SG11201405089WA - Large area imprint lithography - Google Patents
Large area imprint lithographyInfo
- Publication number
- SG11201405089WA SG11201405089WA SG11201405089WA SG11201405089WA SG11201405089WA SG 11201405089W A SG11201405089W A SG 11201405089WA SG 11201405089W A SG11201405089W A SG 11201405089WA SG 11201405089W A SG11201405089W A SG 11201405089WA SG 11201405089W A SG11201405089W A SG 11201405089WA
- Authority
- SG
- Singapore
- Prior art keywords
- large area
- imprint lithography
- area imprint
- lithography
- imprint
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261601632P | 2012-02-22 | 2012-02-22 | |
PCT/US2013/027396 WO2013126750A1 (en) | 2012-02-22 | 2013-02-22 | Large area imprint lithography |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201405089WA true SG11201405089WA (en) | 2014-09-26 |
Family
ID=47833433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201405089WA SG11201405089WA (en) | 2012-02-22 | 2013-02-22 | Large area imprint lithography |
Country Status (8)
Country | Link |
---|---|
US (1) | US9616614B2 (zh) |
EP (1) | EP2823356B1 (zh) |
JP (1) | JP6130404B2 (zh) |
KR (1) | KR101690532B1 (zh) |
CN (2) | CN109407463B (zh) |
SG (1) | SG11201405089WA (zh) |
TW (1) | TWI574912B (zh) |
WO (1) | WO2013126750A1 (zh) |
Families Citing this family (42)
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JP5828626B2 (ja) * | 2010-10-04 | 2015-12-09 | キヤノン株式会社 | インプリント方法 |
JP6207997B2 (ja) * | 2013-01-30 | 2017-10-04 | 株式会社Screenホールディングス | パターン形成装置およびパターン形成方法 |
US9385089B2 (en) | 2013-01-30 | 2016-07-05 | Seagate Technology Llc | Alignment mark recovery with reduced topography |
US9343089B2 (en) * | 2013-03-08 | 2016-05-17 | Seagate Technology Llc | Nanoimprint lithography for thin film heads |
US9144818B2 (en) | 2013-03-13 | 2015-09-29 | Illinois Tool Works Inc. | Method and apparatus for dispensing a viscous material on a substrate |
SG11201505712VA (en) | 2013-03-15 | 2015-08-28 | Canon Nanotechnologies Inc | Nano imprinting with reusable polymer template with metallic or oxide coating |
CN105684126A (zh) * | 2013-10-22 | 2016-06-15 | 应用材料公司 | 具有主动对准的卷对卷无掩模光刻 |
WO2015069279A1 (en) * | 2013-11-08 | 2015-05-14 | Empire Technology Development Llc | Apparatus and methods for detecting substrate alignment during a printing process |
JP6371076B2 (ja) * | 2014-02-24 | 2018-08-08 | 旭化成株式会社 | フィルム状モールドの製造方法 |
JP6076946B2 (ja) * | 2014-08-04 | 2017-02-08 | 大日本印刷株式会社 | ローラーインプリント用モールドとインプリント方法およびワイヤーグリッド偏光子とその製造方法 |
JP6685093B2 (ja) * | 2015-07-23 | 2020-04-22 | 旭化成株式会社 | 可撓性基板の伸縮制御システム及び伸縮制御方法 |
JP6807045B2 (ja) * | 2015-09-07 | 2021-01-06 | 大日本印刷株式会社 | インプリント装置及びインプリント方法 |
US10131134B2 (en) | 2015-10-30 | 2018-11-20 | Canon Kabushiki Kaisha | System and method for discharging electrostatic charge in nanoimprint lithography processes |
JP6980002B2 (ja) * | 2016-07-14 | 2021-12-15 | モーフォトニクス ホールディング ベスローテン フェノーツハップMorphotonics Holding B.V. | 可撓性のスタンプによって個別の基板をインプリントするための装置 |
