SG11201509760SA - Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device - Google Patents

Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device

Info

Publication number
SG11201509760SA
SG11201509760SA SG11201509760SA SG11201509760SA SG11201509760SA SG 11201509760S A SG11201509760S A SG 11201509760SA SG 11201509760S A SG11201509760S A SG 11201509760SA SG 11201509760S A SG11201509760S A SG 11201509760SA SG 11201509760S A SG11201509760S A SG 11201509760SA
Authority
SG
Singapore
Prior art keywords
resin composition
heat dissipation
electronic component
inorganic particles
dissipation member
Prior art date
Application number
SG11201509760SA
Inventor
Shigeyuki Maeda
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG11201509760SA publication Critical patent/SG11201509760SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3063—Treatment with low-molecular organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/40—Compounds of aluminium
    • C09C1/407—Aluminium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/10—Treatment with macromolecular organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/82—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by IR- or Raman-data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
SG11201509760SA 2013-05-30 2014-03-31 Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device SG11201509760SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013114549 2013-05-30
PCT/JP2014/059415 WO2014192402A1 (en) 2013-05-30 2014-03-31 Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device

Publications (1)

Publication Number Publication Date
SG11201509760SA true SG11201509760SA (en) 2015-12-30

Family

ID=51988444

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201509760SA SG11201509760SA (en) 2013-05-30 2014-03-31 Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device

Country Status (7)

Country Link
US (1) US20160122550A1 (en)
JP (1) JP6380386B2 (en)
KR (1) KR20160014021A (en)
CN (1) CN105264021B (en)
SG (1) SG11201509760SA (en)
TW (1) TWI564331B (en)
WO (1) WO2014192402A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160014024A (en) * 2013-05-30 2016-02-05 스미또모 베이크라이트 가부시키가이샤 Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device
WO2016166823A1 (en) * 2015-04-15 2016-10-20 住友ベークライト株式会社 Method for producing organic compound modified inorganic filler and organic compound modified inorganic filler
US10030186B2 (en) * 2016-08-29 2018-07-24 Quantum Technology Group Limited Heat transfer medium
CN106947298A (en) * 2017-03-17 2017-07-14 苏州大学张家港工业技术研究院 A kind of lipophile method of modifying of nano aluminium oxide
WO2020105215A1 (en) * 2018-11-20 2020-05-28 太陽インキ製造株式会社 High-withstand-voltage, heat-dissipating, insulating resin composition and electronic component in which same is used
GB2583893B (en) * 2019-03-29 2022-11-09 Salts Healthcare Ltd Polymeric films
CN114456787A (en) * 2020-10-21 2022-05-10 中国石油化工股份有限公司 Double-group modified water-based nano silicon material and preparation method and application thereof
CN116218586A (en) * 2023-02-01 2023-06-06 河北鑫达能源股份有限公司 Lubricating oil and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3925932B2 (en) * 2004-01-08 2007-06-06 株式会社 東北テクノアーチ Method for producing organically modified metal oxide nanoparticles
US7803347B2 (en) * 2005-07-01 2010-09-28 Tohoku Techno Arch Co., Ltd. Organically modified fine particles
JP5507984B2 (en) * 2009-12-09 2014-05-28 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation, semiconductor device using this epoxy resin composition, and method for producing this epoxy resin composition
JP5612953B2 (en) * 2010-04-12 2014-10-22 日東電工株式会社 Particle, particle dispersion, particle-dispersed resin composition, and resin molded body
JP2011236110A (en) * 2010-04-12 2011-11-24 Nitto Denko Corp Method for producing organic-inorganic composite particle, particle dispersion, particle-dispersed resin composition, and method for producing organic-inorganic composite particle
JP5589856B2 (en) * 2011-01-07 2014-09-17 信越化学工業株式会社 Thermally conductive silicone composition and cured product excellent in transparency
JP5854041B2 (en) * 2011-03-31 2016-02-09 住友ベークライト株式会社 Silicone rubber-based curable composition, method for producing silicone rubber-based curable composition, method for producing silicone rubber, silicone rubber, molded article, and medical tube
JP2012253151A (en) * 2011-06-01 2012-12-20 Toyota Industries Corp Electronic device

Also Published As

Publication number Publication date
US20160122550A1 (en) 2016-05-05
TW201502182A (en) 2015-01-16
TWI564331B (en) 2017-01-01
JPWO2014192402A1 (en) 2017-02-23
JP6380386B2 (en) 2018-08-29
CN105264021B (en) 2018-04-10
WO2014192402A1 (en) 2014-12-04
CN105264021A (en) 2016-01-20
KR20160014021A (en) 2016-02-05

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