SG11201400493QA - Composition for electronic device - Google Patents
Composition for electronic deviceInfo
- Publication number
- SG11201400493QA SG11201400493QA SG11201400493QA SG11201400493QA SG11201400493QA SG 11201400493Q A SG11201400493Q A SG 11201400493QA SG 11201400493Q A SG11201400493Q A SG 11201400493QA SG 11201400493Q A SG11201400493Q A SG 11201400493QA SG 11201400493Q A SG11201400493Q A SG 11201400493QA
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- electronic device
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/22—Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2011/070650 WO2013035204A1 (en) | 2011-09-09 | 2011-09-09 | Composition for electronic device |
PCT/JP2012/072984 WO2013035868A1 (en) | 2011-09-09 | 2012-09-07 | Composition for electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201400493QA true SG11201400493QA (en) | 2014-08-28 |
Family
ID=47831686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201400493QA SG11201400493QA (en) | 2011-09-09 | 2012-09-07 | Composition for electronic device |
Country Status (8)
Country | Link |
---|---|
US (1) | US9576871B2 (en) |
EP (1) | EP2755234B1 (en) |
JP (1) | JP6182068B2 (en) |
KR (1) | KR101926899B1 (en) |
CN (1) | CN103858216B (en) |
SG (1) | SG11201400493QA (en) |
TW (1) | TWI585176B (en) |
WO (2) | WO2013035204A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9330993B2 (en) * | 2012-12-20 | 2016-05-03 | Intel Corporation | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby |
JP2015032639A (en) * | 2013-07-31 | 2015-02-16 | 日立化成株式会社 | Precoating thermosetting underfill composition, electronic component device and method of manufacturing electronic component |
JP6497991B2 (en) * | 2015-03-13 | 2019-04-10 | ナミックス株式会社 | Resin composition and adhesive using the same |
JP2017143310A (en) * | 2017-05-16 | 2017-08-17 | 日立化成株式会社 | Precoating thermosetting underfill composition, electronic component device, and method of manufacturing electronic component device |
EP3786233A4 (en) * | 2018-04-26 | 2021-12-29 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device |
JPWO2020262588A1 (en) * | 2019-06-28 | 2020-12-30 | ||
EP3907252A1 (en) * | 2020-05-06 | 2021-11-10 | Henkel AG & Co. KGaA | Adhesive composition and cured product |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3777734B2 (en) * | 1996-10-15 | 2006-05-24 | 東レ株式会社 | Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same |
JP3599160B2 (en) * | 1997-05-16 | 2004-12-08 | 大日本インキ化学工業株式会社 | Active energy ray-curable composition containing maleimide derivative and method for curing the active energy ray-curable composition |
US6358601B1 (en) * | 1997-07-11 | 2002-03-19 | 3M Innovative Properties Company | Antistatic ceramer hardcoat composition with improved antistatic characteristics |
US5973166A (en) | 1998-03-02 | 1999-10-26 | The Dexter Corporation | Method for the preparation of maleimides |
JP2001302736A (en) * | 2000-02-17 | 2001-10-31 | Nof Corp | Polymer insulation material and its manufacturing method, and electronics-related substrate and electronic member |
JP3633422B2 (en) * | 2000-02-22 | 2005-03-30 | ソニーケミカル株式会社 | Connecting material |
CN102585760A (en) * | 2004-03-19 | 2012-07-18 | 住友电木株式会社 | Resin composition and semiconductor devices made by using the same |
JP4451214B2 (en) | 2004-05-21 | 2010-04-14 | シャープ株式会社 | Semiconductor device |
GB0413630D0 (en) | 2004-06-18 | 2004-07-21 | Avecia Ltd | Process |
JP5140996B2 (en) * | 2006-08-29 | 2013-02-13 | 日立化成工業株式会社 | Adhesive composition, circuit connection material, circuit member connection structure, and semiconductor device |
JP4737177B2 (en) * | 2006-10-31 | 2011-07-27 | 日立化成工業株式会社 | Circuit connection structure |
JP5560544B2 (en) * | 2007-08-29 | 2014-07-30 | 日立化成株式会社 | Adhesive composition, film adhesive, circuit connecting adhesive, connector, and semiconductor device |
JP5014945B2 (en) | 2007-10-17 | 2012-08-29 | シャープ株式会社 | Semiconductor device |
JP2009256581A (en) * | 2008-03-28 | 2009-11-05 | Hitachi Chem Co Ltd | Adhesive composition, adhesive for circuit connection and connected product using the same |
JP5251393B2 (en) * | 2008-03-28 | 2013-07-31 | 日立化成株式会社 | Adhesive composition, adhesive for circuit connection, and connection body using the same |
JP4984099B2 (en) | 2009-02-27 | 2012-07-25 | ソニーケミカル&インフォメーションデバイス株式会社 | Manufacturing method of semiconductor device |
JP5454018B2 (en) * | 2009-09-01 | 2014-03-26 | 日立化成株式会社 | Film adhesive, adhesive sheet and semiconductor device |
KR101023241B1 (en) | 2009-12-28 | 2011-03-21 | 제일모직주식회사 | Adhensive composition for semiconductor device and adhensive film using the same |
JP6165754B2 (en) * | 2011-11-02 | 2017-07-19 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | Adhesive for electronic parts |
-
2011
- 2011-09-09 WO PCT/JP2011/070650 patent/WO2013035204A1/en active Application Filing
-
2012
- 2012-08-24 TW TW101130740A patent/TWI585176B/en not_active IP Right Cessation
- 2012-09-07 WO PCT/JP2012/072984 patent/WO2013035868A1/en unknown
- 2012-09-07 JP JP2013532685A patent/JP6182068B2/en not_active Expired - Fee Related
- 2012-09-07 SG SG11201400493QA patent/SG11201400493QA/en unknown
- 2012-09-07 EP EP12830834.3A patent/EP2755234B1/en not_active Not-in-force
- 2012-09-07 KR KR1020147005990A patent/KR101926899B1/en active IP Right Grant
- 2012-09-07 CN CN201280049569.6A patent/CN103858216B/en not_active Expired - Fee Related
-
2014
- 2014-03-07 US US14/200,525 patent/US9576871B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2013035868A1 (en) | 2013-03-14 |
EP2755234A1 (en) | 2014-07-16 |
US9576871B2 (en) | 2017-02-21 |
TW201319199A (en) | 2013-05-16 |
JPWO2013035868A1 (en) | 2015-03-23 |
TWI585176B (en) | 2017-06-01 |
CN103858216A (en) | 2014-06-11 |
EP2755234A4 (en) | 2015-05-27 |
KR101926899B1 (en) | 2018-12-07 |
US20140187659A1 (en) | 2014-07-03 |
JP6182068B2 (en) | 2017-08-16 |
WO2013035204A1 (en) | 2013-03-14 |
KR20140068930A (en) | 2014-06-09 |
EP2755234B1 (en) | 2018-01-24 |
CN103858216B (en) | 2017-06-06 |
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