JP7041121B2 (ja) * | 2016-08-03 | 2022-03-23 | ボード オブ リージェンツ,ザ ユニバーシティ オブ テキサス システム | 半導体平坦化用及びインプリントリソグラフィ用ウェハスケールプログラマブル膜 |
JP2017034276A (ja) * | 2016-10-20 | 2017-02-09 | 大日本印刷株式会社 | インプリント用モールドとインプリント方法 |
JP6925423B2 (ja) * | 2016-12-02 | 2021-08-25 | モレキュラー インプリンツ, インコーポレイテッドMolecular Imprints,Inc. | インプリントリソグラフィプロセスにおける光学層の構成 |
CN107797379A (zh) * | 2017-02-23 | 2018-03-13 | 常州华威新材料有限公司 | 一种紫外光微纳米压印技术制备拉丝膜的方法 |
CN107097549A (zh) * | 2017-03-20 | 2017-08-29 | 佛山市高明绿色德化工有限公司 | 一种利用uv油墨转印金属拉丝效果膜的工艺及uv油墨 |
CA3064832C (en) * | 2017-05-25 | 2024-04-09 | Magic Leap, Inc. | Double-sided imprinting |
CN109551754A (zh) * | 2017-09-25 | 2019-04-02 | 长春工业大学 | 一种超声辅助辊对辊热纳米压印装置及方法 |
CN107608177B (zh) * | 2017-10-22 | 2024-01-02 | 长春工业大学 | 一种制造超大面积纳米压印无缝图案的装置及方法 |
JP7223008B2 (ja) | 2018-01-26 | 2023-02-15 | モーフォトニクス ホールディング ベスローテン フェノーツハップ | 個別基材にテクスチャ付けするためのプロセスおよび装置 |
KR102574036B1 (ko) * | 2018-02-28 | 2023-09-04 | 삼성디스플레이 주식회사 | 임프린팅 장치 및 이를 이용한 임프린팅 방법 |
US11927883B2 (en) | 2018-03-30 | 2024-03-12 | Canon Kabushiki Kaisha | Method and apparatus to reduce variation of physical attribute of droplets using performance characteristic of dispensers |
KR102703555B1 (ko) * | 2018-04-24 | 2024-09-12 | 주식회사 엠씨넷 | 심라인 제어가 우수한 대면적 복제몰드의 제조방법 및 이로부터 제조된 대면적 복제몰드 |
EP3633453B1 (de) * | 2018-10-03 | 2023-12-27 | ZKW Group GmbH | Verfahren zur herstellung von (sub-)mikrostrukturen auf gewölbten flächen eines optischen bauteils |
JP7417600B2 (ja) | 2018-10-12 | 2024-01-18 | モーフォトニクス ホールディング ベスローテン フェノーツハップ | 調整可能な高い寸法安定性を有するフレキシブルスタンプ |
CN109597278A (zh) * | 2019-02-01 | 2019-04-09 | 集美大学 | 光功能织构薄膜的压印装置及压印方法 |
US20220229361A1 (en) * | 2019-05-13 | 2022-07-21 | Board Of Regents, The University Of Texas System | Roll-to-roll nanoimprint lithography tools and processes |
JP7343176B2 (ja) * | 2019-08-09 | 2023-09-12 | Aiメカテック株式会社 | 微細構造転写装置 |
CN110989293B (zh) * | 2019-12-18 | 2022-04-12 | 京东方科技集团股份有限公司 | 纳米压印结构、其控制方法、纳米压印装置及构图方法 |
WO2021182532A1 (ja) * | 2020-03-11 | 2021-09-16 | Scivax株式会社 | インプリント装置 |
JP6998417B2 (ja) * | 2020-03-31 | 2022-01-18 | 旭化成株式会社 | 可撓性基板 |
US11590688B2 (en) * | 2020-07-02 | 2023-02-28 | Himax Technologies Limited | Imprinting apparatus |
US11531267B2 (en) * | 2020-07-02 | 2022-12-20 | Himax Technologies Limited | Imprinting apparatus |
JP2023535573A (ja) * | 2020-07-31 | 2023-08-18 | モーフォトニクス ホールディング ベスローテン フェノーツハップ | テクスチャを複製するための装置およびプロセス |
US20230296993A1 (en) * | 2020-08-07 | 2023-09-21 | Magic Leap, Inc. | Managing multi-objective alignments for imprinting |
US11908711B2 (en) | 2020-09-30 | 2024-02-20 | Canon Kabushiki Kaisha | Planarization process, planarization system and method of manufacturing an article |
CN116490988A (zh) * | 2020-11-06 | 2023-07-25 | 康宁公司 | 具环境对比增强的光学显示设备及其制造方法 |
WO2023084082A1 (en) * | 2021-11-15 | 2023-05-19 | Morphotonics Holding B.V. | Multi-textured stamp |
IL312648A (en) * | 2021-11-15 | 2024-07-01 | Morphotonics Holding B V | embedding process |
