SG11201400489QA - Sealant composition for electronic device - Google Patents
Sealant composition for electronic deviceInfo
- Publication number
- SG11201400489QA SG11201400489QA SG11201400489QA SG11201400489QA SG11201400489QA SG 11201400489Q A SG11201400489Q A SG 11201400489QA SG 11201400489Q A SG11201400489Q A SG 11201400489QA SG 11201400489Q A SG11201400489Q A SG 11201400489QA SG 11201400489Q A SG11201400489Q A SG 11201400489QA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic device
- sealant composition
- sealant
- composition
- electronic
- Prior art date
Links
- 239000000565 sealant Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/36—Amides or imides
- C08F222/40—Imides, e.g. cyclic imides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J135/02—Homopolymers or copolymers of esters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/36—Amides or imides
- C08F222/40—Imides, e.g. cyclic imides
- C08F222/402—Alkyl substituted imides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Polymerisation Methods In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2011/070653 WO2013035206A1 (ja) | 2011-09-09 | 2011-09-09 | 電子装置用シール剤組成物 |
PCT/JP2012/072987 WO2013035871A1 (ja) | 2011-09-09 | 2012-09-07 | 電子装置用シール剤組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201400489QA true SG11201400489QA (en) | 2014-05-29 |
Family
ID=47831688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201400489QA SG11201400489QA (en) | 2011-09-09 | 2012-09-07 | Sealant composition for electronic device |
Country Status (9)
Country | Link |
---|---|
US (2) | US20140187714A1 (pt) |
EP (1) | EP2755232B1 (pt) |
JP (1) | JP6084567B2 (pt) |
KR (1) | KR101900130B1 (pt) |
CN (1) | CN103858217A (pt) |
PT (1) | PT2755232T (pt) |
SG (1) | SG11201400489QA (pt) |
TW (1) | TWI618790B (pt) |
WO (2) | WO2013035206A1 (pt) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6267980B2 (ja) * | 2014-01-31 | 2018-01-24 | ナミックス株式会社 | 樹脂組成物、先供給型半導体封止剤および半導体装置 |
JP6822863B2 (ja) * | 2016-03-31 | 2021-01-27 | 三井化学株式会社 | 熱硬化性組成物、これを含む封止剤、有機el素子用枠封止剤、及び有機el素子用面封止剤、並びにその硬化物 |
CN109564903B (zh) | 2016-08-10 | 2022-11-15 | 松下知识产权经营株式会社 | 密封用丙烯酸类组合物、片材、层叠片、固化物、半导体装置及半导体装置的制造方法 |
CN109563218A (zh) | 2016-08-10 | 2019-04-02 | 松下知识产权经营株式会社 | 密封用丙烯酸类组合物、片材、层叠片、固化物、半导体装置及半导体装置的制造方法 |
WO2020035906A1 (ja) * | 2018-08-14 | 2020-02-20 | 日立化成株式会社 | 接着剤組成物及び半導体装置の製造方法 |
US12006433B2 (en) | 2019-01-31 | 2024-06-11 | Panasonic Intellectual Property Management Co., Ltd. | Thermosetting resin composition, resin sheet, laminate, and printed wiring board |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5973166A (en) | 1998-03-02 | 1999-10-26 | The Dexter Corporation | Method for the preparation of maleimides |
DE10036801A1 (de) * | 2000-07-28 | 2002-02-07 | Tesa Ag | Acrylathaftklebemassen mit enger Molekulargewichtsverteilung |
US6569969B2 (en) | 2000-09-28 | 2003-05-27 | Symyx Technologies, Inc. | Control agents for living-type free radical polymerization, methods of polymerizing and polymers with same |
US7745553B2 (en) * | 2001-12-21 | 2010-06-29 | University Of Sydney | Aqueous dispersions of polymer particles |
US7323519B2 (en) * | 2002-01-21 | 2008-01-29 | Kaneka Corporation | Process for producing vinyl polymer, vinyl polymer, and curable composition |
