SG11201508619VA - Silicon wafer for solar cells and method for producing same - Google Patents
Silicon wafer for solar cells and method for producing sameInfo
- Publication number
- SG11201508619VA SG11201508619VA SG11201508619VA SG11201508619VA SG11201508619VA SG 11201508619V A SG11201508619V A SG 11201508619VA SG 11201508619V A SG11201508619V A SG 11201508619VA SG 11201508619V A SG11201508619V A SG 11201508619VA SG 11201508619V A SG11201508619V A SG 11201508619VA
- Authority
- SG
- Singapore
- Prior art keywords
- silicon wafer
- solar cells
- producing same
- producing
- same
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Photovoltaic Devices (AREA)
- Weting (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- General Chemical & Material Sciences (AREA)
- ing And Chemical Polishing (AREA)
- Chemical Kinetics & Catalysis (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013094163 | 2013-04-26 | ||
| JP2014009159A JP5868437B2 (ja) | 2013-04-26 | 2014-01-22 | 太陽電池用シリコンウエハーの製造方法 |
| PCT/JP2014/060349 WO2014175072A1 (ja) | 2013-04-26 | 2014-04-09 | 太陽電池用シリコンウエハー及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201508619VA true SG11201508619VA (en) | 2015-12-30 |
Family
ID=51791652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201508619VA SG11201508619VA (en) | 2013-04-26 | 2014-04-09 | Silicon wafer for solar cells and method for producing same |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5868437B2 (ko) |
| KR (1) | KR20160002683A (ko) |
| CN (1) | CN105144351B (ko) |
| SG (1) | SG11201508619VA (ko) |
| TW (1) | TW201444955A (ko) |
| WO (1) | WO2014175072A1 (ko) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014232829A (ja) * | 2013-05-30 | 2014-12-11 | 日本化成株式会社 | 太陽電池用シリコンウエハーの製造方法 |
| JP6898737B2 (ja) * | 2014-12-15 | 2021-07-07 | シャープ株式会社 | 半導体基板の製造方法、光電変換素子の製造方法および光電変換素子 |
| TWI538986B (zh) * | 2015-07-15 | 2016-06-21 | 綠能科技股份有限公司 | 蝕刻液以及矽基板的表面粗糙化的方法 |
| CN108369898B (zh) * | 2015-11-23 | 2022-08-23 | 恩特格里斯公司 | 用于相对于氮化硅选择性蚀刻p掺杂多晶硅的组合物及方法 |
| CN108183067A (zh) * | 2018-01-05 | 2018-06-19 | 苏州同冠微电子有限公司 | 一种半导体晶圆的处理方法 |
| CN111748806B (zh) * | 2020-07-21 | 2022-08-23 | 江苏悦锌达新材料有限公司 | 一种用于聚苯硫醚及其复合材料的粗化液及其制备方法和使用方法 |
| CN112233967B (zh) * | 2020-10-15 | 2024-05-03 | 扬州扬杰电子科技股份有限公司 | 一种改善背面金属与衬底Si脱落异常的加工方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09270400A (ja) | 1996-01-31 | 1997-10-14 | Shin Etsu Handotai Co Ltd | 半導体ウェーハの製造方法 |
| JP4024934B2 (ja) | 1998-08-10 | 2007-12-19 | 住友電気工業株式会社 | ワイヤーソー及びその製造方法 |
| DE19962136A1 (de) * | 1999-12-22 | 2001-06-28 | Merck Patent Gmbh | Verfahren zur Rauhätzung von Siliziumsolarzellen |
| EP1295320A2 (en) | 2000-06-30 | 2003-03-26 | MEMC Electronic Materials, Inc. | Process for etching silicon wafers |
| JP2004063954A (ja) | 2002-07-31 | 2004-02-26 | Sumitomo Mitsubishi Silicon Corp | シリコンウェーハのエッチング方法及びこの方法を用いたシリコンウェーハの表裏面差別化方法 |
| JP3870896B2 (ja) * | 2002-12-11 | 2007-01-24 | 株式会社デンソー | 半導体装置の製造方法およびそれにより製造される半導体装置 |
| WO2005036629A1 (ja) | 2003-10-10 | 2005-04-21 | Mimasu Semiconductor Industry Co., Ltd. | ウェーハの粗面処理方法 |
| JP4430488B2 (ja) | 2004-09-02 | 2010-03-10 | シャープ株式会社 | 太陽電池及びその製造方法 |
| JP4766880B2 (ja) * | 2005-01-18 | 2011-09-07 | シャープ株式会社 | 結晶シリコンウエハ、結晶シリコン太陽電池、結晶シリコンウエハの製造方法および結晶シリコン太陽電池の製造方法 |
| US8222118B2 (en) * | 2008-12-15 | 2012-07-17 | Intel Corporation | Wafer backside grinding with stress relief |
| SG178834A1 (en) * | 2009-09-21 | 2012-04-27 | Basf Se | Aqueous acidic etching solution and method for texturing the surface of single crystal and polycrystal silicon substrates |
| DE102010012044A1 (de) * | 2010-03-19 | 2011-09-22 | Friedrich-Schiller-Universität Jena | Strukturierte Siliziumschicht für ein optoelektronisches Bauelement und optoelektronisches Bauelement |