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JPH03503138A (ja) | 1989-06-12 | 1991-07-18 | ゼネラル・エレクトリック・カンパニイ | 平担な基体にコーティングを施すためのラミナインプレッサ |
US6873087B1 (en) | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
EP1362682A1 (en) * | 2002-05-13 | 2003-11-19 | ZBD Displays Ltd, | Method and apparatus for liquid crystal alignment |
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JP4665608B2 (ja) * | 2005-05-25 | 2011-04-06 | 株式会社日立プラントテクノロジー | 微細構造転写装置 |
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JP4853129B2 (ja) * | 2006-06-23 | 2012-01-11 | 大日本印刷株式会社 | ナノインプリント用転写装置 |
JP4406452B2 (ja) | 2007-09-27 | 2010-01-27 | 株式会社日立製作所 | ベルト状金型およびそれを用いたナノインプリント装置 |
US8187515B2 (en) * | 2008-04-01 | 2012-05-29 | Molecular Imprints, Inc. | Large area roll-to-roll imprint lithography |
KR101049220B1 (ko) * | 2008-04-14 | 2011-07-13 | 한국기계연구원 | 임프린트 리소그래피용 스탬프의 제조 방법 |
US20100104852A1 (en) | 2008-10-23 | 2010-04-29 | Molecular Imprints, Inc. | Fabrication of High-Throughput Nano-Imprint Lithography Templates |
US20100109201A1 (en) | 2008-10-31 | 2010-05-06 | Molecular Imprints, Inc. | Nano-Imprint Lithography Template with Ordered Pore Structure |
JP5627684B2 (ja) * | 2009-08-21 | 2014-11-19 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 超顕微鏡的及び光学的可変像を有するデバイスのための装置及び方法 |
US8980751B2 (en) | 2010-01-27 | 2015-03-17 | Canon Nanotechnologies, Inc. | Methods and systems of material removal and pattern transfer |
US8691134B2 (en) * | 2010-01-28 | 2014-04-08 | Molecular Imprints, Inc. | Roll-to-roll imprint lithography and purging system |
KR20130073890A (ko) | 2010-04-27 | 2013-07-03 | 몰레큘러 임프린츠 인코퍼레이티드 | 나노임프린트 리소그래피를 위한 기판/주형의 분리 제어 |
US20110291330A1 (en) * | 2010-05-27 | 2011-12-01 | Mircea Despa | Replication method and articles of the method |
-
2013
- 2013-02-21 US US13/773,217 patent/US9616614B2/en active Active
- 2013-02-22 WO PCT/US2013/027396 patent/WO2013126750A1/en active Application Filing
- 2013-02-22 EP EP13708037.0A patent/EP2823356B1/en active Active
- 2013-02-22 TW TW102106268A patent/TWI574912B/zh active
- 2013-02-22 KR KR1020147025445A patent/KR101690532B1/ko active IP Right Grant
- 2013-02-22 JP JP2014558885A patent/JP6130404B2/ja active Active
- 2013-02-22 SG SG11201405089WA patent/SG11201405089WA/en unknown
- 2013-02-22 CN CN201811066954.7A patent/CN109407463B/zh active Active
- 2013-02-22 CN CN201380015762.2A patent/CN104303104B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
EP2823356A1 (en) | 2015-01-14 |
EP2823356B1 (en) | 2018-05-23 |
JP6130404B2 (ja) | 2017-05-17 |
WO2013126750A1 (en) | 2013-08-29 |
CN104303104A (zh) | 2015-01-21 |
KR101690532B1 (ko) | 2016-12-28 |
US9616614B2 (en) | 2017-04-11 |
JP2015513797A (ja) | 2015-05-14 |
CN104303104B (zh) | 2019-02-01 |
TWI574912B (zh) | 2017-03-21 |
CN109407463B (zh) | 2022-06-14 |
US20130214452A1 (en) | 2013-08-22 |
CN109407463A (zh) | 2019-03-01 |
TW201339091A (zh) | 2013-10-01 |
KR20140135979A (ko) | 2014-11-27 |
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