SG11201502291VA - Resin composition, cured film, laminated film, and method for manufacturing semiconductor device - Google Patents

Resin composition, cured film, laminated film, and method for manufacturing semiconductor device

Info

Publication number
SG11201502291VA
SG11201502291VA SG11201502291VA SG11201502291VA SG11201502291VA SG 11201502291V A SG11201502291V A SG 11201502291VA SG 11201502291V A SG11201502291V A SG 11201502291VA SG 11201502291V A SG11201502291V A SG 11201502291VA SG 11201502291V A SG11201502291V A SG 11201502291VA
Authority
SG
Singapore
Prior art keywords
semiconductor device
resin composition
manufacturing semiconductor
film
laminated film
Prior art date
Application number
SG11201502291VA
Other languages
English (en)
Inventor
Takuo Watanabe
Chungseon Lee
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201502291VA publication Critical patent/SG11201502291VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C08L61/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/32—Modified amine-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulating Bodies (AREA)
SG11201502291VA 2012-09-25 2013-09-25 Resin composition, cured film, laminated film, and method for manufacturing semiconductor device SG11201502291VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012210689 2012-09-25
PCT/JP2013/075886 WO2014050878A1 (ja) 2012-09-25 2013-09-25 樹脂組成物、硬化膜、積層フィルム、および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
SG11201502291VA true SG11201502291VA (en) 2015-05-28

Family

ID=50388273

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201502291VA SG11201502291VA (en) 2012-09-25 2013-09-25 Resin composition, cured film, laminated film, and method for manufacturing semiconductor device

Country Status (8)

Country Link
US (1) US9716026B2 (zh)
EP (1) EP2902447B1 (zh)
JP (1) JP6303503B2 (zh)
KR (1) KR101950260B1 (zh)
CN (1) CN104662097B (zh)
SG (1) SG11201502291VA (zh)
TW (1) TWI615422B (zh)
WO (1) WO2014050878A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102122278B1 (ko) 2014-02-26 2020-06-15 도레이 카부시키가이샤 폴리이미드 수지, 이것을 이용한 수지 조성물 및 적층 필름
CN110734736B (zh) * 2014-08-08 2022-04-19 东丽株式会社 临时粘接用粘合剂、粘合剂层、晶片加工体及使用其的半导体器件的制造方法
WO2017073507A1 (ja) * 2015-10-29 2017-05-04 東レ株式会社 仮貼り用積層体フィルム、仮貼り用積層体フィルムを用いた基板加工体および積層基板加工体の製造方法、ならびにこれらを用いた半導体装置の製造方法
EP3379564B1 (en) * 2015-11-16 2020-10-14 Mitsui Chemicals, Inc. Film composition for semiconductor, manufacturing method for film composition for semiconductor, manufacturing method for semiconductor member, manufacturing method for process material for semiconductor, and semiconductor device
CN110050013B (zh) * 2016-12-08 2022-11-29 日产化学株式会社 剥离层的制造方法
US11018341B2 (en) * 2017-03-15 2021-05-25 Nec Corporation Binder composition for secondary battery
JP7111031B2 (ja) * 2018-03-23 2022-08-02 信越化学工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
JP2019172892A (ja) * 2018-03-29 2019-10-10 信越化学工業株式会社 シリコーン変性ポリイミド樹脂組成物
CN108997581A (zh) * 2018-09-12 2018-12-14 北京工商大学 一种含硅聚酰亚胺型高分子成炭剂及其制备方法
CN113219796A (zh) * 2020-01-21 2021-08-06 新应材股份有限公司 移除方法、积层体、形成方法、聚酰亚胺树脂及剥离液
CN115210320A (zh) * 2020-09-21 2022-10-18 株式会社Lg化学 制造柔性显示装置用复合基底、使用其的制造柔性显示装置的方法和柔性显示装置用层合体

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3740305A (en) * 1971-10-01 1973-06-19 Gen Electric Composite materials bonded with siloxane containing polyimides
JP3057872B2 (ja) 1992-01-24 2000-07-04 東レ株式会社 耐熱性接着材料
JP3721768B2 (ja) * 1997-01-24 2005-11-30 宇部興産株式会社 感光性ポリイミドシロキサン組成物および絶縁膜
JP3968885B2 (ja) * 1998-05-14 2007-08-29 日本メクトロン株式会社 感光性組成物
EP1266926B1 (en) * 2000-02-01 2007-05-23 Nippon Steel Chemical Co., Ltd. Adhesive polyimide resin and adhesive laminate
JP4120780B2 (ja) * 2002-07-19 2008-07-16 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂の製造方法
CN1311039C (zh) * 2003-01-31 2007-04-18 帝人株式会社 粘合片材和层合体
JP2004277619A (ja) 2003-03-18 2004-10-07 Sumitomo Bakelite Co Ltd ポリイミド樹脂及び半導体接着テープ
TWI360565B (en) * 2003-07-09 2012-03-21 Toray Industries Photosensitive resin precursor composition
JP4595412B2 (ja) 2003-07-09 2010-12-08 東レ株式会社 感光性樹脂前駆体組成物
JP4656845B2 (ja) 2003-08-27 2011-03-23 リンテック株式会社 ポリシルセスキオキサングラフト重合体、その製造方法及び粘着剤
JP5030425B2 (ja) * 2004-01-20 2012-09-19 旭化成イーマテリアルズ株式会社 樹脂及び樹脂組成物
JP4530284B2 (ja) * 2004-10-07 2010-08-25 信越化学工業株式会社 ポリイミド系光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜
JP2007314647A (ja) * 2006-05-25 2007-12-06 Toray Ind Inc インクジェット用熱硬化性樹脂組成物、耐熱性樹脂膜の形成方法およびそれを用いた電子部品
JP5030055B2 (ja) 2007-06-13 2012-09-19 綜研化学株式会社 耐熱性粘着剤組成物
KR101588364B1 (ko) * 2007-12-14 2016-01-25 닛산 가가쿠 고교 가부시키 가이샤 폴리히드록시이미드의 제조방법 및 그 제조방법으로부터 얻어진 폴리히드록시이미드를 함유하는 포지티브형 감광성 수지 조성물
TWI516527B (zh) * 2009-12-10 2016-01-11 信越化學工業股份有限公司 光固化性樹脂組成物，圖案形成法和基板保護膜，以及使用該組成物之膜狀黏著劑及黏著片
JP5417623B2 (ja) * 2009-12-10 2014-02-19 信越化学工業株式会社 ポリイミド系光硬化性樹脂組成物、パターン形成方法及び基板保護用皮膜