| JP2011255475A (ja) | 2010-06-11 | 2011-12-22 | Takatori Corp | 固定砥粒ワイヤ |
| JP2012024866A (ja) | 2010-07-21 | 2012-02-09 | Sumco Corp | ワイヤソー切断スラッジの回収方法およびその装置 |
| KR101657626B1 (ko) * | 2010-10-08 | 2016-09-19 | 주식회사 원익아이피에스 | 태양전지제조방법 및 그 방법에 의하여 제조된 태양전지 |
| WO2012102368A1 (ja) * | 2011-01-27 | 2012-08-02 | 京セラ株式会社 | 太陽電池素子の製造方法、太陽電池素子、および太陽電池モジュール |
| JP2012169420A (ja) * | 2011-02-14 | 2012-09-06 | Sumco Corp | 太陽電池用ウェーハの製造方法、太陽電池セルの製造方法および太陽電池モジュールの製造方法 |
| JP2012222300A (ja) * | 2011-04-13 | 2012-11-12 | Panasonic Corp | テクスチャ形成面を有するシリコン基板、およびその製造方法 |
| JP5780856B2 (ja) | 2011-06-30 | 2015-09-16 | 京セラ株式会社 | 積層セラミックコンデンサ |
| JP2013043268A (ja) | 2011-08-26 | 2013-03-04 | Sharp Corp | 固定砥粒ワイヤおよび半導体基板の製造方法 |
-
2014
- 2014-01-22 JP JP2014009159A patent/JP5868437B2/ja not_active Expired - Fee Related
- 2014-04-09 KR KR1020157022409A patent/KR20160002683A/ko not_active Application Discontinuation
- 2014-04-09 WO PCT/JP2014/060349 patent/WO2014175072A1/ja active Application Filing
- 2014-04-09 SG SG11201508619VA patent/SG11201508619VA/en unknown
- 2014-04-09 CN CN201480023748.1A patent/CN105144351B/zh not_active Expired - Fee Related
- 2014-04-18 TW TW103114268A patent/TW201444955A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014175072A1 (ja) | 2014-10-30 |
| TW201444955A (zh) | 2014-12-01 |
| CN105144351A (zh) | 2015-12-09 |
| KR20160002683A (ko) | 2016-01-08 |
| JP5868437B2 (ja) | 2016-02-24 |
| CN105144351B (zh) | 2017-09-26 |
| JP2014225633A (ja) | 2014-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3054488A4 (en) | SOLAR CELL, SOLAR CELL MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR MANUFACTURING METHOD | |
| PL3044817T3 (pl) | Ogniwo słoneczne o strukturze odwróconej i sposób jego wytwarzania | |
| EP2913921A4 (en) | SOLAR CELL DEVICE AND METHOD FOR THE PRODUCTION THEREOF | |
| EP2863440A4 (en) | SEMICONDUCTOR DEVICE WITH SILICON CARBIDE AND METHOD FOR MANUFACTURING THE SAME | |
| EP2863417A4 (en) | SILICON CARBIDE SEMICONDUCTOR ELEMENT AND METHOD FOR THE PRODUCTION THEREOF | |
| EP2789011A4 (en) | SEMICONDUCTOR MODULES AND METHODS OF FORMING THE SAME | |
| SG11201701356WA (en) | Solar cell and method for producing thereof | |
| PT3012875T (pt) | Célula solar e método de fabricação | |
| EP2806461A4 (en) | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME | |
| EP2827382A4 (en) | SOLAR CELL AND METHOD FOR THE PRODUCTION THEREOF | |
| PL2994946T3 (pl) | Sposób wytwarzania fotowoltaicznego urządzenia przy pomocy perowskitów | |
| EP2999017A4 (en) | ORGANIC PHOTOVOLTAIC CELL AND METHOD FOR PRODUCING THE SAME | |
| EP2937910A4 (en) | SOLAR CELL AND METHOD FOR PRODUCING SAME | |
| SG11201508619VA (en) | Silicon wafer for solar cells and method for producing same | |
| EP2851938A4 (en) | SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR | |
| GB201213673D0 (en) | Semiconductor device and fabrication method | |
| SG11201507962XA (en) | Method for polishing silicon wafer and method for producing epitaxial wafer | |
| EP2963689A4 (en) | SOLAR CELL MODULE AND METHOD FOR THE PRODUCTION THEREOF | |
| SG11201404426YA (en) | Semiconductor device and method for producing same | |
| EP3010053A4 (en) | Organic photovoltaic cell and method for manufacturing same | |
| SG11201506429SA (en) | Epitaxial silicon wafer and method for manufacturing same | |
| EP2988337A4 (en) | SOLAR CELL AND METHOD FOR PRODUCING A SOLAR CELL | |
| EP2835828A4 (en) | SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | |
| EP2993690A4 (en) | Silicon carbide semiconductor device and method for producing silicon carbide semiconductor device | |
| EP3061727A4 (en) | Method for manufacturing polycrystalline silicon |