SG11201509761VA - Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device - Google Patents
Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component deviceInfo
- Publication number
- SG11201509761VA SG11201509761VA SG11201509761VA SG11201509761VA SG11201509761VA SG 11201509761V A SG11201509761V A SG 11201509761VA SG 11201509761V A SG11201509761V A SG 11201509761VA SG 11201509761V A SG11201509761V A SG 11201509761VA SG 11201509761V A SG11201509761V A SG 11201509761VA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- heat dissipation
- electronic component
- inorganic particles
- dissipation member
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title 1
- 230000002209 hydrophobic effect Effects 0.000 title 1
- 239000010954 inorganic particle Substances 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/06—Aluminium compounds
- C07F5/069—Aluminium compounds without C-aluminium linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/025—Silicon compounds without C-silicon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/82—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by IR- or Raman-data
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/84—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by UV- or VIS- data
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013114550 | 2013-05-30 | ||
PCT/JP2014/061536 WO2014192472A1 (en) | 2013-05-30 | 2014-04-24 | Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201509761VA true SG11201509761VA (en) | 2015-12-30 |
Family
ID=51988511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201509761VA SG11201509761VA (en) | 2013-05-30 | 2014-04-24 | Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160102109A1 (en) |
JP (1) | JP6380387B2 (en) |
KR (1) | KR20160016916A (en) |
CN (1) | CN105246983B (en) |
SG (1) | SG11201509761VA (en) |
TW (1) | TWI499628B (en) |
WO (1) | WO2014192472A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6380388B2 (en) * | 2013-05-30 | 2018-08-29 | 住友ベークライト株式会社 | Resin composition for heat dissipation member and electronic component device |
JP6404103B2 (en) * | 2014-12-09 | 2018-10-10 | 積水化学工業株式会社 | Thermally conductive composition |
CN104558323B (en) * | 2014-12-22 | 2016-08-24 | 汕头大学 | A kind of highly-water-soluble nano-hexagonal boron nitride and the preparation method of polymer composite aquogel thereof |
EP3368614A1 (en) | 2015-10-30 | 2018-09-05 | Sasol (USA) Corporation | Hydrophobic surface modified aluminas for polymer compositions and method for making thereof |
CN106947298A (en) * | 2017-03-17 | 2017-07-14 | 苏州大学张家港工业技术研究院 | A kind of lipophile method of modifying of nano aluminium oxide |
JP6892811B2 (en) * | 2017-10-02 | 2021-06-23 | 富士フイルム株式会社 | Compositions, heat conductive materials, devices with heat conductive layers |
US11181323B2 (en) * | 2019-02-21 | 2021-11-23 | Qualcomm Incorporated | Heat-dissipating device with interfacial enhancements |
CN112209354B (en) * | 2019-06-26 | 2021-11-19 | 苏州太湖电工新材料股份有限公司 | Method for preparing hydrophobic hexagonal boron nitride nanosheets |
JP2021015932A (en) * | 2019-07-16 | 2021-02-12 | 住友ベークライト株式会社 | Sealing resin composition and mold coil |
WO2021048977A1 (en) * | 2019-09-12 | 2021-03-18 | 昭和電工マテリアルズ株式会社 | Sealing material for compression molding and electronic component device |
CN114456787A (en) * | 2020-10-21 | 2022-05-10 | 中国石油化工股份有限公司 | Double-group modified water-based nano silicon material and preparation method and application thereof |
KR102280280B1 (en) * | 2021-02-24 | 2021-07-21 | 레이져라이팅(주) | Painting Composition having heat dissipation and LED Lamp Device by employing the same |
CN113897000B (en) * | 2021-11-12 | 2023-08-22 | 江苏越升科技股份有限公司 | Antimicrobial inorganic particles, and preparation method and application thereof |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6391082B1 (en) * | 1999-07-02 | 2002-05-21 | Holl Technologies Company | Composites of powdered fillers and polymer matrix |
CN100341938C (en) * | 2000-07-18 | 2007-10-10 | 京瓷化成株式会社 | Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board |
JP2004067828A (en) * | 2002-08-05 | 2004-03-04 | Nippon Perunotsukusu Kk | Epoxy resin powder coating |
JP3925932B2 (en) * | 2004-01-08 | 2007-06-06 | 株式会社 東北テクノアーチ | Method for producing organically modified metal oxide nanoparticles |
US7803347B2 (en) * | 2005-07-01 | 2010-09-28 | Tohoku Techno Arch Co., Ltd. | Organically modified fine particles |
JP4961677B2 (en) * | 2005-03-28 | 2012-06-27 | 富士ゼロックス株式会社 | Flame retardant epoxy resin composition and electronic component device, laminated board, multilayer circuit board and printed wiring board using the same |
JP5507984B2 (en) * | 2009-12-09 | 2014-05-28 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation, semiconductor device using this epoxy resin composition, and method for producing this epoxy resin composition |
JP2011236110A (en) * | 2010-04-12 | 2011-11-24 | Nitto Denko Corp | Method for producing organic-inorganic composite particle, particle dispersion, particle-dispersed resin composition, and method for producing organic-inorganic composite particle |
JP5589856B2 (en) * | 2011-01-07 | 2014-09-17 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product excellent in transparency |
JP2012253151A (en) * | 2011-06-01 | 2012-12-20 | Toyota Industries Corp | Electronic device |
-
2014
- 2014-04-24 JP JP2015519745A patent/JP6380387B2/en not_active Expired - Fee Related
- 2014-04-24 SG SG11201509761VA patent/SG11201509761VA/en unknown
- 2014-04-24 CN CN201480031342.8A patent/CN105246983B/en not_active Expired - Fee Related
- 2014-04-24 KR KR1020157036817A patent/KR20160016916A/en not_active Application Discontinuation
- 2014-04-24 US US14/894,749 patent/US20160102109A1/en not_active Abandoned
- 2014-04-24 WO PCT/JP2014/061536 patent/WO2014192472A1/en active Application Filing
- 2014-04-29 TW TW103115257A patent/TWI499628B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN105246983A (en) | 2016-01-13 |
WO2014192472A1 (en) | 2014-12-04 |
TWI499628B (en) | 2015-09-11 |
JP6380387B2 (en) | 2018-08-29 |
CN105246983B (en) | 2017-10-24 |
TW201504302A (en) | 2015-02-01 |
KR20160016916A (en) | 2016-02-15 |
JPWO2014192472A1 (en) | 2017-02-23 |
US20160102109A1 (en) | 2016-04-14 |
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