02-05 |
US20160137772A1 (en) | 2016-05-19 |
JP6380388B2 (ja) | 2018-08-29 |
TWI503359B (zh) | 2015-10-11 |
JPWO2014192499A1 (ja) | 2017-02-23 |
TW201504303A (zh) | 2015-02-01 |
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