Also Published As

Publication number Publication date
US20150228527A1 (en) 2015-08-13
CN104662097A (zh) 2015-05-27
EP2902447B1 (en) 2020-10-28
TW201420641A (zh) 2014-06-01
JP6303503B2 (ja) 2018-04-04
KR101950260B1 (ko) 2019-02-21
WO2014050878A1 (ja) 2014-04-03
TWI615422B (zh) 2018-02-21
EP2902447A4 (en) 2016-04-27
JPWO2014050878A1 (ja) 2016-08-22
CN104662097B (zh) 2018-06-05
KR20150061641A (ko) 2015-06-04
US9716026B2 (en) 2017-07-25
EP2902447A1 (en) 2015-08-05

Similar Documents

Publication Publication Date Title
EP2692759A4 (en) RESIN COMPOSITION, RESIN FOIL, CURED RESIN FOIL, RESIN FOIL LAMINATE, CURED RESIN LAMINATE, AND METHOD OF MANUFACTURING THEM, SEMICONDUCTOR DEVICE, AND LED DEVICE
SG11201502291VA (en) Resin composition, cured film, laminated film, and method for manufacturing semiconductor device
HK1256151A1 (zh) 曝光裝置及曝光方法、以及器件製造方法
PT3339352T (pt) Resina, composição, película curada, método para o fabrico de película curada e dispositivo semicondutor
EP3015487A4 (en) Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and led device
SG11201504441PA (en) Insulating film, method for manufacturing semiconductor device, and semiconductor device
KR102008162B9 (ko) 수지 전구체 및 그것을 함유하는 수지 조성물, 수지 필름 및 그 제조 방법, 그리고, 적층체 및 그 제조 방법
SG11201600907UA (en) Resin sheet for hollow electronic device encapsulation and method for manufacturing hollow electronic device package
SG11201501594UA (en) Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition
SG11201406941TA (en) Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package
EP2905120A4 (en) METHOD FOR MANUFACTURING OPTICAL SUBSTRATE USING FILM MOLD, DEVICE FOR MANUFACTURING AND OPTICAL SUBSTRATE THUS OBTAINED
EP2913841A4 (en) SUBSTRATE BONDING APPARATUS, ALIGNMENT APPARATUS, SUBSTRATE BONDING METHOD, ALIGNMENT METHOD, AND LAMINATED SEMICONDUCTOR DEVICE MANUFACTURING METHOD
SG10201600065TA (en) Method for manufacturing oxide semiconductor film, method for manufacturing semiconductor device, and semiconductor device
SG11201403633QA (en) Resin composition for encapsulation and electronic device using thesame
SG11201505053XA (en) Adhesive agent, adhesive film, and semiconductor device and method for manufacturing same
SG11201600906YA (en) Resin sheet for electronic device encapsulation and method for manufacturing electronic device package
SG11201401908RA (en) Resin composition, resin composition sheet, semiconductor device and method for manufacturing same
HK1212720A1 (zh) 樹脂組合物、預浸料和薄膜
SG11201601300TA (en) Adhesive film and method for manufacturing semiconductor device
SG10201604299YA (en) Resin Composition, Semiconductor Device Using Same, and Method of Manufacturing Semiconductor Device
SG11201405097QA (en) Resin composition and semiconductor device
EP2980176A4 (en) PRODUCTION METHOD FOR LAMINATED FILM, LAMINATED FILM, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE USING THE SAME
EP2735580A4 (en) POLYIMIDE RESIN, RESIN COMPOSITION, AND LAMINATED FILM USING THE SAME
EP2918638A4 (en) SILICONE RESIN COMPOSITION, HARDENED SILICONE RESIN AND SEALANT OPTICAL SEMICONDUCTOR ELEMENT
EP2837668A4 (en) ADHESIVE COMPOSITION, ADHESIVE AND BINDING PROCESS