SG11201408744UA - Workpiece ejection device and workpiece supply device provided with same - Google Patents
Workpiece ejection device and workpiece supply device provided with sameInfo
- Publication number
- SG11201408744UA SG11201408744UA SG11201408744UA SG11201408744UA SG11201408744UA SG 11201408744U A SG11201408744U A SG 11201408744UA SG 11201408744U A SG11201408744U A SG 11201408744UA SG 11201408744U A SG11201408744U A SG 11201408744UA SG 11201408744U A SG11201408744U A SG 11201408744UA
- Authority
- SG
- Singapore
- Prior art keywords
- workpiece
- same
- supply device
- device provided
- ejection device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012146240A JP5992229B2 (ja) | 2012-06-29 | 2012-06-29 | ワーク押出装置およびそれを備えるワーク供給装置 |
| PCT/JP2013/067438 WO2014003029A1 (fr) | 2012-06-29 | 2013-06-26 | Dispositif d'éjection de pièce à usiner et dispositif d'alimentation en pièce à usiner équipé de celui-ci |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201408744UA true SG11201408744UA (en) | 2015-02-27 |
Family
ID=49783170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201408744UA SG11201408744UA (en) | 2012-06-29 | 2013-06-26 | Workpiece ejection device and workpiece supply device provided with same |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JP5992229B2 (fr) |
| KR (1) | KR102070744B1 (fr) |
| CN (1) | CN104395037B (fr) |
| HK (1) | HK1203889A1 (fr) |
| MY (1) | MY171474A (fr) |
| SG (1) | SG11201408744UA (fr) |
| TW (1) | TWI566320B (fr) |
| WO (1) | WO2014003029A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7104081B2 (ja) * | 2020-01-30 | 2022-07-20 | 株式会社鈴木 | ワーク供給装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4742400Y1 (fr) | 1968-12-09 | 1972-12-21 | ||
| JPS606115Y2 (ja) * | 1980-03-18 | 1985-02-26 | 神鋼アルフレツシユ株式会社 | 改装建物用支持枠装置 |
| JPH0447159Y2 (fr) * | 1985-05-14 | 1992-11-06 | ||
| JPS62216243A (ja) * | 1986-03-17 | 1987-09-22 | Tokyo Seimitsu Co Ltd | ウエ−ハ押し出し装置 |
| JPH066115Y2 (ja) * | 1987-03-16 | 1994-02-16 | 東京エレクトロン株式会社 | ウエハ供給装置 |
| JP3238786B2 (ja) * | 1993-03-23 | 2001-12-17 | ローム株式会社 | リードフレーム又はプリント基板の繰り出し装置 |
| JP2000298099A (ja) * | 1999-04-15 | 2000-10-24 | Citizen Watch Co Ltd | 部品検査方法、部品管理方法および部品選別方法 |
| JP3943293B2 (ja) * | 1999-08-17 | 2007-07-11 | 武蔵エンジニアリング株式会社 | 過負荷検出機能を備えたワークフィーダ |
| JP4742400B2 (ja) * | 1999-10-01 | 2011-08-10 | パナソニック株式会社 | プッシャおよびローダ |
| KR100750413B1 (ko) * | 1999-12-16 | 2007-08-21 | 지멘스 악티엔게젤샤프트 | 조립될 기판을 위한 다수의 이송 라인을 포함하는 조립장치 |
| DE10117023A1 (de) * | 2001-04-05 | 2002-10-10 | Bsh Bosch Siemens Hausgeraete | Gargerät |
| US20030002964A1 (en) * | 2001-06-27 | 2003-01-02 | Hee Wee Boon | Handler system incorporating a semi-automatic tray replacement apparatus and method of use |
| JP4278584B2 (ja) * | 2004-08-03 | 2009-06-17 | 日新工機株式会社 | プール床の昇降装置 |
| ATE554018T1 (de) * | 2009-08-17 | 2012-05-15 | Tetra Laval Holdings & Finance | MEHRSCHICHTFOLIEN-VERPACKUNGSMATERIAL ZUR HERSTELLUNG VERSIEGELTER VERPACKUNGEN FÜR GIEßBARE LEBENSMITTELPRODUKTE |
-
2012
- 2012-06-29 JP JP2012146240A patent/JP5992229B2/ja active Active
-
2013
- 2013-06-26 WO PCT/JP2013/067438 patent/WO2014003029A1/fr active Application Filing
- 2013-06-26 SG SG11201408744UA patent/SG11201408744UA/en unknown
- 2013-06-26 MY MYPI2014704044A patent/MY171474A/en unknown
- 2013-06-26 KR KR1020157002348A patent/KR102070744B1/ko active IP Right Grant
- 2013-06-26 CN CN201380034695.9A patent/CN104395037B/zh active Active
- 2013-06-28 TW TW102123222A patent/TWI566320B/zh active
-
2015
- 2015-05-08 HK HK15104374.1A patent/HK1203889A1/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR102070744B1 (ko) | 2020-01-29 |
| JP2014008567A (ja) | 2014-01-20 |
| TW201409600A (zh) | 2014-03-01 |
| CN104395037B (zh) | 2017-02-22 |
| MY171474A (en) | 2019-10-15 |
| CN104395037A (zh) | 2015-03-04 |
| WO2014003029A1 (fr) | 2014-01-03 |
| HK1203889A1 (en) | 2015-11-06 |
| JP5992229B2 (ja) | 2016-09-14 |
| TWI566320B (zh) | 2017-01-11 |
| KR20150021130A (ko) | 2015-02-27 |
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