JP5111711B2 (ja) * | 2002-01-31 | 2013-01-09 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物及び回路接続方法 |
EP1728826B1 (en) * | 2004-03-26 | 2011-04-20 | Kaneka Corporation | Composition curable by both free-radical photocuring and cationic photocuring |
WO2005108458A1 (ja) * | 2004-05-06 | 2005-11-17 | Jsr Corporation | 硬化性樹脂組成物、保護膜およびその形成方法 |
CN101831247B (zh) | 2004-06-09 | 2012-06-06 | 日立化成工业株式会社 | 粘结剂组合物、电路连接材料、电路部材的连接结构以及半导体装置 |
CN102796487B (zh) | 2005-03-16 | 2014-04-02 | 日立化成株式会社 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
WO2006112420A1 (ja) | 2005-04-14 | 2006-10-26 | Kaneka Corporation | 硬化性組成物、該組成物を含有する粘着剤用組成物および粘着剤 |
EP1897896B1 (en) * | 2005-06-30 | 2012-08-08 | Three Bond Co., Ltd. | Curable composition and sealing method |
CN101292006A (zh) * | 2005-10-18 | 2008-10-22 | 日立化成工业株式会社 | 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 |
CN102277091A (zh) * | 2005-10-18 | 2011-12-14 | 日立化成工业株式会社 | 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 |
KR101035810B1 (ko) * | 2005-10-18 | 2011-05-20 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 회로 접속 재료, 회로 접속 부재의 접속구조 및 반도체 장치 |
JP2008163276A (ja) | 2007-01-05 | 2008-07-17 | Nitto Denko Corp | 半導体基板加工用粘着シート |
JP5560544B2 (ja) * | 2007-08-29 | 2014-07-30 | 日立化成株式会社 | 接着剤組成物、フィルム状接着剤、回路接続用接着剤、接続体及び半導体装置 |
JP4420095B2 (ja) * | 2007-10-01 | 2010-02-24 | 横浜ゴム株式会社 | 変性ブチルゴム組成物 |
CN102334182B (zh) | 2009-02-27 | 2015-11-25 | 迪睿合电子材料有限公司 | 半导体装置的制造方法 |
JP2011037953A (ja) * | 2009-08-07 | 2011-02-24 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続構造体及び半導体装置 |
NZ603705A (en) * | 2010-06-09 | 2014-10-31 | Semprus Biosciences Corp | Non-fouling, anti-microbial, anti-thrombogenic graft-from compositions |
WO2011156590A2 (en) * | 2010-06-09 | 2011-12-15 | Semprus Biosciences Corp. | Non-fouling, anti-microbial, anti-thrombogenic graft compositions |
-
2011
- 2011-09-09 WO PCT/JP2011/070653 patent/WO2013035206A1/ja active Application Filing
-
2012
- 2012-08-31 TW TW101131697A patent/TWI618790B/zh not_active IP Right Cessation
- 2012-09-07 EP EP12829319.8A patent/EP2755232B1/en not_active Not-in-force
- 2012-09-07 SG SG11201400489QA patent/SG11201400489QA/en unknown
- 2012-09-07 JP JP2013532687A patent/JP6084567B2/ja active Active
- 2012-09-07 CN CN201280049572.8A patent/CN103858217A/zh active Pending
- 2012-09-07 PT PT128293198T patent/PT2755232T/pt unknown
- 2012-09-07 KR KR1020147005977A patent/KR101900130B1/ko active IP Right Grant
- 2012-09-07 WO PCT/JP2012/072987 patent/WO2013035871A1/ja active Application Filing
-
2014
- 2014-03-07 US US14/201,121 patent/US20140187714A1/en not_active Abandoned
-
2016
- 2016-02-03 US US15/014,231 patent/US9771500B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2013035206A1 (ja) | 2013-03-14 |
US20160177148A1 (en) | 2016-06-23 |
EP2755232A1 (en) | 2014-07-16 |
TWI618790B (zh) | 2018-03-21 |
WO2013035871A1 (ja) | 2013-03-14 |
JP6084567B2 (ja) | 2017-02-22 |
KR20140068928A (ko) | 2014-06-09 |
CN103858217A (zh) | 2014-06-11 |
US20140187714A1 (en) | 2014-07-03 |
PT2755232T (pt) | 2017-04-12 |
KR101900130B1 (ko) | 2018-09-18 |
US9771500B2 (en) | 2017-09-26 |
EP2755232A4 (en) | 2015-09-30 |
TW201321488A (zh) | 2013-06-01 |
JPWO2013035871A1 (ja) | 2015-03-23 |
EP2755232B1 (en) | 2017-02-08 |
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